10AS057H2F34I2SG - Arria 10 SX SoC FPGA, 570K LE, Dual A9 | Intel
MPN: 10AS057H2F34I2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8500 | $8,500.00 |
| 10 | $8200 | $82,000.00 |
| 100 | $7800 | $780,000.00 |
| 500 | $7400 | $3,700,000.00 |
| 1,000 | $7100 | $7,100,000.00 |
Drop-in alternatives for 10AS057H2F34I2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS057H2F34I2LG
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$3675 / Unit
View Datasheet →10AS057H2F34I1HG
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$4980.3 / Unit
View Datasheet →10AS057H2F34E2SG
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$3250 / Unit
View Datasheet →10AS057H2F34E2LG
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$2524.1 / Unit
View Datasheet →10AS057H2F34E1HG
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$3050 / Unit
View Datasheet →10AS057H1F34I1HG
✅ Drop-In✓ In Stock
$3500 / Unit
View Datasheet →10AS057H1F34E1HG
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$3300 / Unit
View Datasheet →10AS057H2F34I2SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 570000 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum User I/O | 492 |
| Package | 1152-ball FCBGA (F34) |
| Package Dimensions | 35 x 35 mm |
| Mounting Type | Surface Mount (Flip-Chip BGA) |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | -2 (mid-range) |
| Transceiver Data Rate | Up to 1.5 Gbps (effective) |
| Configuration | JTAG, AS, FPP |
| RoHS Status | Compliant |
| Part Number Decoder - I2 | Industrial temperature grade |
| Part Number Decoder - SG | Lead-free, RoHS compliant, Pb-free F34 package |
10AS057H2F34I2SG 35 x 35 mm Pin Configuration Guide
Complete pinout information for 10AS057H2F34I2SG (35 x 35 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS057H2F34I2SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS057H2F34I2SG is suitable for 6 applications: Wireless Baseband Processing, Software-Defined Radio, Video Broadcasting Infrastructure, Industrial Machine Vision Systems, Radar Signal Processing, Test and Measurement Instrumentation.
Wireless Baseband Processing
The 10AS057H2F34I2SG suits wireless baseband applications thanks to its 570K logic elements for high-throughput DSP pipelines, integrated 1.5 Gbps transceivers for CPRI/OBSAI fronthaul links, and dual ARM Cortex-A9 cores that run the MAC and upper layers while the FPGA fabric accelerates PHY and FEC. The Arria 10 SX SoC architecture reduces latency by eliminating chip-to-chip HPS-to-FPGA bridge interfaces, which is critical for LTE and 5G NR sub-6 GHz radio units.
Recommended
Software-Defined Radio
The dual ARM Cortex-A9 MPCore in the 10AS057H2F34I2SG runs real-time control stacks, scheduling, and waveform management while the 570K LE fabric executes parallel demodulation, channelization, and digital up/down conversion. Transceivers operating up to 1.5 Gbps aggregate support multi-band RF sampling for tactical and commercial SDR platforms. Quartus Prime DSP Builder and SoC EDS provide a complete development path.
Recommended
Video Broadcasting Infrastructure
The 570K logic elements of the 10AS057H2F34I2SG provide the resources needed for multi-stream HEVC/AVC encode and decode, video processing pipelines (deinterlacing, scaling, color conversion), and overlay graphics at 4K/60p and beyond. The hard ARM cores manage IP/UDP/SRT/RTP protocol stacks for contribution encoders and decoders, while FCBGA-1152 with 492 I/O supports simultaneous SDI, HDMI, and 10G Ethernet I/O.
Recommended
Industrial Machine Vision Systems
The 10AS057H2F34I2SG combines high-throughput FPGA logic for image preprocessing and machine-learning inference with an ARM Cortex-A9 dual-core for system control, network connectivity, and HMI rendering. Industrial temperature grading (-40C to +100C) suits factory-floor deployment. Multiple MIPI or LVDS channels aggregated over 492 I/O interfaces with CoaXPress, GigE Vision, or USB3 Vision cameras.
Recommended
Radar Signal Processing
The 570K LE fabric of the 10AS057H2F34I2SG handles FFT, beamforming, and pulse compression for phased-array radar, while 1.5 Gbps transceivers digitize ADC outputs and feed back digital control. The hard ARM cores run the tracker and display rendering. Industrial temperature and high pin count make it well-suited to airborne, ground-based, and maritime radar systems where deterministic latency matters.
Recommended
Test and Measurement Instrumentation
The 10AS057H2F34I2SG enables high-end test equipment by combining FPGA-speed data acquisition with ARM-driven display and remote control logic. The 570K LE fabric executes parallel DSP for real-time spectral analysis, protocol decoding, and arbitrary waveform generation, while 1.5 Gbps transceivers feed data from high-speed ADCs/DACs. SoC integration reduces board complexity in oscilloscopes, logic analyzers, and signal analyzers.
Recommended
Recommended Products Summary
Engineering reference data for 10AS057H2F34I2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS057H2F34I2LG | 10AS057H2F34I1HG | 10AS057H2F34E2SG | 10AS057H2F34E2LG |
|---|---|---|---|---|---|
| Package | 1152-ball FCBGA (F34), 35x35 mm | 1152-ball FCBGA (F34), 35x35 mm - same | 1152-ball FCBGA (F34), 35x35 mm - same | 1152-ball FCBGA (F34), 35x35 mm - same | 1152-ball FCBGA (F34), 35x35 mm - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Logic Elements | 570000 | 570000 | 570000 | 570000 | 570000 |
| Speed Grade | -2 | -2 | -1 (faster) | -2 | -2 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Extended | Extended |
| Lead-free Suffix | SG | LG | HG | SG | LG |
| User I/O | 492 | 492 | 492 | 492 | 492 |
| HPS Revision | H2 | H2 | H2 | H2 | H2 |
| Indicated Unit Price (qty-1, USD, as of 2026-09-05) | 8500.00 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest user I/O among the 570K-LE Arria 10 SX F34 family (vs 10AS057K1F35E1SG)
- Industrial temperature grade with -2 speed balance (vs 10AS057H2F34E2SG)
- Dual-core ARM Cortex-A9 hard processor system integrated (vs 10AS048H2F34I2SG)
Design Notes
The 1152-ball FCBGA at 35x35 mm has a typical theta_JA in the range of 0.4-1.0 C/W with proper thermal design (chip-scale BGA with thermal lid and adequate PCB copper). For industrial temperature operation up to +100C ambient, plan for at least 8-10 W continuous dissipation without airflow. Use the manufacturer's thermal model and follow the package lid-down mounting recommendations in the Arria 10 device datasheet.
Design a high-density PCB stack-up (typically 12-16 layers) with microvia arrays under the BGA for breakout. Pair each high-speed transceiver differential pair with continuous reference ground planes and follow the Arria 10 pin connection guidelines for length matching. Use the Intel/Altera Pin Connection Guidelines document to identify any pins that require specific termination or pull-up resistors.
Verify the HPS (hard processor system) pin multiplex mapping for SD/MMC, USB, EMAC, and NAND before PCB layout - the HPS peripheral I/O assignment differs across Arria 10 SX SKUs. Also confirm Quartus Prime version supports the silicon revision on the part. Configuring SoC FPGA via AS mode requires a compatible EPCQ flash device; consult the Arria 10 Configuration Handbook for supported densities and voltage rails.
Compliance Information
Lead-free F34 FCBGA package; SG suffix indicates lead-free and RoHS compliance per Altera/Intel convention. Not AEC-Q100 qualified - choose automotive-grade Arria 10 devices for that requirement.
