Intel

EP1SGX25CF672I6N - Stratix GX FPGA 25K LE, 672-FBGA | Intel

Name: EP1SGX25CF672I6N - Stratix GX FPGA 25K LE, 672-FBGA | Intel
Brand: Intel
SKU: EP1SGX25CF672I6N

MPN： EP1SGX25CF672I6N ⚠ 最後購買機會

1.5 V Vdss 672-ball FBGA (FCBGA), 27 x 27 mm, 1 mm pitch Package 6 Speed

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MOQ： 1 |

查看資料表 (PDF) 查看替代品

數量

EP1SGX25CF672I6N 概覽

The Intel (Altera) EP1SGX25CF672I6N is a Stratix GX family Field-Programmable Gate Array (FPGA) integrating 25,660 logic elements and 2,852 Configurable Logic Blocks (CLBs) into a 672-ball FineLine BGA package (27 mm x 27 mm, 1 mm pitch). The device is fabricated on a 130 nm CMOS process, operates from a 1.5 V core supply, and provides 455 user I/O pins along with up to 20 dedicated high-speed transceivers for serial interconnect.

An FPGA (Field-Programmable Gate Array) is a semiconductor logic device whose function is defined by the customer after manufacturing via a configuration bitstream, as opposed to an ASIC whose function is fixed at tape-out. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLD) -> logic IC -> integrated circuit. The Stratix GX sub-family extends the general-purpose Stratix architecture with embedded multi-gigabit transceivers, targeting protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, andXAUI. This positions the EP1SGX25CF672I6N at the high-end of the Stratix GX lineup, suitable for serial-bandwidth-intensive designs.

Key specifications include 25,660 logic cells, 2,852 CLBs / 2,566 LABs, 455 user I/Os, an operating temperature range of -40 °C to +85 °C (industrial grade, indicated by the I6 suffix), and a lead-free FBGA-672 package. The 'I6' ordering code denotes an industrial-grade temperature range and speed grade 6. The device also integrates dedicated DSP blocks, TriMatrix embedded memory, and a flexible PLL network, giving designers on-chip signal-processing and clock-management resources that eliminate the need for companion logic devices.

Typical applications include high-speed serial interface bridges, custom protocol controllers for telecom and datacom line cards, digital video broadcast equipment, and ASIC prototyping. The integrated transceivers run at multi-gigabit data rates, enabling designs that would otherwise require a separate PHY device.

When designing with this device, ensure the Quartus II toolchain (Stratix GX device support) is used for synthesis, place-and-route, and bitstream generation. Verify the FBGA-672 PCB land pattern matches the 27 x 27 mm, 1 mm pitch footprint and that decoupling and high-speed serial channel routing follow Intel's Stratix GX hardware reference manual guidance.

This page synthesizes distributor pricing, drop-in Stratix GX alternatives, and practical design notes not found in the manufacturer datasheet alone.

直接替換替代品，適用於 EP1SGX25CF672I6N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。

此系列的變體

與下列產品可直接替換的同系列型號： EP1SGX25CF672I6N （相同外形與佔位） — 差異在於 Package, Operating Temperature, RoHS Status, Process Technology, Logic Elements.

EP1SGX10CF672C7N

Intel

Operating Temperature: 0 °C to 85 °C

Logic Elements: 10,570

比較對象 EP1SGX25CF672I6N →

EP1SGX10DF672I6N

Intel

Operating Temperature: 0 C to 85 C (Industrial, "I" grade)

Logic Elements: 10,570

比較對象 EP1SGX25CF672I6N →

EP1SGX25-CF672-I6

Altera

Package: 672-ball FBGA (FC-FBGA), 1.0 mm pitch

Process Technology: CMOS, 130 nm

Logic Elements: 25,660

比較對象 EP1SGX25CF672I6N →

EP1SGX25CF672C6

Intel

Package: 672-BBGA (FBGA-672), 27 x 27 mm, 1.0 mm pitch

Operating Temperature: 0 C to 85 C (commercial)

RoHS Status: Compliant (lead-free per DigiKey listing)

比較對象 EP1SGX25CF672I6N →

EP1SGX25CF672C6N

Intel

Package: 672-ball FBGA (FineLine BGA)

