EP1SGX25FF1020 - Stratix GX FPGA 25K LE FCBGA-1020 | Altera
料号： EP1SGX25FF1020 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $425 | $4,250.00 |
| 100 | $380 | $38,000.00 |
| 500 | $335 | $167,500.00 |
| 1,000 | $295 | $295,000.00 |
EP1SGX25FF1020 概述
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, interconnect, and I/O can be customized after manufacture using HDL (Hardware Description Language) bitstreams. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), alongside CPLDs, and are distinct from ASICs (which are fixed at fabrication). Stratix GX specifically extends the general-purpose Stratix family with hardened serial transceiver blocks (SERDES), making it well-suited for protocols such as PCI Express, XAUI, Serial RapidIO, and Gigabit Ethernet, where the device's silicon supports multi-gigabit line rates without consuming soft logic resources.
Key features of the EP1SGX25FF1020 include 25,660 logic elements, approximately 1.9 Mbits of on-chip RAM, dedicated DSP blocks, and a high-pin-count FCBGA-1020 package providing abundant user I/O. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, and includes embedded multiplier blocks for DSP. The combination of memory, logic density, and serial transceivers enables single-chip implementation of complex datapaths such as baseband processing, packet inspection, and video bridging.
Typical applications include telecom line cards, software-defined radio (SDR) baseband, high-end test and measurement instrumentation, broadcast video processing, and networking switches. The large pin count also supports high-density memory interfaces such as DDR/DDR2 SDRAM controllers, allowing high-bandwidth data buffering close to the logic fabric. Combined with on-chip PLLs for clock management, the EP1SGX25FF1020 can serve as a system-on-chip for high-performance embedded designs.
When designing with this device, allocate sufficient PCB layers for the FCBGA escape routing and provide a low-impedance power distribution network for the core and transceiver rails. Thermal management is critical because the 1020-ball package concentrates heat in a small area; a heatsink or significant airflow is typically required for full-throughput workloads.
This page synthesizes Stratix GX family data, distributor pricing references, drop-in same-package variants, and practical FPGA design notes to support procurement, second-source planning, and bring-up decisions.
直接替换替代料： EP1SGX25FF1020 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP1SGX25FF1020 （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Speed Grade, Mounting Type, Process Technology.
快速对比工具——选择替代料号进行并排对比：
EP1SGX25FF1020C6N
✅ 直接替换✓ 有现货
$160 / 个
查看数据手册 →EP1SGX25FF1020C7
✅ 直接替换✓ 有现货
$1280 / 个
查看数据手册 →EP1SGX25FF1020I5ES
✅ 直接替换📋 参考替代料（不在目录中）
EP1SGX25FF1020C6ES
✅ 直接替换✓ 有现货
$192.4 / 个
查看数据手册 →EP1SGX25FF1020C5N
✅ 直接替换✓ 有现货
$1580 / 个
查看数据手册 →EP1SGX25FF1020 最大额定值与电气特性
| Family | Stratix GX |
| Logic Elements (LE) | 25,660 |
| Configurable Logic Blocks (CLB) | 2,566 |
| Embedded Memory (bits) | 1,944,576 |
| Process Technology | 130 nm CMOS |
| Logic Cells (per FPGAkey) | 25,660 |
| Combinatorial Delay (Tpd) | 7.49 ns (per Microchip USA datasheet summary) |
| 封装 | 1020-ball FCBGA (PBGA, 1.00 mm pitch) |
| Pin/Package Count | 1020 |
| 安装类型 | Surface Mount (BGA) |
| 工作温度 | -40C to +85C (industrial variant) / 0C to +85C (commercial variant) |
| Serial Transceivers | Embedded SERDES (multi-gigabit, protocol-dependent) |
| DSP Blocks | Embedded dedicated multipliers |
| PLL / Clock Management | Embedded PLLs |
| Configuration Method | SRAM-based, configuration via JTAG / passive serial / fast passive parallel |
EP1SGX25FF1020 1020 引脚配置指南
EP1SGX25FF1020（1020 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP1SGX25FF1020.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP1SGX25FF1020 适用于 7 应用s: Telecom Line Cards, Software Defined Radio (SDR) Baseband, High-End Test and Measurement Instrumentation, Broadcast Video Processing, Networking Switches and Routers, Industrial Control and Factory Automation, Medical Imaging Systems.
Telecom Line Cards
The EP1SGX25FF1020 fits telecom line-card designs because its 25,660 logic elements and 1.9 Mbits of embedded RAM support packet-classification and traffic-management pipelines without external buffering. The Stratix GX embedded SERDES delivers multi-gigabit line rates for backplane links, while the FCBGA-1020 provides the high pin count required to interface with multiple SFP/QSFP cages simultaneously. Placed on a 6-layer PCB with dedicated core/transceiver power planes, it handles framer/mapper functions at line rate with margin for future protocol updates.
推荐
Software Defined Radio (SDR) Baseband
The EP1SGX25FF1020 is well matched to SDR baseband processing, where its embedded DSP multiplier blocks accelerate FIR filters and FFT cores while the large logic element count supports soft-core CPUs and channelizers. The Stratix GX transceivers accept ADC/DAC sample streams at multi-gigabit rates, and the 1.9 Mbits of embedded RAM buffer symbol-rate data on-chip. Use the on-chip PLLs to derive baseband clocks from a single reference, and route LVDS pairs to external data converters for a single-chip baseband solution.
