A3PE3000-FG896 - ProASIC3E Flash FPGA 620 I/O | Microchip
MPN： A3PE3000-FG896 ✓ 啟用中A3PE3000-FG896 概覽
A flash-based FPGA is a field-programmable gate array that stores its configuration in on-chip non-volatile flash memory cells rather than in an external configuration ROM, as SRAM FPGAs require. Within the power-management hierarchy of programmable logic, flash FPGAs sit between one-time-programmable antifuse devices and reprogrammable SRAM devices, offering single-chip, instant-on behavior with reprogrammability. The ProASIC3E family extends the ProASIC3 architecture with embedded SRAM and PCIe-ready I/O for system-level integration.
Key features of the A3PE3000-FG896 include non-volatile flash configuration enabling a true single-chip solution with no external boot device, 620 user I/Os supporting a broad range of voltage-referenced and single-ended standards, and embedded memory totaling 516096 bits for FIFOs and dual-port buffering. The VersaTile architecture allows each tile to function as a three-input LUT, a D flip-flop, or a latch with enable, maximizing fabric efficiency.
Technically, the device uses Microchip's third-generation flash switch technology on a 130 nm process. The fabric achieves a typical system clock rate of 231 MHz, and VersaNet global networks distribute low-skew, high-fanout clocks and resets across the die. The 896-ball FBGA provides abundant I/O and power/ground balls for signal-integrity headroom in high-pin-count designs.
Typical applications include industrial automation controllers, communications and networking line cards, medical instrumentation, aerospace/defense subsystems requiring instant-on logic, and test equipment, all of which benefit from the 3M-gate capacity and 620 I/O count.
Designers should note the commercial 0 C to +70 C operating range of this FG896 speed-grade: industrial applications must select the FG896I variant instead. Voltage-referenced I/O standards require one VREF pin per minibank per the ProASIC3E datasheet.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, as of 2026-09-02.
直接替換替代品，適用於 A3PE3000-FG896 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： A3PE3000-FG896 （相同外形與佔位） — 差異在於 Family, Package, Configuration Memory, Process Technology, System Gates.
A3PE3000-FGG896
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000-FG896I
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000-FGG896I
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000L-FG896M
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000L-FGG896M
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000L-FGG896I
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000L-FG896I
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000-FG896 最大額定值與電氣特性
| Family | ProASIC3E |
| System Gates | 3000000 |
| Number of I/O | 620 |
| Embedded Memory | 516096 bit |
| Maximum System Frequency | 231 MHz |
| Process Technology | 130 nm |
| Core Supply Voltage | 1.5 V |
| Configuration Memory | Flash (non-volatile, reprogrammable) |
| 封裝 | 896-BGA (FBGA) |
| 安裝方式 | SMD/SMT |
| 工作溫度 | 0 C to +70 C |
| Packaging | Tray |
| Speed Grade | Standard (-) |
| Architecture | VersaTile 3-input LUT / D flip-flop / latch |
| Global Networks | VersaNet low-skew high-fanout networks |
| RoHS 狀態 | Non-green package (FG prefix; FGG variants are RoHS green) |
A3PE3000-FG896 896-bga (fbga) 腳位配置指南
A3PE3000-FG896（896-bga (fbga) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： A3PE3000-FG896.
請參閱 資料表 以查看完整腳位配置。
典型應用
A3PE3000-FG896 適用於 6 應用s: Industrial Automation and Control, Communications and Networking Line Cards, Medical Instrumentation, Test and Measurement Equipment, Aerospace and Defense Subsystems, Embedded System Prototyping and ASIC Emulation.
Industrial Automation and Control
The A3PE3000-FG896 fits industrial automation controllers where its 3M system gates absorb protocol bridging, motion-profile logic, and safety interlocks, while 620 user I/Os interface PLC backplanes, encoders, and field sensors. Its flash configuration gives instant-on logic at power-up, so the controller does not wait for an external boot ROM, an advantage over SRAM FPGAs in factory-floor nodes subject to frequent power cycling. Embedded memory of 516096 bits implements FIFOs between heterogeneous bus domains. For factory environments with wide ambient swings, select the A3PE3000-FG896I industrial variant instead; the commercial-grade FG896 is best for environmentally controlled cabinets. Instant-on behavior also simplifies determinism analysis for cycle-time-critical I/O scanning loops.
推薦
Communications and Networking Line Cards
Networking line cards benefit from the A3PE3000-FG896's combination of 231 MHz system performance and 620 I/Os for parallel PHY interfaces, backplane buses, and framing logic. The VersaNet low-skew global networks distribute line-rate clocks across the die with minimal skew, per the ProASIC3E fabric user guide, which matters for source-synchronous parallel data capture. The 516096-bit embedded SRAM buffers packet streams between MAC and switch-core domains. Because configuration is flash-based, cards are live within milliseconds of slot insertion, supporting hot-swap and fast-failover requirements. For thermally dense chassis, the same footprint accepts the low-power A3PE3000L-FG896M drop-in, cutting static dissipation without a PCB respin.
推薦
Medical Instrumentation
Diagnostic and laboratory medical instruments use the A3PE3000-FG896 to glue together analog front ends, data converters, and host interfaces. Its instant-on flash fabric means acquisition subsystems are ready as soon as power is applied, shortening instrument boot time for point-of-care devices. The 620 user I/Os drive high-channel-count front ends, while the 3M-gate capacity implements channel-sequencing state machines, digital filtering, and communication stacks simultaneously. Commercial 0 C to +70 C rating suits clinical environments; portable or outdoor telemetry designs should use the industrial A3PE3000-FG896I variant on the same PCB. Embedded FIFO memory between ADC banks and processing blocks avoids external SRAM, reducing BOM count and board area in compact enclosures.