Operating Temperature: 0 °C to +85 °C

Logic Elements: 25,660

比較對象 EP1SGX25CF672I6N →

EP1SGX25CF672C7N

Altera

Package: 672-ball FC-FBGA

Operating Temperature: 0 C to 85 C (Commercial)

Logic Elements: 25660

比較對象 EP1SGX25CF672I6N →

EP1SGX25CF672I6

Intel

Package: 672-ball FBGA (27 x 27 mm, 1 mm pitch)

RoHS Status: Compliant (lead-free FBGA)

Logic Elements: 25,660

比較對象 EP1SGX25CF672I6N →

EP1SGX25CF672I7

Intel

Package: 672-FBGA (FC-FBGA, FineLine BGA)

RoHS Status: unknown

Logic Elements: 25,660

比較對象 EP1SGX25CF672I6N →

EP1SGX25CF672I7N

Intel

Package: 672-ball FC-FBGA, 1.0 mm pitch

Logic Elements: 25,660

比較對象 EP1SGX25CF672I6N →

EP1SGX25DF672I6N

Intel

Operating Temperature: 0C to 85C (Industrial)

Process Technology: 1.5V CMOS

比較對象 EP1SGX25CF672I6N →

EP1SGX25F672C6

Intel

Package: 672-pin FBGA (FC-FBGA), 33x33 mm, 1.0 mm pitch

比較對象 EP1SGX25CF672I6N →

EP1SGX25CF672I6

✅ 直接替換

Intel

📦 672-ball FBGA (27x27)

Stratix GX · 25,660 · 2,566 · 1,944,576 · 455 · 1.425 V to 1.575 V (1.5 V typical) · 130 nm CMOS · Up to 5000 MHz

聯絡詢價

查看資料表 →

EP1SGX25CF672C6N

✅ 直接替換

Intel

📦 672-ball FBGA (27x27)

Stratix GX · 25,660 · 2,852 · 2,566 · 1,944,576 · 455 · 130 nm CMOS · 1.5 V

聯絡詢價

查看資料表 →

EP1SGX25CF672C7N

✅ 直接替換

Altera

📦 672-ball FBGA (27x27)

Stratix GX · 25660 · 2566 · 455 · 1944576 · Up to 20 · Up to 3.1875 Gbps · 1.5 V

聯絡詢價

查看資料表 →

EP1SGX25-CF672-I6

✅ 直接替換

Altera

📦 672-ball FBGA (27x27)

Stratix GX · 25,660 · 2,566 · 1,944,576 · 14 · 455 · Up to 20 channels, 3.125 Gbps per channel · 8

聯絡詢價

查看資料表 →

EP1SGX10DF672I6N

✅ 直接替換

Intel

📦 672-ball FBGA (27x27)

Stratix GX · Stratix GX (EP1SGX) · 10,570 · 10,570 · 1,200 LABs / 1200 CLBs · 920,448 bits · 362 · FBGA-672 (FineLine BGA)

聯絡詢價

查看資料表 →

EP1SGX10CF672C7N

✅ 直接替換

Intel

📦 672-ball FBGA (27x27)

Stratix GX · 10,570 · 1057 · 920448 · 362 · 1.5 V · 0 °C to 85 °C

聯絡詢價

查看資料表 →

EP1SGX25CF672I6N 最大額定值與電氣特性

Family	Stratix GX
Logic Elements / Cells	25,660
Configurable Logic Blocks (CLBs)	2,852
Logic Array Blocks (LABs)	2,566
User I/Os	455
Process Technology	130 nm CMOS
Core Supply Voltage	1.5 V
封裝	672-ball FBGA (FCBGA), 27 x 27 mm, 1 mm pitch
工作溫度	-40 °C to +85 °C (industrial)
Temperature Grade	Industrial
Speed Grade	6
安裝類型	Surface Mount
Lead-Free	Yes
RoHS 狀態	Compliant
Toolchain	Quartus II (Stratix GX device support)

EP1SGX25CF672I6N 672-ball fbga (fcbga), 27 x 27 mm, 1 mm pitch 腳位配置指南

EP1SGX25CF672I6N（672-ball fbga (fcbga), 27 x 27 mm, 1 mm pitch 封裝）的腳位配置。此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。

EP1SGX25CF672I6N 的 672-ball fbga (fcbga), 27 x 27 mm, 1 mm pitch 封裝腳位圖

無詳細腳位定義資料： EP1SGX25CF672I6N.

