10AS048K2F35I2LG - Arria 10 SX 480K LE SoC FPGA, 1.5GHz, 1152-FBGA | Intel
MPN: 10AS048K2F35I2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3200 | $3,200.00 |
| 10 | $3050 | $30,500.00 |
| 100 | $2880 | $288,000.00 |
| 250 | $2750 | $687,500.00 |
| 500 | $2650 | $1,325,000.00 |
Drop-in alternatives for 10AS048K2F35I2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS048K2F35I1HG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3580 / Unit
View Datasheet →10AS048K2F35E2LG
✅ Drop-In✓ In Stock
$4150 / Unit
View Datasheet →10AS048K2F35E1HG
✅ Drop-In✓ In Stock
$2650 / Unit
View Datasheet →10AS048K1F35I1HG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3263.87 / Unit
View Datasheet →10AS048K2F35I2LG Maximum Ratings & Electrical Characteristics
| Series | Arria 10 SX |
| Family | Arria 10 SX SoC FPGA |
| Device Variant | 10AS048 |
| Logic Elements | 480K |
| Embedded Memory | 28.62 Mbits |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| Transceivers | Up to 16 (F35 speed grade) |
| Maximum Transceiver Data Rate | 12.5 Gbps (F35) |
| User I/O Pins | 768 (F35 package) |
| Package | 1152-ball FC-FBGA, 35x35 mm |
| Process Technology | 20 nm Tri-Gate CMOS |
| Supply Voltage - Core (VCCINT) | 0.87 V nominal |
| Temperature Grade | Industrial (-40C to +100C junction) |
| Configuration Method | Serial, Parallel, PCI Express |
| RoHS Status | Compliant |
10AS048K2F35I2LG 1152-ball fc-fbga, 35x35 mm Pin Configuration Guide
Complete pinout information for 10AS048K2F35I2LG (1152-ball fc-fbga, 35x35 mm package) with 768 (F35 package) pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS048K2F35I2LG.
Refer to the datasheet for full pin configuration.
Estimated pin count: 768 (F35 package) pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS048K2F35I2LG is suitable for 6 applications: Wireless Baseband Processing, Software-Defined Radio (SDR), Military Radar and Electronic Warfare, Medical Imaging Accelerator, Broadcast Video Processing, Industrial Motor Control.
Wireless Baseband Processing
The 10AS048K2F35I2LG is well-suited to wireless baseband signal chains such as LTE small cells and 5G sub-6 GHz radio units. The 480K logic elements and 28.62 Mbits of embedded memory deliver the FIR/FFT/CFR/DPD throughput required for multi-antenna processing, while up to 16 transceivers at 12.5 Gbps interface directly to RF ADC/DAC and CPRI links to baseband hubs. The dual 1.5 GHz ARM Cortex-A9 cores run the MAC scheduler and protocol stack, eliminating a discrete host processor on the radio card. Designers typically achieve 30-50% lower system power and 40% smaller board area versus a discrete FPGA+SoC architecture.
Recommended
Software-Defined Radio (SDR)
For wideband SDR platforms in defense and commercial test, the 10AS048K2F35I2LG provides the logic density and transceiver count to digitize and process multi-MHz instantaneous bandwidths in real time. The 20 nm Tri-Gate CMOS fabric runs variable-precision DSP blocks at clock rates beyond 400 MHz, supporting polyphase channelizers and adaptive beamforming. The Cortex-A9 HPS executes GNU Radio or vendor-specific waveform code while sharing memory with the FPGA via a 128-bit on-chip bus. Compared with a CPU-only SDR, this part delivers 10-100x DSP acceleration per watt.
Recommended
Military Radar and Electronic Warfare
The 10AS048K2F35I2LG's industrial temperature rating and high transceiver count suit phased-array radar and electronic-countermeasure subsystems. Designers implement pulse compression, MTI, and adaptive nulling in the FPGA fabric, while the HPS side handles track management and track-while-scan control. The 768 user I/O pins aggregate multiple ADCs, DACs, and fiber-optic links from T/R modules. The 0.87 V VCCINT core, combined with intelligent clock gating, keeps thermal rise manageable in sealed airborne enclosures with limited airflow.
