5CSEBA4U19I7 vs 5CSEBA4U19A7N 对比

详细并排对比 5CSEBA4U19I7 出自 Intel 和 5CSEBA4U19A7N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 5CSEBA4U19I7 5CSEBA4U19A7N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $24.95 $99.90
Device Family Cyclone V SE SoC FPGA —
Logic Elements 40 K 40 K
Process Technology 28 nm TSMC low-power —
Core Voltage 1.1 V 1.1 V (typical)
HPS Core Dual-core ARM Cortex-A9 MPCore with CoreSight, NEON —
HPS Maximum Frequency 800 MHz —
FPGA Maximum Frequency 400 MHz —
DSP Blocks 156 (18x18 multipliers) —
Embedded Memory M10K blocks 3.4 Mbits (M9K)
封装 484-UBGA (U19), 19x19 mm, 1.0 mm pitch 484-UBGA (U19), 19x19 mm, 1.0 mm pitch
工作温度 -40C to +100C (industrial, I7 grade) —
HPS Peripherals EMAC, USB 2.0, SD/MMC, NAND, SPI, I2C, UART, I2S —
安装类型 Surface Mount (BGA) Surface Mount (BGA)
MSL 等级 [DATA_NEEDED: MSL level] 3 (168 hours)
RoHS 状态 Compliant Compliant
Family — Cyclone V SE SoC FPGA
Hard Processor System — Dual ARM Cortex-A9 MPCore with CoreSight
Adaptive Logic Modules — [DATA_NEEDED: ALM count]
DSP Blocks (18x18 Multipliers) — 224
PLLs — [DATA_NEEDED: PLL count]
HPS Maximum Application Clock — 925 MHz
Memory Interfaces — DDR3, DDR3L, LPDDR2 (via HPS); soft DDR3/2 in FPGA
User I/O — 161
工作结温 — -40C to +125C (automotive) / -40C to +100C (industrial)
Process Node — TSMC 28 nm low-power

数据手册与资源

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