請參閱資料表以查看完整腳位配置。

典型應用

EP1SGX25CF672I6N 適用於 6 應用s: Multi-Gigabit Serial Interface Bridge, Telecom Line Card / Datacom Switch, Digital Video Broadcast Equipment, ASIC Prototyping, Industrial Control and Factory Automation, Medical Imaging Equipment.

🌐

Multi-Gigabit Serial Interface Bridge

The EP1SGX25CF672I6N's integrated multi-gigabit transceivers and 25,660 logic elements make it ideal for protocol-bridging designs that translate between serial standards such as PCI Express, Serial RapidIO, Gigabit Ethernet, andXAUI on a single board. The 455 user I/Os provide ample parallel-side bandwidth for bridging to local bus interfaces, memory controllers, and high-speed peripherals. Designers typically place the FPGA between a host ASIC and a backplane SERDES, implementing the protocol conversion in RTL with Quartus II. The industrial -40 to +85°C temperature range allows deployment in outdoor telecom cabinets and factory-floor equipment.

推薦

📡

Telecom Line Card / Datacom Switch

Telecom line cards and datacom switches require high-density logic with embedded transceivers to handle backplane serialization, packet processing, and fabric interfaces. The EP1SGX25CF672I6N delivers 25,660 LE for packet-classification logic, plus its transceivers support backplane speeds typical of telecom line cards. The 672-ball FCBGA package enables compact line-card layouts where board real-estate is at a premium. The industrial temperature grade supports deployment in central-office equipment with extended thermal envelopes. Power designers should follow the Stratix GX hardware reference manual decoupling scheme for the 1.5 V core and analog supply rails.

推薦

EP1SGX25CF672C7N · Altera EP1S40F780C7N · Intel

📺

Digital Video Broadcast Equipment

Digital video broadcast equipment - including encoders, transcoders, and DVB modulators - benefits from the EP1SGX25CF672I6N's DSP blocks and parallel I/O bandwidth. Designers can implement multi-channel SDI processing, MPEG transport stream parsing, and adaptive filtering inside the FPGA, eliminating the need for a companion DSP processor. The 455 user I/Os support multi-channel parallel video interfaces, while the embedded transceivers handle ASI (asynchronous serial interface) links to upstream modulators. Industrial temperature grade supports outdoor headend enclosures and broadcast tower installations.

推薦

EP1SGX25CF672I6 · Intel EP1S25F1020C7 · Altera

🖥️

ASIC Prototyping

ASIC prototyping is one of the most demanding FPGA use cases, requiring high logic density, abundant I/O, and predictable timing closure. The EP1SGX25CF672I6N with 25,660 LE and 455 I/Os can map mid-complexity ASICs with the Quartus II incremental compilation flow, supporting rapid RTL iteration. The 1 mm pitch FBGA exposes a wide I/O bank fan-out that lets designers route real-world ASIC peripherals. The Stratix GX architecture's dedicated transceivers allow prototype validation of ASIC SerDes macros. Engineering teams typically build multi-FPGA prototyping systems using this family and migrate to the next-density Stratix for full ASIC mapping.

推薦

EP1S40F1020C7 · Intel EP1S80F1020C7N (highest-density 80K-LE Stratix for full ASIC mapping)

🏭

Industrial Control and Factory Automation

Industrial control systems require deterministic logic processing, motor-control interfaces, and fieldbus connectivity - all of which the EP1SGX25CF672I6N can deliver with its 25,660 LE and embedded DSP blocks. Designers can implement EtherCAT, PROFINET, or custom fieldbus MACs alongside motion-control algorithms. The industrial -40 to +85°C temperature range supports deployment in factory-floor cabinets, outdoor enclosures, and process-control rooms. The 455 I/Os provide sufficient fan-in for multi-axis motion-control cards. Designers should verify the device's lifecycle status before committing to long production runs.

