10AS057H4F34E3LG - Arria 10 SX SoC FPGA, 570K LE, Dual ARM Cortex-A9 | Intel
MPN： 10AS057H4F34E3LG ✓ 啟用中10AS057H4F34E3LG 概覽
A Field-Programmable Gate Array (FPGA) is a semiconductor device containing configurable logic blocks, programmable interconnect, and dedicated hardware resources such as DSP slices, block RAM, and high-speed transceivers. An SoC FPGA additionally integrates one or more hard processor cores alongside the programmable fabric, allowing designers to execute an operating system (typically Linux or RTOS) on the processors while accelerating custom logic in the FPGA fabric. The Arria 10 SX sits in the product hierarchy: Arria 10 SX -> Arria 10 family -> Intel mid-range FPGA -> programmable logic device -> semiconductor IC.
Key features include 570K logic elements, dual ARM Cortex-A9 MPCore cores with CoreSight debug, 1.5 GHz maximum core frequency, on-chip memory, multiple high-speed transceiver channels, and a rich set of hardened IP such as PCI Express Gen2/Gen3 controllers and DDR3/DDR4 memory controllers. The 20nm process enables a favorable balance between performance, power efficiency, and density, with the integrated HPS reducing BOM cost and board area for embedded designs.
Typical applications include wireless baseband processing, military radar, medical imaging, broadcast video processing, and high-performance industrial test and measurement. The dual-core ARM subsystem allows Linux/RTOS execution for control-plane tasks while the FPGA fabric handles data-plane DSP at line rate.
When designing with this device, use Intel Quartus Prime software for synthesis, place-and-route, and HPS firmware configuration. Pay close attention to PCB layout for the FCBGA-1152 package - it requires HDI PCB stack-up with microvia technology and a matched-length multi-drop memory interface for DDR3/DDR4. This page synthesizes distributor pricing, drop-in same-package variants, and practical design notes not found in the manufacturer datasheet alone.
直接替換替代品，適用於 10AS057H4F34E3LG — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10AS057H4F34E3LG （相同外形與佔位） — 差異在於 Package, Speed Grade, Logic Elements, Mounting Type, RoHS Status.
10AS057H3F34E2SG
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查看資料表 →10AS057H2F34I2SG
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查看資料表 →10AS057H2F34E2LG
✅ 直接替換聯絡詢價
查看資料表 →10AS048H4F34E3LG
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查看資料表 →10AS048H3F34I2SG
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查看資料表 →10AS057H4F34E3LG 最大額定值與電氣特性
| Family | Arria 10 SX |
| Device Variant | 10AS057 |
| Logic Elements | 570,000 |
| Processor Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Core Frequency | 1.5 GHz |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| 封裝 | 1152-FBGA, FCBGA (35x35 mm) |
| I/O Count | 492 user I/O |
| 安裝類型 | Surface Mount |
| Operating Temperature Grade | Enhanced (E3) |
| RoHS 狀態 | Compliant |
| Speed Grade | H4 |
| Package Code | F34 |
| Device Type | SoC FPGA - System on Chip |
| Configuration | FPGA Arria 10 SX 570000 Cells |
10AS057H4F34E3LG f34 腳位配置指南
10AS057H4F34E3LG（f34 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 10AS057H4F34E3LG.
請參閱 資料表 以查看完整腳位配置。
典型應用
10AS057H4F34E3LG 適用於 6 應用s: Wireless Baseband Processing, Military Radar and SIGINT, Medical Imaging Systems, Broadcast Video Processing, Industrial Test and Measurement, Datacenter Hardware Acceleration.
Wireless Baseband Processing
The 10AS057H4F34E3LG's 570K logic elements and DSP-rich fabric enable high-throughput baseband processing for 4G LTE and sub-6 GHz 5G small cells. Its 20nm process delivers the performance-per-watt needed for outdoor RRH units. Placed between RF front-end ADCs/DACs and the network interface, the dual ARM Cortex-A9 subsystem handles MAC scheduling and L2/L3 protocol stacks while the FPGA fabric accelerates FFT/iFFT, channel coding, and MIMO detection at line rate. The H4 speed grade ensures timing closure for high symbol-rate carriers.
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Military Radar and SIGINT
Arria 10 SX SoC FPGAs are widely used in phased-array radar and electronic warfare where 570K LEs deliver thousands of multiply-accumulate operations per clock. The integrated ARM Cortex-A9 subsystem runs radar control software and target-tracking algorithms while the FPGA performs beamforming, pulse compression, and Doppler processing. The 20nm process provides radiation tolerance margin for airborne platforms, and the H4 speed grade enables sample rates above 250 MHz on multiple parallel ADC channels without timing violation.
推薦
Medical Imaging Systems
The 10AS057H4F34E3LG powers ultrasound beamformers, CT reconstruction engines, and MRI digital receivers in clinical imaging equipment. Its 570K logic elements support hundreds of parallel DSP lanes needed for real-time image reconstruction, while the dual ARM Cortex-A9 subsystem manages the user interface and DICOM network stack. The 1152-FCBGA package's high pin density accommodates hundreds of LVDS pairs for parallel ADC interfacing. Power dissipation in the 15-25W range is manageable with passive heatsinking in cart-based imaging systems.
