5CSEBA4U19I7 vs 5CSEBA4U19A7N Comparison

Detailed side-by-side comparison of 5CSEBA4U19I7 by Intel and 5CSEBA4U19A7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 5CSEBA4U19I7 5CSEBA4U19A7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $24.95 $99.90
Device Family Cyclone V SE SoC FPGA —
Logic Elements 40 K 40 K
Process Technology 28 nm TSMC low-power —
Core Voltage 1.1 V 1.1 V (typical)
HPS Core Dual-core ARM Cortex-A9 MPCore with CoreSight, NEON —
HPS Maximum Frequency 800 MHz —
FPGA Maximum Frequency 400 MHz —
DSP Blocks 156 (18x18 multipliers) —
Embedded Memory M10K blocks 3.4 Mbits (M9K)
Package 484-UBGA (U19), 19x19 mm, 1.0 mm pitch 484-UBGA (U19), 19x19 mm, 1.0 mm pitch
Operating Temperature -40C to +100C (industrial, I7 grade) —
HPS Peripherals EMAC, USB 2.0, SD/MMC, NAND, SPI, I2C, UART, I2S —
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
MSL Level [DATA_NEEDED: MSL level] 3 (168 hours)
RoHS Status Compliant Compliant
Family — Cyclone V SE SoC FPGA
Hard Processor System — Dual ARM Cortex-A9 MPCore with CoreSight
Adaptive Logic Modules — [DATA_NEEDED: ALM count]
DSP Blocks (18x18 Multipliers) — 224
PLLs — [DATA_NEEDED: PLL count]
HPS Maximum Application Clock — 925 MHz
Memory Interfaces — DDR3, DDR3L, LPDDR2 (via HPS); soft DDR3/2 in FPGA
User I/O — 161
Operating Junction Temperature — -40C to +125C (automotive) / -40C to +100C (industrial)
Process Node — TSMC 28 nm low-power

Datasheets & Resources

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