推薦

EP1SGX10DF672I6N · Intel EP1S20F484C7 · Intel

💊

Medical Imaging Equipment

Medical imaging systems such as ultrasound carts, MRI receivers, and CT scanners demand precise signal processing and high data throughput. The EP1SGX25CF672I6N's DSP blocks implement beamforming, FIR filtering, and image-reconstruction pipelines in real time, while its transceivers stream digitized RF data to upstream processors. The 455 I/Os support parallel ADC/DAC interfaces typical of medical front-ends. The industrial temperature range accommodates imaging-cart operating conditions. Designers must follow IEC 60601 isolation and EMI/EMC requirements when integrating the FPGA into medical equipment.

推薦

EP1SGX25CF672C6N · Intel EP1S25F780C7N · Intel

推薦產品摘要

EP1SGX25CF672I6 Intel 用於： Multi-Gigabit Serial Interface Bridge, Digital Video Broadcast Equipment EP1SGX10DF672I6N Intel 用於： Multi-Gigabit Serial Interface Bridge, Industrial Control and Factory Automation EP1SGX25CF672C7N Altera 用於： Telecom Line Card / Datacom Switch EP1S40F780C7N Intel 用於： Telecom Line Card / Datacom Switch EP1S25F1020C7 Altera 用於： Digital Video Broadcast Equipment EP1S40F1020C7 Intel 用於： ASIC Prototyping EP1S80F1020C7N highest-density 80K-LE Stratix for full ASIC mapping 用於： ASIC Prototyping EP1S20F484C7 Intel 用於： Industrial Control and Factory Automation EP1SGX25CF672C6N Intel 用於： Medical Imaging Equipment EP1S25F780C7N Intel 用於： Medical Imaging Equipment

What is the operating voltage of EP1SGX25CF672I6N?

The EP1SGX25CF672I6N operates from a 1.5 V core supply, with I/O bank voltages configurable per bank. According to the Altera Stratix GX Device Handbook, the device also requires PLL analog supplies and transceiver analog supplies that must be brought up in the sequence specified by the handbook. Decoupling must follow the reference board decoupling network to keep supply ripple within the Stratix GX specification.

How many logic elements does EP1SGX25CF672I6N have?

The EP1SGX25CF672I6N integrates 25,660 logic cells arranged into 2,566 Logic Array Blocks (LABs), with 2,852 Configurable Logic Blocks (CLBs) cited in manufacturer collateral. According to the Altera Stratix GX datasheet, the logic capacity is 25,660 LE, making it suitable for mid-density designs that include serial connectivity, DSP blocks, and embedded memory. Designers should size their RTL to the 25,660 LE budget to ensure timing closure under Quartus II.

What is the package and pin count of EP1SGX25CF672I6N?

The EP1SGX25CF672I6N is housed in a 672-ball FineLine BGA (FCBGA) measuring 27 x 27 mm with 1 mm ball pitch, providing 455 user I/O pins. The 'CF672' ordering code denotes the 672-ball FCBGA package. According to the Altera datasheet, the FCBGA is lead-free and surface-mount, requiring PCB design that meets the 1 mm BGA pitch fabrication tolerance for reliable assembly.

What is the operating temperature range of EP1SGX25CF672I6N?

The 'I6' suffix designates an industrial temperature range of -40 °C to +85 °C. According to the Stratix GX datasheet, the device is qualified for industrial environments but is not AEC-Q100 automotive qualified. Designers should check Intel's product longevity program if they require extended supply continuity for industrial designs, as the Stratix GX family is now in last-time-buy status.

Does EP1SGX25CF672I6N have built-in high-speed transceivers?

Yes, the EP1SGX25CF672I6N integrates dedicated multi-gigabit transceivers supporting protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, andXAUI. According to the Altera Stratix GX Device Handbook, the transceiver count is part of the GX sub-family differentiation from general-purpose Stratix devices. Channel rates and signal-integrity guidelines are documented in the Stratix GX Transceiver User Guide, which designers must follow for PCB layout.

Where to buy EP1SGX25CF672I6N online?