推薦
Test and Measurement Equipment
Bench and automated test instruments leverage the A3PE3000-FG896 for pattern generation, timing capture, and bus emulation, exploiting 620 I/Os to drive many channels in parallel from a single device. The 231 MHz fabric timing supports source-synchronous capture of mid-speed parallel buses, while VersaTiles configured as D flip-flops with enable build per-channel timing verniers. Flash configuration removes the configuration-ROM bring-up delay at each instrument power cycle, and the non-volatile fabric retains its image through brownouts common on lab benches. The 516096-bit embedded memory implements deep capture FIFOs. Design teams targeting extended-temperature testers should drop in the pin-compatible A3PE3000-FG896I without changing the PCB footprint.
推薦
Aerospace and Defense Subsystems
Flash FPGAs are attractive in avionics and defense electronics because the non-volatile configuration is inherently instant-on and single-chip, and the A3PE3000-FG896 provides 3M gates of mission logic with 620 I/Os for sensor and actuator interfaces. ProASIC3E architecture is deployed in space and defense programs where SRAM configuration-readout concerns push designers toward flash fabric, per Microchip positioning of the family. Ground-based radar, test benches, and manned-platform subsystems within 0 C to +70 C can use this commercial grade; temperature-extended builds should select the A3PE3000L-FG896M drop-in, which keeps the identical 896-ball FBGA footprint while adding extended temperature and reduced static power for convection-cooled enclosures.
推薦
Embedded System Prototyping and ASIC Emulation
R&D teams use the A3PE3000-FG896 as a reprogrammable prototyping vehicle: 3M gates accommodate substantial RTL blocks, and 620 I/Os expose wide buses to logic analyzers and FPGA-to-FPGA bridges. Unlike antifuse one-time-programmable devices, the flash fabric is fully reprogrammable in-system, so iterative RTL debugging does not consume new silicon, lowering total cost of ownership per Microchip family positioning. The 516096-bit embedded memory models on-chip RAM or FIFO structures during emulation. Because the same footprint hosts the industrial FG896I and low-power A3PE3000L variants, a validated prototype PCB migrates directly to production builds, including extended-temperature derivatives, without layout revision, protecting schedule when qualification variants are needed.
推薦
推薦產品摘要
工程參考資料，適用於 A3PE3000-FG896 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | A3PE3000-FG896I | A3PE3000-FGG896 | A3PE3000L-FG896M |
|---|---|---|---|---|
| Brand | Microchip Technology (Actel) | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 896-BGA (FBGA) | 896-BGA (FBGA) - same | 896-BGA (FBGA) - same | 896-BGA (FBGA) - same |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/O | 620 | 620 | 620 | 620 |
| Max System Frequency | 231 MHz | 231 MHz | 231 MHz | 231 MHz |
| Operating Temperature | 0 C to +70 C (commercial) | Industrial (-40 C range) | 0 C to +70 C (commercial) | Extended (M suffix) |
| RoHS / Green Package | No (FG standard package) | No (FG standard package) | Yes (G = green) | No (FG standard package) |
| Core Power Characteristic | Standard ProASIC3E (1.5 V core) | Standard ProASIC3E (1.5 V core) | Standard ProASIC3E (1.5 V core) | Low-power A3PE3000L family |
| Configuration | Flash, non-volatile, reprogrammable | Flash, non-volatile | Flash, non-volatile | Flash, non-volatile |
主要差異化特點
- Single-chip instant-on flash configuration (對比SRAM FPGAs (e.g., Spartan-3 class))
- Footprint-identical extended-temperature variants (對比A3PE3000-FG896I)
- Low-power family option on same footprint (對比A3PE3000L-FG896M)
設計說明
Estimated: budget the 1.5 V core rail first using Libero SmartPower estimates for your utilization, since flash FPGAs dissipate static power proportional to configured fabric. Bank I/O supplies (VCCI) must match the selected I/O standards per bank; when using voltage-referenced standards, the ProASIC3E datasheet requires one VREF pin assignment per minibank. Decouple each VCCI bank with local ceramics close to the ball via fanout to limit di/dt droop during simultaneous switching on wide parallel buses.
The 896-ball FBGA requires a via-in-pad or dog-bone fanout strategy; verify ball pitch against your fabricator's capability before layout release. Follow the ProASIC3E datasheet package footnote: FG256 and FG484 are footprint-compatible packages, but the FG896 is a distinct footprint - do not assume family-wide footprint interchangeability. Keep configuration and JTAG balls routed away from high-slew I/O to protect flash configuration integrity during reprogramming.
The FG896 (no I suffix) is a commercial-grade part rated 0 C to +70 C; sourcing it for industrial builds is a frequent error - order A3PE3000-FG896I instead, which is the same footprint. The FG prefix is the non-green package; for RoHS/lead-free production lines specify the FGG896. Also confirm speed-grade suffix on purchase orders, since pricing and timing closure results differ across family speed grades.
合規資訊
Per ProASIC3E datasheet ordering information, the G in the part number indicates RoHS-compliant green packages; this FG896 (no G) is the standard package. The A3PE3000-FGG896 is the RoHS-compliant equivalent.
