MPC860DEZQ50D4 vs MC860ENCVR50D4R2 比較
詳細並排比較 MPC860DEZQ50D4 由 NXP Semiconductors 與 MC860ENCVR50D4R2 由 NXP. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MPC860DEZQ50D4 | MC860ENCVR50D4R2 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | NRND | Obsolete |
| Processor Type | MPC8xx PowerQUICC, 32-bit | — |
| Core Architecture | Power Architecture (embedded) | PowerPC 32-bit |
| Core Frequency | 50 MHz | — |
| Communications Processor Module | CPM with HDLC, Ethernet, PCMCIA, SCC | — |
| Ethernet MAC | 10/100 Mbps integrated | — |
| HDLC/SDLC Channels | Yes (multi-channel) | — |
| PCMCIA Interface | Yes | — |
| Supply Voltage (I/O) | 3.3 V | — |
| 封裝 | 357-Ball PBGA (25x25 mm) | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount, BGA |
| 工作溫度 | 0 C to +95 C | [DATA_NEEDED: Operating Temperature] |
| RoHS 狀態 | Contains Lead (legacy BGA) | RoHS compliant |
| Lead-Free Status | Contains Lead | — |
| Packaging | Tray | Digi-Reel / Tape and Reel |
| Sub-Brand Heritage | Freescale / NXP PowerQUICC | — |
| Processor Family | — | MPC8xx PowerQUICC |
| Core Count | — | 1 |
| 最大時脈頻率 | — | 50 MHz |
| 工作電源電壓 | — | 3.3 V |
| 封裝 / 外殼 | — | 357-BBGA (PBGA, 25 x 25 mm) |
| Pitch | — | 1.27 mm |
| Lead Free Status | — | Lead Free |
| Communications Module | — | CPM (SCC/SMC/UART/SPI) |
| JTAG / Debug Interface | — | Yes (BDM/JTAG) |
| Memory Controller | — | Integrated DRAM/SRAM/Flash + PCMCIA |
| Process Technology | — | 0.32 um CMOS |