MT40A256M16GE-083E vs H5AN4G6NBJR-UHC 对比

详细并排对比 MT40A256M16GE-083E 出自 Micron Technology 和 H5AN4G6NBJR-UHC 出自 SK hynix。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Micron Technology
MT40A256M16GE-083E MT40A256M16GE-083E - DDR4 4Gb 256Mx16 2400MHz DRAM | Micron

MT40A256M16GE-083E - DDR4 4Gb 256Mx16 2400MHz DRAM | Micron

MT40A256M16GE-083E ✗ 停产
SK hynix
H5AN4G6NBJR-UHC H5AN4G6NBJR-UHC - 4Gb DDR4 SDRAM 256Mx16 FBGA-96 | SK Hynix

H5AN4G6NBJR-UHC - 4Gb DDR4 SDRAM 256Mx16 FBGA-96 | SK Hynix

H5AN4G6NBJR-UHC ✓ 量产中

规格对比

参数 MT40A256M16GE-083E H5AN4G6NBJR-UHC
品牌 Micron Technology SK hynix
分类 Memory ICs Memory ICs
生命周期状态 停产 有效
库存状态 有库存 有库存
单价(USD) $2.20 $8.09
存储器类型 DDR4 SDRAM DDR4 SDRAM
Density 4 Gbit —
存储组织 256M x 16 256M x 16
Clock Frequency 1200 MHz (DDR4-2400) 1.6 GHz
电源电压 1.2 V —
封装 96-ball FBGA, 9 x 14 mm FBGA-96 (PBGA-96)
安装类型 Surface Mount Surface Mount
接口 Parallel —
Technology CMOS DRAM CMOS
ECCN EAR99 —
Country of Origin China —
无卤 Compliant —
Lead Free Yes —
Introduction Date August 2017 —
Lifecycle Obsolete / End of Life (per distributor cross-reference data) —
工作温度 [DATA_NEEDED: operating temperature range] -40C to +95C
CAS 延迟 [DATA_NEEDED: CAS latency at DDR4-2400] —
Refresh [DATA_NEEDED: refresh rate] —
存储容量 — 4 Gbit
Supply Voltage (VDD) — 1.14 V to 1.26 V
Self Refresh — Auto self-refresh
Data Mask Function — Yes (DM)
Asynchronous Reset — Yes (RESET_n)
On-Die Termination — Dynamic ODT
ZQ Calibration — Yes
Write Leveling — Yes
CRC Function — Yes (command/address CRC)
RoHS 状态 — Compliant

数据手册与资源

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