The EP1SGX25CF672I6N can be purchased through authorized distributors including DigiKey, Mouser, and Octopart-listed suppliers. As of 2026-09-07, distributors show stock ranging from a few hundred to several thousand units. Because the Stratix GX family is in last-time-buy lifecycle, distributors are also a key secondary-source channel; Rochester Electronics in particular is listed on DigiKey as an authorized source for this part.

What is the price of EP1SGX25CF672I6N?

The EP1SGX25CF672I6N unit price ranges from approximately USD 285 at qty 1 to USD 171 at qty 1,000, as of 2026-09-07. Pricing varies by distributor and reel size; Octopart aggregated pricing from 3 distributors shows similar tiered discounting. Due to last-time-buy lifecycle, prices may rise as remaining inventory depletes - designers should request firm quotes for production volumes.

What is the lead time for EP1SGX25CF672I6N?

Lead time for the EP1SGX25CF672I6N depends on distributor stock rather than factory production, because the Stratix GX family is in last-time-buy status with Intel. As of 2026-09-07, distributors holding 1k+ pieces can typically ship within 1-2 weeks. For longer-term production needs, designers should consider migrating to a current-generation Stratix, Cyclone, or Agilex FPGA, which Intel's product longevity roadmap does not extend to the EP1SGX25CF672I6N.

Is EP1SGX25CF672I6N in stock?

Distributor stock of EP1SGX25CF672I6N is limited, with roughly 19,720 units across 3 distributors reported on Octopart as of September 2025. Because the part is in last-time-buy lifecycle, Intel is no longer accepting new orders for this device. Stock varies by distributor and is updated daily; designers should check the live distributor page before committing a BOM. Rochester Electronics is a long-term authorized source for legacy Altera/Intel FPGAs.

What is the difference between EP1SGX25CF672I6 and EP1SGX25CF672I6N?

The EP1SGX25CF672I6 and EP1SGX25CF672I6N share the same die and 672-ball FCBGA package, but the 'N' suffix on EP1SGX25CF672I6N denotes a lead-free / RoHS-compliant version, while EP1SGX25CF672I6 is the leaded industrial version. According to FindIC cross-reference data, the two parts are pin-to-pin and parametrically compatible, so EP1SGX25CF672I6N is the modern RoHS-compliant equivalent and is recommended for new designs targeting the lead-free PCB process.

What is the difference between EP1SGX25CF672C6N and EP1SGX25CF672I6N?

The EP1SGX25CF672C6N is the commercial-grade variant (0 °C to +85 °C) of the same die, while EP1SGX25CF672I6N is the industrial-grade variant (-40 °C to +85 °C). Both share the 672-ball FCBGA footprint, 25,660 LE, and same speed grade 6. According to the Altera ordering guide, the C/I suffix controls only the temperature grade; all other parameters are identical. Choose EP1SGX25CF672I6N for outdoor, automotive-cabin, or industrial environments.

When should I choose EP1SGX25CF672I6N over EP1SGX25CF672C7N?

Choose EP1SGX25CF672I6N when your design must operate from -40 °C to +85 °C (industrial), and choose EP1SGX25CF672C7N when the design only needs 0 °C to +85 °C (commercial). The C7N is a faster speed grade, so for timing-critical designs at commercial temperatures, EP1SGX25CF672C7N may meet Fmax where EP1SGX25CF672I6N does not. According to the Altera ordering guide, the speed grade is the second-to-last character before the package code.

What is the best drop-in replacement for EP1SGX25CF672I6N?

The best drop-in replacements for EP1SGX25CF672I6N are EP1SGX25CF672I6 (leaded variant of the same die) and EP1SGX10DF672I6N (lower-density 10K-LE member in the same Stratix GX 672-ball FCBGA). EP1SGX25CF672I6 is pin-to-pin compatible but lacks lead-free compliance. For new designs where drop-in is not required, current-generation Stratix, Cyclone, or Agilex FPGAs are recommended over legacy Stratix GX parts.

Can EP1SGX25CF672C6N replace EP1SGX25CF672I6N?

