10AS057K3F35I2LG - Arria 10 SX SoC FPGA 570K LE | Intel
MPN： 10AS057K3F35I2LG ✓ 啟用中10AS057K3F35I2LG 概覽
An SoC FPGA is a heterogeneous computing device that tightly couples a hardened CPU subsystem with programmable logic on a single die, eliminating the latency, power, and board-area overhead of a separate processor-plus-FPGA design. The hard processor system (HPS) typically includes peripherals such as DDR controllers, Ethernet MACs, USB, and SD/MMC; the FPGA fabric handles custom datapaths, DSP blocks, high-speed transceivers, and parallel I/O. Arria 10 SX extends this concept to mid- to high-density designs at lower power than prior Stratix-class parts.
Key features of the 10AS057K3F35I2LG include 570K logic elements, embedded DSP blocks for fixed- and floating-point acceleration, high-speed serial transceivers supporting multi-gigabit serial links, and a wide parallel I/O count exposed through the 1152-ball BGA. The device supports configuration via industry-standard active serial or JTAG, with bitstream encryption and tamper protection features enabled by default. The industrial temperature grade permits operation in harsh environments without derating beyond standard commercial envelopes.
The Arria 10 architecture combines TSMC's 20 nm process with an adaptive logic module that reduces dynamic power while maintaining timing closure on congested designs. Hard memory controllers in the HPS support DDR3/DDR4 with ECC, while the FPGA fabric provides dedicated block RAM and MLAB distributed memory for low-latency storage.
Typical applications include wireless baseband processing, military radar and electronic warfare prototypes, industrial machine vision, test and measurement backplanes, and high-throughput data acquisition. Designers pair the HPS for control-plane software and the FPGA for real-time DSP or protocol offload, achieving deterministic latency impossible with discrete CPU+FPGA assemblies.
When selecting this device, verify that your design's logic, DSP, memory, transceiver, and I/O utilization fits within the 570K-LE budget and the 1152-ball package pin-out. Power estimation should be performed in Intel Quartus Prime before board design because Arria 10 SX power scales non-linearly with toggle rate.
This page consolidates distributor pricing, a curated set of same-family SoC FPGA variants, and practical board-design guidance not always covered in the manufacturer datasheet.
直接替換替代品，適用於 10AS057K3F35I2LG — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10AS057K3F35I2LG （相同外形與佔位） — 差異在於 Package, Mounting Type, Speed Grade, Operating Temperature, Logic Elements.
10AS057K3F35E2LG
✅ 直接替換聯絡詢價
查看資料表 →10AS057K3F35I2SG
✅ 直接替換聯絡詢價
查看資料表 →10AS057K2F35I2LG
✅ 直接替換聯絡詢價
查看資料表 →10AS057K3F35E2SG
✅ 直接替換聯絡詢價
查看資料表 →10AS048K3F35I2LG
✅ 直接替換聯絡詢價
查看資料表 →10AS057K2F35I2SG
✅ 直接替換聯絡詢價
查看資料表 →10AS057K3F35I2LG 最大額定值與電氣特性
| Family | Arria 10 SX |
| Device Variant | 10AS057 |
| Logic Elements | 570,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Core Frequency | 1.5 GHz |
| Speed Grade | -3 |
| 封裝 | 1152-ball FC-FBGA, 35x35 mm |
| Package Code | F35 |
| 工作溫度 | -40C to +100C (Industrial) |
| Temperature Grade | I (Industrial) |
| 安裝類型 | Surface Mount (BGA) |
| Configuration Method | Active Serial / JTAG |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
10AS057K3F35I2LG f35 腳位配置指南
10AS057K3F35I2LG（f35 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 10AS057K3F35I2LG.
請參閱 資料表 以查看完整腳位配置。
典型應用
10AS057K3F35I2LG 適用於 7 應用s: Wireless Baseband Processing, Military Radar and Electronic Warfare, Industrial Machine Vision, Test and Measurement Backplane, High-Throughput Data Acquisition, Aerospace Communications and Avionics, Video Broadcast and Processing.
Wireless Baseband Processing
The 10AS057K3F35I2LG's 570K logic elements and embedded DSP blocks deliver the throughput required for LTE and 5G NR physical-layer baseband processing. The dual-core ARM Cortex-A9 HPS handles MAC-layer scheduling and RF control loops while the FPGA fabric accelerates FFT, channel estimation, and turbo/LDPC decoding. Industrial temperature rating permits outdoor small-cell deployment.
推薦
Military Radar and Electronic Warfare
The industrial-temperature, 570K-LE Arria 10 SX FPGA in F35 FC-FBGA is suited for prototype radar pulse compression, beamforming, and EW receiver designs. On-chip DSP blocks accelerate FFT and chirp-Z transforms at sample rates above 200 MSPS, while hardened transceivers link to ADCs and DACs at multi-Gbps rates. Industrial grade supports harsh airborne and naval enclosures.
推薦
Industrial Machine Vision
The 10AS057K3F35I2LG pairs a dual-core Cortex-A9 HPS for vision software frameworks (OpenCV, HALCON) with FPGA fabric for image preprocessing, feature extraction, and convolutional inference. Industrial temperature operation enables deployment on factory floors and outdoor inspection rigs where ambient temperature swings exceed commercial ranges. The HPS peripherals accelerate GigE Vision and USB3 Vision ingest.
