10AS048K2F35I2LG - Arria 10 SX 480K LE SoC FPGA, 1.5GHz, 1152-FBGA | Intel
MPN： 10AS048K2F35I2LG ✓ 啟用中10AS048K2F35I2LG 概覽
An SoC FPGA is a hybrid semiconductor device that pairs a programmable logic fabric with one or more embedded processor cores on the same die. Unlike a discrete FPGA-plus-microcontroller solution, the processor and FPGA share on-chip memory, interconnect, and I/O resources, enabling lower latency, reduced board area, and tighter power management. The Arria 10 SX family belongs to the broader mid-range FPGA segment, sitting between Intel Cyclone (low-cost) and Intel Stratix (high-performance), optimized for transceiver-rich, DSP-heavy designs in wireless, broadcast, and defense markets.
Key features of the 10AS048K2F35I2LG include 480K adaptive logic modules (ALMs), 28.62 Mbits of embedded memory, variable-precision DSP blocks, and up to 384 full-duplex transceiver channels supporting rates up to 17.4 Gbps (chip-dependent). The dual ARM Cortex-A9 cores run up to 1.5 GHz with NEON media-processing extensions and a CoreSight debug fabric. The HPS side includes hard memory controllers, USB, EMAC, and other standard peripherals, while the FPGA side offers 768 user I/O pins and 16 transceiver channels at up to 12.5 Gbps for this specific F35-speed-grade variant.
The 20nm process technology enables high logic density at moderate static power, while partial reconfiguration and configuration via PCI Express accelerate field updates. The package is a 1152-pin FC-FBGA with 35x35 mm body, providing the high-pin-count escape required by the parallel HPS bus and multiple high-speed transceiver lanes.
Typical applications include wireless baseband processing, software-defined radio (SDR), military radar and electronic-warfare subsystems, medical imaging accelerators, broadcast video processing, and industrial motor control. Designers choose the Arria 10 SX when they need deterministic low-latency FPGA processing combined with Linux-capable host control on a single board.
For power planning, estimate dynamic dissipation using the Intel PowerPlay Early Power Estimator (EPE) spreadsheet; at moderate toggle rates (15-25%), a 480K-LE design typically draws 8-15 W from the 0.9V core, plus transceiver and I/O contributions. Decouple the VCCINT and VCCR rails with a mix of bulk and 0402-size 100 nF ceramic capacitors placed directly under the BGA via-in-pad array.
This page synthesizes current distributor pricing across DigiKey, Mouser, Octopart, and Heisener, alongside drop-in same-package Arria 10 SX speed-grade siblings and application reference designs, giving engineers a one-stop comparison resource not found in any single datasheet.
直接替換替代品，適用於 10AS048K2F35I2LG — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10AS048K2F35I2LG （相同外形與佔位） — 差異在於 Package, Mounting Type, Operating Temperature, Embedded Memory, Logic Elements.
10AS048K2F35I1HG
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →10AS048K2F35E2LG
✅ 直接替換聯絡詢價
查看資料表 →10AS048K2F35E1HG
✅ 直接替換聯絡詢價
查看資料表 →10AS048K1F35I1HG
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →10AS048K2F35I2LG 最大額定值與電氣特性
| Series | Arria 10 SX |
| Family | Arria 10 SX SoC FPGA |
| Device Variant | 10AS048 |
| Logic Elements | 480K |
| Embedded Memory | 28.62 Mbits |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| Transceivers | Up to 16 (F35 speed grade) |
| Maximum Transceiver Data Rate | 12.5 Gbps (F35) |
| User I/O Pins | 768 (F35 package) |
| 封裝 | 1152-ball FC-FBGA, 35x35 mm |
| Process Technology | 20 nm Tri-Gate CMOS |
| Supply Voltage - Core (VCCINT) | 0.87 V nominal |
| Temperature Grade | Industrial (-40C to +100C junction) |
| Configuration Method | Serial, Parallel, PCI Express |
| RoHS 狀態 | Compliant |
10AS048K2F35I2LG 1152-ball fc-fbga, 35x35 mm 腳位配置指南
10AS048K2F35I2LG（1152-ball fc-fbga, 35x35 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 10AS048K2F35I2LG.
請參閱 資料表 以查看完整腳位配置。
典型應用
10AS048K2F35I2LG 適用於 6 應用s: Wireless Baseband Processing, Software-Defined Radio (SDR), Military Radar and Electronic Warfare, Medical Imaging Accelerator, Broadcast Video Processing, Industrial Motor Control.
Wireless Baseband Processing
The 10AS048K2F35I2LG is well-suited to wireless baseband signal chains such as LTE small cells and 5G sub-6 GHz radio units. The 480K logic elements and 28.62 Mbits of embedded memory deliver the FIR/FFT/CFR/DPD throughput required for multi-antenna processing, while up to 16 transceivers at 12.5 Gbps interface directly to RF ADC/DAC and CPRI links to baseband hubs. The dual 1.5 GHz ARM Cortex-A9 cores run the MAC scheduler and protocol stack, eliminating a discrete host processor on the radio card. Designers typically achieve 30-50% lower system power and 40% smaller board area versus a discrete FPGA+SoC architecture.
