10AS057K2F35E2SG - Arria 10 SX SoC FPGA 570K LE | Intel
料号： 10AS057K2F35E2SG ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $3811.48 | $3,811.48 |
| 10 | $3420.32 | $34,203.20 |
| 100 | $2918.94 | $291,894.00 |
| 500 | $2562.1 | $1,281,050.00 |
| 1,000 | $2304.55 | $2,304,550.00 |
10AS057K2F35E2SG 概述
An SoC FPGA is a single-chip device that fuses a general-purpose CPU subsystem with programmable logic on the same die, eliminating the latency, power, and board-space cost of a discrete CPU + FPGA pair. The Arria 10 SX line is Intel's mid-range 20 nm SoC FPGA family, sitting between the lower-density Cyclone/Cyclone V SoCs and the high-end Stratix 10 SoCs. The 10AS057K2F35E2SG variant is the F35-package, E2 (mid-tier) speed grade, and lead-free / RoHS build with 570K logic elements.
Key features include 570K logic elements, ~22.4 Mbits of embedded M20K memory, 1568 18x19 multipliers, 24 transceivers at up to 17.4 Gbps (GX/SX), hard PCIe Gen2/Gen3 IP blocks, and the HPS dual-core ARM Cortex-A9 MPCore subsystem with peripherals such as Gigabit Ethernet, USB, NAND, SD/MMC, and DDR3/DDR4 controllers. The integrated CoreSight debug and trace fabric allows non-intrusive multi-core debug. The F35 1152-FCBGA package provides the highest I/O count in the Arria 10 family with 396 user I/O and 24 transceiver channels.
This part suits 5G baseband pre-processing, radar/EW front-end DSP, ASIC prototyping, broadcast video processing, and high-performance industrial motion controllers. The mid-density 570K LE tier positions it between the 10AS048 (~480K LE) and 10AS066 (~660K LE) siblings.
This page consolidates distributor pricing, lead-time data, and drop-in variant guidance not bundled in the official datasheet. The E2 speed grade typically offers 30-40% logic timing margin over E3 at the cost of Fmax, while the F35 35x35 FCBGA is the largest Arria 10 package and requires high-layer-count PCB with microvia stack-ups.
直接替换替代料： 10AS057K2F35E2SG ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10AS057K2F35E2SG （相同外形与封装尺寸） ——差异在于 Speed Grade, Package, Mounting Type, RoHS Status, Operating Temperature.
快速对比工具——选择替代料号进行并排对比：
10AS057K2F35E1SG
✅ 直接替换📋 参考替代料（不在目录中）
10AS057K2F35E2LG
✅ 直接替换✓ 有现货
$3450 / 个
查看数据手册 →10AS057K2F35I1HG
✅ 直接替换✓ 有现货
$3820 / 个
查看数据手册 →10AS057H4F34E3LG
✅ 直接替换✓ 有现货
$1820 / 个
查看数据手册 →10AS066K2F35E2SG
✅ 直接替换✓ 有现货
$2890 / 个
查看数据手册 →10AS057K2F35E2SG 最大额定值与电气特性
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 570,000 |
| DSP Blocks (18x19 Multipliers) | 1,568 |
| HPS Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Max Frequency | 1.5 GHz |
| Maximum User I/O | 396 |
| Transceiver Count (GX/SX) | 24 |
| Transceiver Max Data Rate | 17.4 Gbps |
| Hard PCIe Blocks | Gen2/Gen3 x4/x8 IP |
| 封装 | 1152-FBGA, FC (35x35 mm) |
| Speed Grade | E2 (mid-tier) |
| Process Node | 20 nm (TSMC) |
| 安装类型 | Surface Mount (FCBGA) |
| RoHS 状态 | Compliant (lead-free) |
10AS057K2F35E2SG 1152-fbga, fc (35x35 mm) 引脚配置指南
10AS057K2F35E2SG（1152-fbga, fc (35x35 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 10AS057K2F35E2SG.
