10AS048K3F35E2LG - Arria 10 SX 480K SoC FPGA | Intel (Altera)
MPN： 10AS048K3F35E2LG ✓ 啟用中10AS048K3F35E2LG 概覽
A System on Chip (SoC) FPGA is a class of heterogeneous computing device that combines a general-purpose processor subsystem with programmable hardware fabric on a single die. Within the broader taxonomy, this places the 10AS048K3F35E2LG in the chain: SoC -> FPGA -> programmable logic device -> semiconductor IC. The dual Cortex-A9 cores run a separate OS from the FPGA fabric, allowing deterministic hardware acceleration for signal processing alongside a rich software environment for control, networking, and application logic.
Key features include 480K logic elements, 28 Mb of on-chip M20K block RAM distributed across the fabric, variable-precision DSP blocks supporting 18x19 and 27x27 multipliers, hardened memory controllers for DDR3/DDR4/LPDDR2/3, and up to 24 transceivers supporting data rates relevant to high-speed serial protocols. The device also integrates PCI Express hard IP, enabling Gen2/Gen3 endpoint or root port configurations without consuming fabric resources. Multiple I/O banks support 1.5 V and 1.8 V to 3.3 V single-ended standards plus LVDS, HSTL, and SSTL differential signaling.
Typical applications span 5G wireless baseband processing, software-defined radio, radar and electronic warfare beamforming, broadcast and professional video processing, medical imaging acceleration, industrial machine vision, high-performance computing test benches, and aerospace flight-control prototypes. The combination of the HPS and programmable fabric enables asymmetric multiprocessing where time-critical DSP and I/O tasks execute in hardware while control plane, networking stacks, and human-machine interfaces run on Cortex-A9 cores.
When designing with this device, ensure the PCB BGA breakout accommodates 1.0 mm pitch routing and that thermal management accounts for industrial-grade power dissipation under sustained DSP load. Quartus Prime is the primary toolchain, providing synthesis, place-and-route, HPS configuration, and transceiver calibration for this Arria 10 SX family member.
直接替換替代品，適用於 10AS048K3F35E2LG — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10AS048K3F35E2LG （相同外形與佔位） — 差異在於 Package, Product Type, Logic Elements, Mounting Type, Operating Temperature.
10AS048K3F35E2SG
✅ 直接替換聯絡詢價
查看資料表 →10AS048K2F35E2LG
✅ 直接替換聯絡詢價
查看資料表 →10AS048K2F35E2SG
✅ 直接替換聯絡詢價
查看資料表 →10AS048K2F35I2LG
✅ 直接替換聯絡詢價
查看資料表 →10AS048K2F35I2SG
✅ 直接替換聯絡詢價
查看資料表 →10AS048K3F35E2LG 最大額定值與電氣特性
| Product Type | System on Chip (SoC) FPGA |
| Family | Arria 10 SX |
| Logic Elements | 480,000 |
| Processor Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Clock | Up to 1.5 GHz |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| 封裝 | 1152-ball FC-FBGA (35x35 mm, 1.0 mm pitch) |
| 安裝類型 | Surface Mount |
| 工作溫度 | -40C to +100C (industrial) |
| RoHS 狀態 | Compliant |
| Pb-free | Yes |
10AS048K3F35E2LG 1152-ball fc-fbga (35x35 mm, 1.0 mm pitch) 腳位配置指南
10AS048K3F35E2LG（1152-ball fc-fbga (35x35 mm, 1.0 mm pitch) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 10AS048K3F35E2LG.
請參閱 資料表 以查看完整腳位配置。
典型應用
10AS048K3F35E2LG 適用於 6 應用s: 5G Wireless Baseband Processing, Software Defined Radio (SDR) Platform, Radar and Beamforming Systems, Broadcast and Pro Video Processing, Medical Imaging Acceleration, Industrial Machine Vision and Inspection.