推薦
Software-Defined Radio (SDR)
For wideband SDR platforms in defense and commercial test, the 10AS048K2F35I2LG provides the logic density and transceiver count to digitize and process multi-MHz instantaneous bandwidths in real time. The 20 nm Tri-Gate CMOS fabric runs variable-precision DSP blocks at clock rates beyond 400 MHz, supporting polyphase channelizers and adaptive beamforming. The Cortex-A9 HPS executes GNU Radio or vendor-specific waveform code while sharing memory with the FPGA via a 128-bit on-chip bus. Compared with a CPU-only SDR, this part delivers 10-100x DSP acceleration per watt.
推薦
Military Radar and Electronic Warfare
The 10AS048K2F35I2LG's industrial temperature rating and high transceiver count suit phased-array radar and electronic-countermeasure subsystems. Designers implement pulse compression, MTI, and adaptive nulling in the FPGA fabric, while the HPS side handles track management and track-while-scan control. The 768 user I/O pins aggregate multiple ADCs, DACs, and fiber-optic links from T/R modules. The 0.87 V VCCINT core, combined with intelligent clock gating, keeps thermal rise manageable in sealed airborne enclosures with limited airflow.
推薦
Medical Imaging Accelerator
In ultrasound and CT image-formation pipelines, the 10AS048K2F35I2LG executes beamforming and back-projection kernels at deterministic frame rates. The variable-precision DSP block can be configured as 27x27 multipliers, providing the throughput needed for synthetic-aperture and elastography algorithms. The dual ARM cores manage probe identification, thermal monitoring, and the user interface, while the FPGA fabric streams raw RF to image reconstruction in real time. The single-chip SoC integration reduces the bill of materials, easing IEC 60601-1 medical-device compliance and shortening time to FDA clearance.
推薦
Broadcast Video Processing
The 10AS048K2F35I2LG drives 4K/UHD broadcast workflows including HEVC/H.265 encoding, multi-view stitching, and real-time color-space conversion. Its 28.62 Mbits of embedded memory buffer multiple video frames on-chip, eliminating external DDR traffic for many pipeline stages. The 12.5 Gbps transceivers carry SDI, DisplayPort 1.4, and HDMI 2.0 streams without external gearbox parts. The ARM Cortex-A9 HPS runs a Linux control plane for IP streaming, OSD overlay, and remote management over Ethernet.
推薦
Industrial Motor Control
In high-precision servo and multi-axis drive controllers, the 10AS048K2F35I2LG executes field-oriented control (FOC) loops at sub-microsecond latency while the HPS runs the motion sequencer and EtherCAT/Master stack. The 16 transceivers accept multi-MHz encoder feedback, and the 768 user I/O drive PWM channels for dozens of half-bridge stages. Industrial temperature grading (-40C to +100C junction) supports deployment in factory-floor cabinets without derating, while on-chip deterministic memory avoids cache-related jitter in the torque loop.
推薦
推薦產品摘要
工程參考資料，適用於 10AS048K2F35I2LG — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10AS048K2F35I1HG | 10AS048K2F35E2LG | 10AS048K2F35E1HG | 10AS048K1F35I1HG |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA FC (35x35) | 1152-FBGA FC (35x35) - same | 1152-FBGA FC (35x35) - same | 1152-FBGA FC (35x35) - same | 1152-FBGA FC (35x35) - same |
| Logic Elements | 480K | 480K | 480K | 480K | 480K |
| HPS Cores | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz |
| Speed/Power Bin | K2 (mid) | K2 (fast) | K2 (mid) | K2 (fast) | K1 (low power) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended | Extended | Industrial (-40C to +100C) |
| Transceivers | Up to 16 at 12.5 Gbps | Up to 16 at 12.5 Gbps | Up to 16 at 12.5 Gbps | Up to 16 at 12.5 Gbps | Up to 16 at 12.5 Gbps |
| User I/O | 768 | 768 | 768 | 768 | 768 |
主要差異化特點
- Industrial-temperature K2 bin in F35 package (對比10AS048K1F35I1HG)
- Mid-tier K2 power/performance position (對比10AS048K2F35I1HG)
- Industrial temperature rating (對比10AS048K2F35E2LG)
設計說明
Estimated: At moderate toggle rates (15-25%) and full transceiver utilization, a 480K-LE Arria 10 SX design typically dissipates 8-15 W from the 0.87 V VCCINT core plus additional transceiver and I/O contributions. The 35x35 mm FC-FBGA has a theta_JB in the 0.5-1.0 C/W range; a high-performance thermal interface material (TIM) and a heatsink with 2-3 C/W are recommended to keep junction below 100C in industrial enclosures. Use the Intel PowerPlay Early Power Estimator spreadsheet for design-specific dissipation before PCB layout.
Decouple VCCINT and VCCR with a mix of bulk and 0402-size 100 nF ceramic capacitors placed directly under the BGA via-in-pad array. Use a 12-14 layer PCB stackup with dedicated ground and power planes adjacent to the BGA breakout. The 1152-ball FC-FBGA requires escape routing on multiple layers; verify manufacturability with your PCB vendor's BGA fan-out rules (typically 0.4 mm pitch escape using laser-drilled microvias).
Do not substitute a -1 (faster) speed-grade part into a design validated only for -2 without re-running timing analysis, even though the package and pinout match. Conversely, substituting a -E (extended) part into an industrial-only design is safe but may require thermal re-characterization. Always cross-reference the ordering-code suffix against the latest Intel Arria 10 ordering guide before committing to a multi-thousand-unit build.
合規資訊
RoHS and REACH compliance per Intel product declarations. AEC-Q100 not applicable - this is an industrial FPGA, not an automotive-qualified part. Lead-free and halogen-free per JEDEC J-STD-020 reflow compliance.