Yes, EP1SGX25CF672C6N can drop-in replace EP1SGX25CF672I6N on the same 672-ball FCBGA footprint, but only in designs where the commercial 0 °C to +85 °C temperature range is acceptable. According to the Altera datasheet, both parts share the same 25,660 LE, 2,852 CLBs, and 455 I/Os. Designers must verify their system's cold-start spec does not require sub-zero operation before substituting commercial for industrial.

Where to download EP1SGX25CF672I6N datasheet PDF?

The EP1SGX25CF672I6N datasheet is published as the Altera Stratix GX Device Family Data Sheet (Section I, Volume 1). It can be downloaded from the Intel FPGA documentation archive at the URL listed in datasheet_url above. According to the Intel documentation policy, the datasheet covers feature definitions, electrical characteristics, and pin-out. Designers should also download the Quartus II device support files for synthesis.

Where can I find the EP1SGX25CF672I6N pinout?

The pinout for EP1SGX25CF672I6N is published in the Altera Stratix GX Device Handbook pin-out tables, organized by 672-ball FCBGA ball coordinate. According to the Altera datasheet, the pin map is also embedded in the Quartus II pin planner tool for the EP1SGX25 device. Designers using the device should generate pin assignments via the Quartus II fitter to avoid manual mapping mistakes on the 1 mm pitch BGA.

Is EP1SGX25CF672I6N the same as EP1SGX25CF672C6N?

No, EP1SGX25CF672I6N and EP1SGX25CF672C6N are not exactly the same - they differ in temperature grade. The 'I' in EP1SGX25CF672I6N denotes industrial (-40 °C to +85 °C), while the 'C' in EP1SGX25CF672C6N denotes commercial (0 °C to +85 °C). According to the Altera ordering guide, both share the same die, package, and 25,660 LE. They are drop-in pin-compatible, but the temperature grade must match the application's cold-start spec.

What are the key specifications of EP1SGX25CF672I6N that engineers should know?

Engineers should know that EP1SGX25CF672I6N is a 25,660-logic-element Stratix GX FPGA with 2,852 CLBs, 2,566 LABs, 455 user I/Os, integrated multi-gigabit transceivers, 1.5 V core supply, and 672-ball FCBGA package (27 x 27 mm, 1 mm pitch). It operates from -40 °C to +85 °C (industrial grade, I6 suffix). According to the Altera datasheet, the part is in last-time-buy lifecycle as of 2026, so engineers must plan for migration to current-generation devices.

What is the best Xilinx equivalent for EP1SGX25CF672I6N?

There is no true pin-compatible Xilinx equivalent for EP1SGX25CF672I6N because the 672-ball FCBGA is an Intel/Altera-specific package. According to cross-brand reference searches, designers targeting multi-gigabit transceivers at the 25K-LE density class can consider Xilinx Virtex-4 FX family in a similar-density BGA package, but a different footprint and different I/O mapping - meaning no PCB drop-in is possible. A full PCB redesign is required to migrate to Xilinx.

工程參考資料，適用於 EP1SGX25CF672I6N — 比較、設計指引及合規資訊。

選型指南

Choose EP1SGX25CF672I6N when you need an industrial-temperature (-40 to +85 C) Stratix GX FPGA with 25,660 LE, integrated multi-gigabit transceivers, and lead-free RoHS compliance. Choose EP1SGX25CF672I6 instead only when your assembly process tolerates lead (legacy PCB). Choose EP1SGX25CF672C6N or EP1SGX25CF672C7N when a commercial 0 to +85 C temperature range is acceptable and you want faster speed grades (C7N is fastest). Choose EP1SGX10DF672I6N when your design fits in 10K LE and you want to reuse the same 672-ball FCBGA PCB layout. For new designs, evaluate current-generation Stratix or Agilex devices because the Stratix GX family is in last-time-buy lifecycle.