推薦
Broadcast Video Processing
Broadcast studios and contribution encoders deploy Arria 10 SX SoC FPGAs for 4K/UHD HEVC encoding, video stitching, and color grading. The 570K logic elements run multiple parallel HEVC encode cores at 60 fps, while the ARM Cortex-A9 subsystem handles SMPTE 2110 IP transport and PTP timing. The H4 speed grade sustains the 600 MHz fabric clock required for 4:2:2 10-bit 4K/60p processing. Latency is consistently below 100 ms end-to-end, suitable for live broadcast workflows.
推薦
Industrial Test and Measurement
High-end oscilloscopes, protocol analyzers, and ATE testers use the 10AS057H4F34E3LG for parallel waveform capture, FFT computation, and protocol decoding. The 570K logic elements process up to 48 acquisition channels simultaneously, while the ARM subsystem runs the instrument UI and GPIB/LXI control. The 20nm process minimizes per-channel power, allowing high channel density in a single 1U instrument. The H4 speed grade sustains the 1.5 GHz DSP clock needed for real-time FFT analysis on multi-GHz input signals.
推薦
Datacenter Hardware Acceleration
Hyperscale data centers deploy Arria 10 SX SoC FPGAs as SmartNIC accelerators for NVMe-over-Fabrics, network function virtualization, and storage compression. The 570K logic elements accelerate custom data-plane algorithms while the ARM Cortex-A9 cores run Linux control-plane software, eliminating the need for a companion processor. The dual PCIe Gen3 hard IP blocks provide 8 GTps connectivity to host CPUs. Power envelope of 25-40W fits within standard SmartNIC thermal and slot-power constraints.
推薦
推薦產品摘要
工程參考資料，適用於 10AS057H4F34E3LG — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10AS057H3F34E2SG | 10AS057H3F34I2LG | 10AS057H2F34I2SG | 10AS048H4F34E3LG |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA, FCBGA (35x35 mm) | 1152-FBGA (F34) - same | 1152-FBGA (F34) - same | 1152-FBGA (F34) - same | 1152-FBGA (F34) - same |
| Logic Elements | 570,000 | 570,000 | 570,000 | 570,000 | 480,000 (-16%) |
| Speed Grade | H4 | H3 | H3 | H2 | H4 (same) |
| Temperature Grade | E3 (Enhanced) | E2 | I2 (Industrial) | I2 (Industrial) | E3 (same) |
| Processor Core | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| User I/O Count | 492 | 492 | 492 | 492 | 492 |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
主要差異化特點
- Highest logic density in Arria 10 SX F34 package (對比10AS048H4F34E3LG)
- Fastest speed grade available for this device (對比10AS057H2F34E2LG)
- Enhanced temperature grade for wider thermal envelope (對比10AS057H3F34I2LG)
設計說明
The 1152-ball FCBGA (35x35 mm) F34 package requires a high-density interconnect (HDI) PCB stack-up with laser-drilled microvias. Standard 4-layer FR-4 is not viable. Use at least an 8-layer 1-2-5-2 stack-up with 1.5 mil line/space and 0.4 mm pitch escape routing. Allocate four dedicated PCB layers for transceiver channels and two for DDR3/DDR4 matched-length routing. Reference Intel's Arria 10 SX Board Design Guidelines for the exact via-in-pad and decoupling recommendations.
Estimated: at typical DSP and transceiver loading (~70% utilization, ~25W dissipation) with the standard 35x35 FCBGA thermal pad, junction-to-ambient thermal resistance theta_JA is approximately 8 C/W with forced air at 1.5 m/s, yielding ~25C junction temperature rise above ambient. Without airflow, theta_JA rises to ~14 C/W. Use a heat spreader or heat sink with thermal interface material rated for the operating temperature range to keep Tj below 100C for industrial grade.
Do not confuse the F34 package code (1152-ball FCBGA) with other Arria 10 packages - the F34 is the largest BGA in the family and the only one that supports 570K LEs. Also verify the speed grade letter before PCB layout: H4 is the fastest, H2 is the slowest, and routing margins differ. Programming file generation in Quartus Prime is speed-grade specific; using the wrong file will cause timing violations or boot failures.
Use Intel's Early Power Estimator (EPE) spreadsheet before RTL freeze to budget power rails. The 0.9V core rail can demand 15-30A under full load with high di/dt; place at least eight 22uF ceramic capacitors plus a single 470uF polymer bulk capacitor within 25 mm of the BGA. Sequence core, transceiver, and HPS rails with a power management IC such as the LTC2977 to avoid latch-up during hot-plug events.
合規資訊
RoHS and lead-free compliant per DigiKey listing and Intel product page. Reach statement available via Intel product compliance request. Not AEC-Q100 qualified (this is an industrial/commercial-grade FPGA SoC).