Recommended
Medical Imaging Accelerator
In ultrasound and CT image-formation pipelines, the 10AS048K2F35I2LG executes beamforming and back-projection kernels at deterministic frame rates. The variable-precision DSP block can be configured as 27x27 multipliers, providing the throughput needed for synthetic-aperture and elastography algorithms. The dual ARM cores manage probe identification, thermal monitoring, and the user interface, while the FPGA fabric streams raw RF to image reconstruction in real time. The single-chip SoC integration reduces the bill of materials, easing IEC 60601-1 medical-device compliance and shortening time to FDA clearance.
Recommended
Broadcast Video Processing
The 10AS048K2F35I2LG drives 4K/UHD broadcast workflows including HEVC/H.265 encoding, multi-view stitching, and real-time color-space conversion. Its 28.62 Mbits of embedded memory buffer multiple video frames on-chip, eliminating external DDR traffic for many pipeline stages. The 12.5 Gbps transceivers carry SDI, DisplayPort 1.4, and HDMI 2.0 streams without external gearbox parts. The ARM Cortex-A9 HPS runs a Linux control plane for IP streaming, OSD overlay, and remote management over Ethernet.
Recommended
Industrial Motor Control
In high-precision servo and multi-axis drive controllers, the 10AS048K2F35I2LG executes field-oriented control (FOC) loops at sub-microsecond latency while the HPS runs the motion sequencer and EtherCAT/Master stack. The 16 transceivers accept multi-MHz encoder feedback, and the 768 user I/O drive PWM channels for dozens of half-bridge stages. Industrial temperature grading (-40C to +100C junction) supports deployment in factory-floor cabinets without derating, while on-chip deterministic memory avoids cache-related jitter in the torque loop.
Recommended
Recommended Products Summary
Engineering reference data for 10AS048K2F35I2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS048K2F35I1HG | 10AS048K2F35E2LG | 10AS048K2F35E1HG | 10AS048K1F35I1HG |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA FC (35x35) | 1152-FBGA FC (35x35) - same | 1152-FBGA FC (35x35) - same | 1152-FBGA FC (35x35) - same | 1152-FBGA FC (35x35) - same |
| Logic Elements | 480K | 480K | 480K | 480K | 480K |
| HPS Cores | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz |
| Speed/Power Bin | K2 (mid) | K2 (fast) | K2 (mid) | K2 (fast) | K1 (low power) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended | Extended | Industrial (-40C to +100C) |
| Transceivers | Up to 16 at 12.5 Gbps | Up to 16 at 12.5 Gbps | Up to 16 at 12.5 Gbps | Up to 16 at 12.5 Gbps | Up to 16 at 12.5 Gbps |
| User I/O | 768 | 768 | 768 | 768 | 768 |
Key Differentiators
- Industrial-temperature K2 bin in F35 package (vs 10AS048K1F35I1HG)
- Mid-tier K2 power/performance position (vs 10AS048K2F35I1HG)
- Industrial temperature rating (vs 10AS048K2F35E2LG)
Design Notes
Estimated: At moderate toggle rates (15-25%) and full transceiver utilization, a 480K-LE Arria 10 SX design typically dissipates 8-15 W from the 0.87 V VCCINT core plus additional transceiver and I/O contributions. The 35x35 mm FC-FBGA has a theta_JB in the 0.5-1.0 C/W range; a high-performance thermal interface material (TIM) and a heatsink with 2-3 C/W are recommended to keep junction below 100C in industrial enclosures. Use the Intel PowerPlay Early Power Estimator spreadsheet for design-specific dissipation before PCB layout.
Decouple VCCINT and VCCR with a mix of bulk and 0402-size 100 nF ceramic capacitors placed directly under the BGA via-in-pad array. Use a 12-14 layer PCB stackup with dedicated ground and power planes adjacent to the BGA breakout. The 1152-ball FC-FBGA requires escape routing on multiple layers; verify manufacturability with your PCB vendor's BGA fan-out rules (typically 0.4 mm pitch escape using laser-drilled microvias).
Do not substitute a -1 (faster) speed-grade part into a design validated only for -2 without re-running timing analysis, even though the package and pinout match. Conversely, substituting a -E (extended) part into an industrial-only design is safe but may require thermal re-characterization. Always cross-reference the ordering-code suffix against the latest Intel Arria 10 ordering guide before committing to a multi-thousand-unit build.
Compliance Information
RoHS and REACH compliance per Intel product declarations. AEC-Q100 not applicable - this is an industrial FPGA, not an automotive-qualified part. Lead-free and halogen-free per JEDEC J-STD-020 reflow compliance.