推荐
High-End Test and Measurement Instrumentation
For oscilloscopes, logic analyzers, and protocol testers, the EP1SGX25FF1020's combination of 25,660 logic elements, 1.9 Mbits of embedded RAM, and multi-gigabit SERDES enables real-time signal capture, deep trace buffering, and high-speed host interfaces. The 1020-ball FCBGA allows direct connection to high-bandwidth ADC front-ends and DDR2 SDRAM buffers. On-chip PLLs generate the multiple clock domains required by the acquisition, processing, and display subsystems, simplifying system timing architecture.
推荐
Broadcast Video Processing
The EP1SGX25FF1020 supports broadcast video processing tasks such as format conversion, scaling, and overlay composition. Its embedded memory (1.9 Mbits) holds multiple video line buffers, and the 25,660 logic elements implement multi-tap polyphase scaling and deinterlacing filters in real time. The FCBGA-1020's high user-I/O count directly interfaces to HDMI, SDI, and DisplayPort serializers at 1080p60 and beyond. Combined with the Stratix GX SERDES, the same chip can drive SDI outputs while ingesting HDMI streams from multiple sources.
推荐
Networking Switches and Routers
In enterprise and carrier-grade networking switches, the EP1SGX25FF1020 functions as the central packet-processing engine. The 25,660 logic elements run multi-table lookup pipelines, while the embedded memory buffers packet headers and routing tables without external SSRAM. Multi-gigabit SERDES provide 10 GbE uplinks directly, and the 1020-ball FCBGA supports parallel connections to TCAMs and external DRAM for deep queue management. The device's PLLs lock onto recovered line clocks for synchronized switching fabric operation.
推荐
Industrial Control and Factory Automation
The EP1SGX25FF1020 suits industrial control platforms that combine high-speed deterministic control loops with multi-protocol communication. The 25,660 logic elements implement IEC 61131-3 logic, motion-control algorithms, and safety functions in parallel with protocol stacks such as EtherCAT, PROFINET, and SERCOS. Embedded memory buffers sensor data, while the Stratix GX SERDES handle fieldbus uplinks. The 1020-ball FCBGA's high user-I/O count interfaces to multiple encoder, sensor, and actuator channels directly, reducing external glue logic.
推荐
Medical Imaging Systems
The EP1SGX25FF1020 supports medical imaging modalities such as ultrasound beamforming and MRI reconstruction. Its embedded DSP multiplier blocks accelerate FIR beamforming and FFT pipelines in real time, and the 1.9 Mbits of embedded RAM buffers channel data close to the processing elements. The 1020-ball FCBGA provides the high pin count required to interface with multi-channel ADC front-ends and high-resolution display outputs. Multi-gigabit transceivers stream pre-beamformed RF data to host systems, enabling flexible probe configurations.
推荐
推荐产品汇总
工程参考数据： EP1SGX25FF1020 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP1SGX25FF1020C6N | EP1SGX25FF1020C7 | EP1SGX25FF1020I5ES | EP1SGX25FF1020C6ES | EP1SGX25FF1020C5N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | FCBGA-1020 (1.00 mm pitch) | FCBGA-1020 (1.00 mm pitch) - same | FCBGA-1020 (1.00 mm pitch) - same | FCBGA-1020 (1.00 mm pitch) - same | FCBGA-1020 (1.00 mm pitch) - same | FCBGA-1020 (1.00 mm pitch) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Embedded Memory (bits) | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Speed Grade | FF (unspecified bin) | C6 (commercial) | C7 (commercial, fastest bin) | I5 (industrial) | C6 (commercial, ES) | C5 (commercial, slowest bin) |
| Family | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX |
| Process / Pin Pitch | 130 nm / 1.00 mm | 130 nm / 1.00 mm | 130 nm / 1.00 mm | 130 nm / 1.00 mm | 130 nm / 1.00 mm | 130 nm / 1.00 mm |
关键差异点
- Standard speed-bin cost optimization （对比 EP1SGX25FF1020C7)
- Industrial temperature screening option （对比 EP1SGX25FF1020C6N)
- Drop-in same-package second source within Stratix GX family （对比 EP1S60F1020C7)
设计说明
The 1020-ball FCBGA at 1.00 mm pitch requires a minimum 6-layer PCB stack-up: assign dedicated layers for core VCC, transceiver supply, ground reference, and signal routing. Escape routing must use micro-vias or via-in-pad for inner rows; place 0.1 uF decoupling capacitors directly beneath the BGA on the opposite side to minimize loop inductance. A continuous copper pour on the opposite PCB side must be stitched to ground for thermal dissipation.
Estimated: at typical Stratix GX utilization (70 percent logic, 50 percent RAM, all SERDES active), the FCBGA-1020 dissipates roughly 5-8 W. The 1.00 mm pitch package concentrates heat in the center; design for a minimum of 150 LFPM airflow or attach a low-profile heatsink with thermal interface material. Monitor junction temperature during bring-up using the device's on-chip thermal diode routed to a separate temperature-sensing circuit.
Do not confuse the EP1SGX25FF1020 (Stratix GX family with SERDES) with the EP1S25F1020C6 (Stratix family without SERDES); both share the 1020-ball FCBGA outline but have different ball maps. Always verify the exact ball-map against the Altera Stratix GX Device Family Data Sheet pin tables before PCB fabrication. Mixing the two will result in non-functional boards and rework costs.
Match the length of each SERDES differential pair within the tolerance specified by the target protocol (typically 5 mil for 3.125 Gbps signals). Route SERDES pairs on the top layer directly above an uninterrupted ground plane to maintain 100 ohm differential impedance. Keep the SERDES power supply isolated from the digital core supply; place ferrite beads and bulk decoupling to minimize switching-noise coupling into the receiver front-end.
合规信息
Compliance data not present in verified web data. Stratix GX FPGAs are typically lead-free; RoHS and REACH status must be verified per individual lot via the supplier's certificate of conformance.
