K4A4G165WD-BCTD vs H5AN4G6NBJR-UHC 对比

详细并排对比 K4A4G165WD-BCTD 出自 Samsung Electronics 和 H5AN4G6NBJR-UHC 出自 SK hynix。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Samsung Electronics
K4A4G165WD-BCTD K4A4G165WD-BCTD - 4Gb DDR4 SDRAM x16 2666Mbps | Samsung

K4A4G165WD-BCTD - 4Gb DDR4 SDRAM x16 2666Mbps | Samsung

K4A4G165WD-BCTD ✓ 量产中
SK hynix
H5AN4G6NBJR-UHC H5AN4G6NBJR-UHC - 4Gb DDR4 SDRAM 256Mx16 FBGA-96 | SK Hynix

H5AN4G6NBJR-UHC - 4Gb DDR4 SDRAM 256Mx16 FBGA-96 | SK Hynix

H5AN4G6NBJR-UHC ✓ 量产中

规格对比

参数 K4A4G165WD-BCTD H5AN4G6NBJR-UHC
品牌 Samsung Electronics SK hynix
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $19.00 $8.09
存储器类型 DDR4 SDRAM DDR4 SDRAM
Density 4 Gbit —
存储组织 256M x 16 256M x 16
数据速率 2666 Mbps/pin (-BCTD speed grade) —
Supply Voltage (VDD) 1.2 V 1.14 V to 1.26 V
Core Supply (VPP) 2.5 V —
接口 SSTL-12 —
Data Mask Yes (DM per byte lane) —
Bank Architecture 16 banks / 4 bank groups —
封装 96-ball FBGA FBGA-96 (PBGA-96)
安装类型 Surface Mount (BGA) Surface Mount
工作温度 0C to +85C (commercial) -40C to +95C
On-Die Termination Dynamic ODT Dynamic ODT
ZQ Calibration Yes (external RZQ resistor) Yes
CRC / CA Parity CRC read/write support —
Reset Asynchronous reset (RESET_n) —
RoHS 状态 [DATA_NEEDED: RoHS status] Compliant
存储容量 — 4 Gbit
Clock Frequency — 1.6 GHz
Technology — CMOS
Self Refresh — Auto self-refresh
Data Mask Function — Yes (DM)
Asynchronous Reset — Yes (RESET_n)
Write Leveling — Yes
CRC Function — Yes (command/address CRC)

数据手册与资源

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