MRF8P26080HSR3 vs MRF8P23160WHSR3 比較

詳細並排比較 MRF8P26080HSR3 由 NXP Semiconductors 與 MRF8P23160WHSR3 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MRF8P26080HSR3 MRF8P26080HSR3 - 14W, 2.6GHz W-CDMA/LTE RF Power MOSFET | NXP

MRF8P26080HSR3 - 14W, 2.6GHz W-CDMA/LTE RF Power MOSFET | NXP

MRF8P26080HSR3 ✓ 啟用中
NXP Semiconductors
MRF8P23160WHSR3 MRF8P23160WHSR3 - 160W RF Power MOSFET 2.3-2.4GHz | NXP

MRF8P23160WHSR3 - 160W RF Power MOSFET 2.3-2.4GHz | NXP

MRF8P23160WHSR3 Obsolete

規格比較

參數 MRF8P26080HSR3 MRF8P23160WHSR3
品牌 NXP Semiconductors NXP Semiconductors
類別 MOSFETs RF Transceivers
生命週期狀態 啟用中 Obsolete
電晶體類型 N-Channel Enhancement-Mode Lateral MOSFET N-Channel LDMOS RF Power MOSFET
Technology Gen8 LDMOS (Silicon, Lateral) HV8 Lateral LDMOS
Frequency Range 2500 MHz to 2700 MHz 2300 to 2400 MHz
Average Output Power (P3dB) 14 W (W-CDMA, single-carrier) —
Peak Output Power (CW) 80 W —
Drain-Source Voltage (VDSS max) 65 V —
Operating Drain Voltage (VDD) 28 V nominal —
Test Mode Typical Doherty Single-Carrier W-CDMA —
Application Class Class AB or Class C capable —
Modulation Formats W-CDMA, LTE, OFDM, multi-carrier —
封裝 NI-780S-4 (ceramic, flange-mount, air-cavity) —
安裝類型 Through-hole flange-mount with screw attachment —
Lead Finish Gold-plated (NiPdAu) —
Lead-Free / RoHS Compliant —
工作溫度範圍 -40C to +150C (junction) [DATA_NEEDED: operating temperature range]
Manufacturer — NXP USA Inc. (formerly Freescale Semiconductor)
Operating Mode — Enhancement Mode
Test Frequency — 2.32 GHz
V(BR)DSS (Drain-Source Breakdown Voltage) — 65 V
Test Voltage (VDD) — 28 V
Power Gain — 14.1 dB
Average Output Power (P1dB / W-CDMA) — 30 W
Peak Output Power — 160 W
Quiescent Drain Current (IDQA) — 600 mA
Package Type — NI-780-4 (CASE 465M-01), ceramic flangeless
Number of Terminals — 4
安裝方式 — Surface Mount (SMD flat lead)
Configuration — Single (Doherty-ready)
Application — Base Station / Macro Cell Power Amplifier
RoHS 狀態 — Compliant
濕度敏感等級 (MSL) — [DATA_NEEDED: MSL rating]

資料表與資源

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