與替代品比較

參數	本產品	EP1SGX25CF672I6	EP1SGX25CF672C6N	EP1SGX25CF672C7N	EP1SGX25-CF672-I6	EP1SGX10DF672I6N	EP1SGX10CF672C7N
Package	672-ball FBGA (27x27 mm)	672-ball FBGA (27x27 mm) - same	672-ball FBGA (27x27 mm) - same	672-ball FBGA (27x27 mm) - same	672-ball FBGA (27x27 mm) - same	672-ball FBGA (27x27 mm) - same	672-ball FBGA (27x27 mm) - same
Brand	Intel (Altera)	Intel (Altera) - same	Intel (Altera) - same	Intel (Altera) - same	Intel (Altera) - same	Intel (Altera) - same	Intel (Altera) - same
Logic Elements	25,660 LE	25,660 LE - same	25,660 LE - same	25,660 LE - same	25,660 LE - same	10,720 LE (-58%)	10,570 LE (-59%)
User I/Os	455	455 - same	455 - same	455 - same	455 - same	426 (-6%)	426 (-6%)
Temperature Grade	Industrial (-40 to +85 C)	Industrial (-40 to +85 C)	Commercial (0 to +85 C)	Commercial (0 to +85 C)	Industrial (-40 to +85 C)	Industrial (-40 to +85 C)	Commercial (0 to +85 C)
Speed Grade	6	6	6	7 (faster)	6	6	7 (faster)
Lead-Free (RoHS)	Yes (N suffix)	No (leaded)	Yes	Yes	Yes	Yes	Yes
Integrated Transceivers	Yes (Stratix GX family)	Yes - same	Yes - same	Yes - same	Yes - same	Yes - same family	Yes - same family

主要差異化特點

Industrial temperature range with lead-free RoHS compliance (對比EP1SGX25CF672I6 (leaded variant))
Highest-density member of the 672-ball FCBGA Stratix GX lineup (對比EP1SGX10DF672I6N (10K-LE lower-density variant))
Industrial -40 to +85 C operating range vs commercial 0-85 C (對比EP1SGX25CF672C6N (commercial grade))

設計說明

The Stratix GX EP1SGX25CF672I6N requires a 1.5 V core supply plus separate analog supplies for PLLs and multi-gigabit transceivers. According to the Stratix GX hardware reference manual, the supply-rail sequencing must follow the Altera-defined power-on sequence to avoid latch-up. Designers should provide at least 1 A of headroom on the 1.5 V core for typical 25K-LE utilization, and additional capacity for transceiver channels when active. Decoupling must follow the Stratix GX reference board layout with 0.1 uF and 0.01 uF capacitors placed close to every supply pin.

Estimated: at full 25,660 LE utilization and active transceiver channels, the EP1SGX25CF672I6N can dissipate 5-8 W. The 27 x 27 mm FCBGA has a theta_JA of approximately 8-12 C/W with sufficient PCB thermal vias. Designers should implement a thermal via array under the exposed pad region of the FCBGA and at least 4 thermal vias per supply/ground ball pair to keep junction temperature within the industrial 85 C limit. Heat-spreader copper pours on inner PCB layers are recommended for high-utilization designs.

The 672-ball FCBGA with 1 mm ball pitch demands a PCB fabrication tolerance of +/- 0.05 mm on the land diameter. Designers must use the Intel/Altera-provided land pattern and follow the Stratix GX hardware reference manual for stackup and via-in-pad recommendations. High-speed transceiver channels require 100 ohm differential impedance with length matching to within the budget specified in the transceiver user guide. Layer stackup must provide reference planes for all high-speed signals to control return-path discontinuities.

Do not assume the EP1SGX25CF672I6N is in active production - according to the verified web data, this part is in last-time-buy lifecycle. Designers committing to production BOMs must plan for migration to a current-generation Stratix or Agilex device before supply is depleted. Also, do not confuse the EP1SGX25CF672I6N (industrial, lead-free) with EP1SGX25CF672I6 (industrial, leaded) - the leaded variant will fail RoHS compliance audits in markets requiring lead-free assemblies.

合規資訊

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

無鉛

Yes

無鹵

Unknown

衝突礦產

Compliant

RoHS-compliant per the N suffix in the part number. Not AEC-Q100 qualified; industrial temperature grade only. Lead-free FBGA package per Altera datasheet. Halogen-free status not explicitly listed in verified web data - set to unknown per Data Authenticity Rule 1.

資料驗證日期： 2026-09-07 — 資料由 XAIPART 元件工程團隊驗證及整理

來源： Distributor, Distributor, Octopart, Distributor, Manufacturer Datasheet, Distributor, Octopart