K4A4G085WG-BCWE vs K4A4G085WD-BCRC 对比
详细并排对比 K4A4G085WG-BCWE 出自 Samsung Electronics 和 K4A4G085WD-BCRC 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | K4A4G085WG-BCWE | K4A4G085WD-BCRC |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $2.68 | $3.58 |
| 存储器类型 | DDR4 SDRAM (Volatile) | DDR4 SDRAM (D-die) |
| 存储容量 | 4 Gb | — |
| Memory Organization | 512M x 8 | — |
| 数据速率 | 3200 Mbps/pin | 2400 Mb/s (PC2400) |
| Speed Class | DDR4-3200 | — |
| Supply Voltage (VDD) | 1.2 V | — |
| Technology | D-die DDR4 | — |
| 封装 | FBGA-78 (BCW) | FBGA-78 (TFBGA) |
| 安装类型 | Surface Mount | Surface Mount |
| 接口 | Parallel (DDR4) | Parallel |
| Burst Length | BL8 | — |
| DLL Mode | DLL Enabled (per datasheet timing) | — |
| 工作温度 | [DATA_NEEDED: operating temperature range] | — |
| Refresh | [DATA_NEEDED: refresh rate specification] | [DATA_NEEDED: Refresh specification] |
| RoHS 状态 | Compliant | [DATA_NEEDED: RoHS Status] |
| Packaging | Tray | — |
| Memory Density | — | 4 Gbit |
| 存储组织 | — | 512M x 8 |
| 电源电压 | — | 1.2 V |
| Number of Terminals | — | 78 |
| Access Mode | — | Multi-bank page burst |
| CAS 延迟 | — | [DATA_NEEDED: CAS Latency] |
| 工作温度范围 | — | [DATA_NEEDED: Operating Temperature Range] |
| MSL 等级 | — | [DATA_NEEDED: MSL Level] |