5G Wireless Baseband Processing
The 10AS048K3F35E2LG suits 5G baseband unit (BBU) prototyping and small-cell signal chains thanks to its 480K logic elements combined with hardened multi-gigabit transceivers and PCI Express Gen2/3 hard IP. The dual Cortex-A9 MPCore subsystem handles Layer 2/3 protocol stacks and OAM while the FPGA fabric accelerates FFT, channel estimation, and LDPC/turbo decoding in deterministic nanosecond latency. Up to 1.5 GHz CPU clock and 20 nm process enable real-time CPRI/eCPRI fronthaul processing. Compared with pure software DSP on a CPU, fabric implementation typically delivers 10-50x speedup for parallel baseband kernels, while the SoC form factor reduces board area and BOM by consolidating processor, FPGA, and PCIe on one package.
推薦
Software Defined Radio (SDR) Platform
For software-defined radio platforms covering HF, VHF, UHF, and L-band waveforms, the 10AS048K3F35E2LG provides a balanced compute substrate. The FPGA fabric runs DDC/DUC, channelizers, and modulators in dedicated DSP blocks, while the dual Cortex-A9 MPCore runs waveform software such as GNU Radio or vendor-specific frameworks under Linux. The 1152-ball F35 package exposes sufficient LVDS/HSTL GPIO for ADC and DAC interfacing typical of wideband RF frontends. Power consumption under full DSP load is in the 15-25 W range, manageable with a moderate copper-pour thermal solution. Compared with discrete processor+FPGA solutions, the integrated SoC halves board area and simplifies high-bandwidth interconnect between HPS and fabric.
推薦
Radar and Beamforming Systems
The 10AS048K3F35E2LG is well matched to phased-array radar, EW, and SIGINT beamforming subsystems. Its 480K logic elements and variable-precision DSP blocks support 64-256 element digital beamforming with per-element pulse compression, MTI/MTD filtering, and CFAR detection. The dual ARM Cortex-A9 cores handle command/control, adaptive nulling algorithms, and Ethernet/network IO. Hardened transceivers enable direct interfacing to A/D converters at sample rates above 1 GSPS using JESD204B/C. The 20 nm process allows sustained DSP utilization with predictable timing closure - critical for radar real-time budgets. Industrial temperature grade E2 supports field-deployed systems without additional thermal screening.
推薦
Broadcast and Pro Video Processing
Studio-grade video processing leverages the 10AS048K3F35E2LG's DSP blocks for real-time 4K/UHD up/down/cross-conversion, color space transform, and HDR/SDR mapping. The FPGA fabric processes multi-stream SDI ingest at 12G-SDI rates while the HPS Cortex-A9 subsystem runs a network stack and control surface. PCI Express Gen3 hard IP enables direct connection to host capture cards in workstation environments. The integrated SoC approach reduces latency below 1 frame end-to-end compared with GPU-based pipelines, which is decisive for live broadcast applications. Industrial temperature support suits OB van and outdoor-event deployment.
推薦
Medical Imaging Acceleration
The 10AS048K3F35E2LG accelerates CT, MRI, and ultrasound reconstruction pipelines including back-projection, FFT-based MR reconstruction, and beam-formed ultrasound. The dual Cortex-A9 runs the patient/operator interface and DICOM network stack while the FPGA fabric executes the heavy lifting of image reconstruction in deterministic hardware. PCI Express Gen3 hard IP enables a single-cable host interface to the imaging workstation. Compared with a discrete CPU+GPU pipeline, the FPGA+SoC approach offers lower and more deterministic latency - critical for interventional procedures. Industrial temperature rating supports hospital and field-imaging deployments.
推薦
Industrial Machine Vision and Inspection
Multi-camera machine vision lines benefit from the 10AS048K3F35E2LG's DSP pipeline, which can run simultaneous defect detection, OCR, and 3D triangulation algorithms across parallel Camera Link or GigE Vision inputs. The FPGA fabric handles pre-processing (debayer, color correction, convolution filters) at line rate, while the HPS executes classification, network protocol, and HMI logic. Hardened PCI Express enables direct workstation connectivity for training-data collection. The industrial-grade temperature range supports factory-floor deployment from -40C to +100C. Compared with CPU-only vision pipelines, the SoC FPGA delivers 5-20x throughput improvement while reducing system power.