请参阅 数据手册 以查看完整引脚配置。
典型应用
10AS057K2F35E2SG 适用于 6 应用s: 5G Baseband Pre-Processing, Radar and Electronic Warfare DSP, ASIC Prototyping, Broadcast Video Processing, Industrial Motion Controllers, Test and Measurement Instrumentation.
5G Baseband Pre-Processing
The 10AS057K2F35E2SG fits 5G baseband pre-processing because its 24 transceivers at 17.4 Gbps provide enough serial bandwidth for CPRI/eCPRI links, and its 570K logic elements sustain the parallel DSP required for crest-factor reduction, digital predistortion, and front-haul packetization. The 1.5 GHz dual ARM Cortex-A9 HPS runs the MAC scheduler and OAM stack while the FPGA fabric handles PHY-layer functions in deterministic latency. Industrial temperature variants (-40C to +100C) suit outdoor radio units and base-station chassis without active cooling.
推荐
Radar and Electronic Warfare DSP
The 10AS057K2F35E2SG is well suited to radar and electronic-warfare DSP because its 1,568 hardened 18x19 multipliers execute FFTs, pulse compression, and beamforming kernels with predictable latency. Twenty-four 17.4 Gbps transceivers ingest multi-channel ADC streams directly into the FPGA fabric without external SERDES, simplifying receiver board design. The integrated ARM Cortex-A9 HPS runs the threat library and tracker, eliminating the need for a separate signal-processor card in size-constrained EW pods.
推荐
ASIC Prototyping
The 10AS057K2F35E2SG is a workhorse ASIC prototyping platform because 570K logic elements plus the 1.5 GHz Cortex-A9 HPS lets engineers emulate complete SoC subsystems on a single device. The F35 1152-FCBGA exposes enough user I/O to break out hundreds of prototype signals, and Intel's Quartus Prime design flows support automatic partitioning of large ASIC RTL into multi-FPGA emulation boards. Industrial temperature variants support validation in environmental chambers for aerospace and automotive ASIC qualification.
推荐
Broadcast Video Processing
The 10AS057K2F35E2SG fits broadcast video processing because 570K logic elements and the integrated HPS handle multi-stream SDI routing, HEVC/H.264 encode/decode assist, and on-screen graphics compositing on a single device. The Cortex-A9 cores run a Linux-based control plane for IP video streaming, while the FPGA fabric maintains deterministic pixel pipelines. Industrial temperature variants support outdoor broadcast head-end equipment where ambient temperatures swing widely.
推荐
Industrial Motion Controllers
The 10AS057K2F35E2SG suits high-axis-count industrial motion controllers because 1,568 DSP blocks execute multi-axis PID loops, S-curve profiles, and vibration-suppression filters in hardware with sub-microsecond latency. Twenty-four transceivers drive distributed EtherCAT, Profinet IRT, or SERCOS III master links, and the Cortex-A9 HPS hosts a real-time Linux or VxWorks control stack. The F35 1152-FCBGA package supplies enough GPIO for encoder, limit-switch, and safety I/O across 16+ axes.
推荐
Test and Measurement Instrumentation
The 10AS057K2F35E2SG fits high-end test and measurement instruments because the dual ARM Cortex-A9 HPS runs a Linux-based instrument control stack while the FPGA fabric executes real-time signal acquisition, DSP, and protocol-decoding functions. Twenty-four 17.4 Gbps transceivers handle multi-lane PCIe Gen3 host connectivity and high-speed serial instrument ports. The 570K logic-element capacity integrates waveform synthesis, FFT analysis, and trigger logic into one device, simplifying thermal management in benchtop or rack-mount form factors.