推薦
Test and Measurement Backplane
The 10AS057K3F35I2LG suits modular instruments where the FPGA aggregates data from multiple ADC/DAC channels while the Cortex-A9 HPS runs Linux for display, networking, and SCPI control. PCI Express hard IP and multi-gigabit transceivers allow the instrument to plug into PXIe or proprietary backplanes. Industrial temperature grade supports 24/7 production-line test.
推薦
High-Throughput Data Acquisition
The 10AS057K3F35I2LG ingests multi-GSPS ADC streams via its hardened transceivers and routes them through DSP blocks for real-time decimation, FFT, and triggering. The HPS manages disk storage, Ethernet streaming, and user interface. Industrial temperature rating and -3 speed grade make this variant suitable for oil-and-gas exploration and scientific instrumentation.
推薦
Aerospace Communications and Avionics
The 10AS057K3F35I2LG with industrial temperature grade and 570K LE fabric enables airborne communications modems, ARINC 429/664 bridges, and flight-data recorders. The Cortex-A9 HPS runs DO-178 certifiable stacks, while the FPGA implements custom waveform processing and MIL-STD-1553 interfaces. The F35 FC-FBGA package survives high-vibration environments with proper PCB underfill.
推薦
Video Broadcast and Processing
The 10AS057K3F35I2LG's 570K logic elements and DSP blocks accelerate HEVC/H.265 encoding, de-interlacing, and color-space conversion in broadcast encoder/decoder platforms. HDMI 2.0 and 12G-SDI ingest flow through hardened transceivers, while the HPS runs control software and web UIs. Industrial temperature operation supports 24/7 rack-mount chassis.
推薦
推薦產品摘要
工程參考資料，適用於 10AS057K3F35I2LG — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10AS057K3F35E2LG | 10AS057K3F35I2SG | 10AS057K2F35I2LG | 10AS048K3F35I2LG |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FC-FBGA F35 (35x35 mm) | 1152-ball FC-FBGA F35 (35x35 mm) | 1152-ball FC-FBGA F35 (35x35 mm) | 1152-ball FC-FBGA F35 (35x35 mm) | 1152-ball FC-FBGA F35 (35x35 mm) |
| Logic Elements | 570,000 | 570,000 | 570,000 | 570,000 | 480,000 |
| Speed Grade | -3 | -3 | -3 | -2 | -3 |
| Temperature Grade | Industrial (-40C to +100C) | Extended Commercial | Military | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Hard Processor System | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| HPS Max Frequency | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.4 GHz (estimated, lower speed grade) | 1.5 GHz |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes |
主要差異化特點
- Heterogeneous SoC with integrated dual ARM Cortex-A9 (對比Plain FPGA (e.g. 10AX057K3F35I2LG without HPS))
- Industrial temperature grade at speed grade -3 (對比10AS057K2F35I2LG (speed grade -2))
- Mid-density 570K-LE balance vs 660K-LE variant (對比10AS066K3F35I2LG)
設計說明
Arria 10 SX SoC FPGAs at -3 speed grade can dissipate 15-25 W in high-utilization designs; the 35x35 mm F35 FC-FBGA requires a high-performance thermal solution. Attach a heatsink with thermal-interface material rated for the -40C to +100C industrial envelope, and consider forced-air cooling or a cold plate for fanless enclosures above 8 W steady-state dissipation. The exposed-die flip-chip BGA does not support PCB-bottom-side cooling without custom heat spreaders.
The 1152-ball FC-FBGA F35 (0.8 mm or 1.0 mm pitch, verify exact pitch in datasheet) requires a high-density-interconnect PCB stack-up with laser-drilled microvias, sequential lamination, and matched-length routing for the HPS DDR3/DDR4 interface. Use the Arria 10 SX pin-out file from Intel to plan escape routing and split references between HPS and FPGA power rails. Maintain at least four PCB layers for the core fabric with continuous ground planes for return-path integrity.
Decouple every transceiver and HPS power pin with the capacitor values specified in the Arria 10 SX device datasheet (typically 0.1 uF + 1 uF + 10 uF per supply). Use a sequenced power-supply scheme (TPS65086x or equivalent) to ensure the 0.9 V core, 1.1 V HPS, 1.8 V I/O, and 2.5 V/3.3 V auxiliary rails ramp in the order required by Quartus Prime configuration files to avoid in-rush latch-up.
Estimated: a common pitfall is using speed-grade -3 marketing material as a guaranteed Fmax - actual timing closure at industrial temperature and the chosen VCC core voltage must be verified in Quartus Prime Slow 1100 mV / 0.9 V / -40C corner. Another frequent mistake is assuming the HPS and FPGA can boot independently; configure both images in the QSPI flash with proper boot-header so the HPS can reconfigure the FPGA on partial-update events.
合規資訊
RoHS and conflict-minerals status confirmed by Intel product page; AEC-Q100 not applicable for non-automotive FPGA; REACH and halogen-free status not explicitly stated in verified web data.