推薦
推薦產品摘要
工程參考資料，適用於 10AS048K3F35E2LG — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10AS048K3F35E2SG | 10AS048K2F35E2LG | 10AS048K2F35E2SG | 10AS048K2F35I2LG | 10AS048K2F35I2SG |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-FBGA (F35, 35x35 mm) | 1152-FBGA (F35, 35x35 mm) - same | 1152-FBGA (F35, 35x35 mm) - same | 1152-FBGA (F35, 35x35 mm) - same | 1152-FBGA (F35, 35x35 mm) - same | 1152-FBGA (F35, 35x35 mm) - same |
| Logic Elements | 480,000 | 480,000 - same | 480,000 - same | 480,000 - same | 480,000 - same | 480,000 - same |
| Speed Grade | K3 (faster bin) | K3 - same | K2 (slower bin) | K2 (slower bin) | K2 (slower bin) | K2 (slower bin) |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +100C) | Industrial (-40C to +100C) - same | Commercial (0C to +100C) | Industrial (-40C to +100C) - same | Industrial (-40C to +100C) - same |
| Shipping Suffix | E2LG (engineering samples, tray) | E2SG (engineering samples, tray) | E2LG - same | E2SG | I2LG | I2SG |
| Process Technology | 20 nm | 20 nm - same | 20 nm - same | 20 nm - same | 20 nm - same | 20 nm - same |
| HPS | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore - same | Dual ARM Cortex-A9 MPCore - same | Dual ARM Cortex-A9 MPCore - same | Dual ARM Cortex-A9 MPCore - same | Dual ARM Cortex-A9 MPCore - same |
主要差異化特點
- K3 speed bin with same 1152-ball F35 footprint as K2 variants (對比10AS048K2F35E2LG)
- Industrial temperature grade (-40C to +100C) (對比10AS048K3F35E2SG)
- Tray packaging for low-volume prototyping (對比Tape-and-reel production variants)
設計說明
The 1152-ball FC-FBGA F35 package dissipates 15-25 W under sustained DSP and transceiver load. Design the PCB with a thermal via array under the exposed die pad - typically a 4x4 grid of 0.3 mm laser-drilled vias with 1 oz copper plating - and connect these to inner-plane copper pours. Forced airflow (200-400 LFM) or a low-profile heatsink is recommended for industrial enclosures. Estimated: at 20 W dissipation with theta_JA of 8 C/W (F35 thermal model), junction temperature rises 160 C above ambient; with 25 C ambient this gives Tj ~185 C, exceeding the 100 C maximum. Use the Arria 10 PowerPlay estimator in Quartus Prime to validate your design's worst-case junction temperature.
The 1.0 mm pitch FC-FBGA requires 8-layer PCB stack-up with microvia (laser-drilled) technology on top and bottom for signal breakout. Route all 1152 balls with the Intel Arria 10 SX pin connection guidelines as the authoritative source. Place HPS reference clock (25-50 MHz) within 100 mils of the HPS clock pins with a series-termination resistor; route DDR3/DDR4 traces to the HPS memory controller with matched length (within 25 mil for byte groups). Maintain 100 ohm differential impedance for high-speed transceiver pairs. Add decoupling: 0402 100 nF caps adjacent to every power pin plus bulk 22 uF/47 uF capacitors within 200 mils of each supply group.
Estimated: do not attempt drop-in replacement with a different speed bin (K2 vs K3) without re-running timing analysis in Quartus Prime - the K2 bin is approximately 15-20% slower than K3 and may not meet your Fmax target. Do not reuse a 1152-ball F35 footprint for F34 or F29 packages because the F35 ball map is unique. Verify that the MSEL pins are correctly strapped for the desired configuration scheme (AS, JTAG, or FPP) at board level before bringing up - incorrect MSEL prevents Quartus Programmer from communicating with the device.
Multi-gigabit transceivers require controlled-impedance differential routing with 100 ohm differential impedance and intra-pair skew below 1 ps per inch. Use a continuous reference plane under transceiver lanes; avoid crossing transceiver lanes over plane splits. Reference Intel Arria 10 SX Transceiver User Guide for pre-emphasis and equalization settings. For HPS DDR4 interfaces, perform SI simulation with Quartus Prime IBIS models before tape-out to validate write/read margins across process-voltage-temperature corners.
合規資訊
RoHS compliant and Pb-free per Intel Altera material declaration. Industrial temperature grade E2 is not AEC-Q100 qualified - select an automotive-qualified variant if required for automotive applications.