推荐
推荐产品汇总
工程参考数据： 10AS057K2F35E2SG ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10AS057K2F35E1SG | 10AS057K2F35E2LG | 10AS057K2F35I1HG | 10AS057H4F34E3LG | 10AS066K2F35E2SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA, FC (35x35) | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x34) - same BGA family | 1152-FBGA, FC (35x35) - same |
| Logic Elements | 570K | 570K (same) | 570K (same) | 570K (same) | 570K (same) | 660K (+16%) |
| Speed Grade | E2 (mid-tier) | E1 (fastest) | E2 (same) | I1 (industrial) | E3 (slowest) | E2 (same) |
| Temperature Grade | Commercial (E2) | Commercial | Commercial | Industrial (-40C to +100C) | Commercial | Commercial |
| HPS Core | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz |
| Transceivers | 24 @ up to 17.4 Gbps | 24 @ up to 17.4 Gbps | 24 @ up to 17.4 Gbps | 24 @ up to 17.4 Gbps | 24 @ up to 17.4 Gbps | 24 @ up to 17.4 Gbps |
关键差异点
- Mid-density sweet spot in Arria 10 SX family （对比 10AS048K2F35E2SG (480K LE))
- F35 1152-FCBGA delivers full 396 user I/O plus 24 transceivers （对比 10AS057K3F40E2SG (F40 package))
- E2 speed grade offers balanced power-vs-performance （对比 10AS057K2F35E1SG (E1 fastest))
- Integrated dual ARM Cortex-A9 HPS eliminates discrete CPU （对比 10AS057N2F35E2SG (non-SoC Arria 10 GX variant))
设计说明
The F35 1152-FCBGA package has a 1.0 mm ball pitch and 35x35 mm body. Estimated: with a 1.0 mm pitch BGA on standard high-Tg FR-4, a 1+N+1 PCB stack-up with laser-drilled microvias is mandatory for the inner-row escape. Plan at least 8 PCB layers (4 routing + 2 GND + 2 PWR) to fan out the HPS dedicated pins (DDR3, Gigabit Ethernet, USB, NAND/SD) and the 24 transceiver channels without crosstalk above the Gen3 mask. Solid stitched ground pours under the BGA field are required for transceiver return paths.
Estimated: at full FPGA utilization (~85% logic toggle rate) plus active HPS, the 10AS057K2F35E2SG dissipates 12-18 W. The F35 package has a published theta_JA in the 8-12 C/W range (board-dependent), so junction-to-ambient delta is approximately 100-150 C above ambient with only the PCB. A heat-spreader or small heatsink with 200-300 LFM airflow is required to keep Tj below 100C for long-term reliability; in industrial temperature builds, design to ambient 85C with a 1.5x thermal margin.
Use Intel's PowerPlay Early Power Estimator (EPE) for the Arria 10 family to budget rails before PCB layout. The 10AS057K2F35E2SG requires at least 5 separate supplies (0.9 V core, 1.1 V HPS, 1.5/1.8 V transceiver, 1.8/2.5/3.3 V I/O, and HPS reference). Estimated: a 25 A 0.9 V DC-DC buck with 1% ripple is typical for the core rail; decoupling follows Intel's pin-decoupling spreadsheet, which calls for 0402/0201 capacitors inside the BGA field plus bulk capacitors on the underside.
Do not assume a 570K Arria 10 SX bitstream runs on a 660K (10AS066) device without recompiling - density IDs are encoded in the bitstream. Conversely, when migrating from a 480K (10AS048) to this 570K device, only the bitstream needs to be regenerated; the F35 PCB layout is identical. Avoid mixing E2 and E3 speed-grade parts in the same multi-FPGA design: timing closure on E3 will not match E2 margin and downstream debug becomes opaque.
The 24 transceiver channels at 17.4 Gbps require length-matched differential pairs within 150 um and a continuous reference ground plane under each lane. Use Intel's Arria 10 Transceiver Signal Integrity Kit as the starting point for via geometry and stack-up. Estimated: the HPS DDR3/4 interface needs write-leveling and read-DQ centering, with all address/command traces routed on inner stripline layers and 0.1 uF decoupling on every other byte lane.
合规信息
Lead-free and halogen-free build per Altera ordering information; RoHS compliant. AEC-Q100 not applicable for this FPGA family - contact Intel automotive business unit for AEC-qualified variants if required.
