EP1SGX25FF1020 - Stratix GX FPGA 25K LE FCBGA-1020 | Altera
MPN: EP1SGX25FF1020 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $425 | $4,250.00 |
| 100 | $380 | $38,000.00 |
| 500 | $335 | $167,500.00 |
| 1,000 | $295 | $295,000.00 |
Drop-in alternatives for EP1SGX25FF1020 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1SGX25FF1020C6N
✅ Drop-In✓ In Stock
$160 / Unit
View Datasheet →EP1SGX25FF1020C7
✅ Drop-In✓ In Stock
$1280 / Unit
View Datasheet →EP1SGX25FF1020I5ES
✅ Drop-In📋 Reference alternative (not in catalog)
EP1SGX25FF1020C6ES
✅ Drop-In✓ In Stock
$192.4 / Unit
View Datasheet →EP1SGX25FF1020C5N
✅ Drop-In✓ In Stock
$1580 / Unit
View Datasheet →EP1SGX25FF1020 Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements (LE) | 25,660 |
| Configurable Logic Blocks (CLB) | 2,566 |
| Embedded Memory (bits) | 1,944,576 |
| Process Technology | 130 nm CMOS |
| Logic Cells (per FPGAkey) | 25,660 |
| Combinatorial Delay (Tpd) | 7.49 ns (per Microchip USA datasheet summary) |
| Package | 1020-ball FCBGA (PBGA, 1.00 mm pitch) |
| Pin/Package Count | 1020 |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | -40C to +85C (industrial variant) / 0C to +85C (commercial variant) |
| Serial Transceivers | Embedded SERDES (multi-gigabit, protocol-dependent) |
| DSP Blocks | Embedded dedicated multipliers |
| PLL / Clock Management | Embedded PLLs |
| Configuration Method | SRAM-based, configuration via JTAG / passive serial / fast passive parallel |
EP1SGX25FF1020 1020 Pin Configuration Guide
Complete pinout information for EP1SGX25FF1020 (1020 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25FF1020.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25FF1020 is suitable for 7 applications: Telecom Line Cards, Software Defined Radio (SDR) Baseband, High-End Test and Measurement Instrumentation, Broadcast Video Processing, Networking Switches and Routers, Industrial Control and Factory Automation, Medical Imaging Systems.
Telecom Line Cards
The EP1SGX25FF1020 fits telecom line-card designs because its 25,660 logic elements and 1.9 Mbits of embedded RAM support packet-classification and traffic-management pipelines without external buffering. The Stratix GX embedded SERDES delivers multi-gigabit line rates for backplane links, while the FCBGA-1020 provides the high pin count required to interface with multiple SFP/QSFP cages simultaneously. Placed on a 6-layer PCB with dedicated core/transceiver power planes, it handles framer/mapper functions at line rate with margin for future protocol updates.
Recommended
Software Defined Radio (SDR) Baseband
The EP1SGX25FF1020 is well matched to SDR baseband processing, where its embedded DSP multiplier blocks accelerate FIR filters and FFT cores while the large logic element count supports soft-core CPUs and channelizers. The Stratix GX transceivers accept ADC/DAC sample streams at multi-gigabit rates, and the 1.9 Mbits of embedded RAM buffer symbol-rate data on-chip. Use the on-chip PLLs to derive baseband clocks from a single reference, and route LVDS pairs to external data converters for a single-chip baseband solution.
Recommended
High-End Test and Measurement Instrumentation
For oscilloscopes, logic analyzers, and protocol testers, the EP1SGX25FF1020's combination of 25,660 logic elements, 1.9 Mbits of embedded RAM, and multi-gigabit SERDES enables real-time signal capture, deep trace buffering, and high-speed host interfaces. The 1020-ball FCBGA allows direct connection to high-bandwidth ADC front-ends and DDR2 SDRAM buffers. On-chip PLLs generate the multiple clock domains required by the acquisition, processing, and display subsystems, simplifying system timing architecture.
Recommended
Broadcast Video Processing
The EP1SGX25FF1020 supports broadcast video processing tasks such as format conversion, scaling, and overlay composition. Its embedded memory (1.9 Mbits) holds multiple video line buffers, and the 25,660 logic elements implement multi-tap polyphase scaling and deinterlacing filters in real time. The FCBGA-1020's high user-I/O count directly interfaces to HDMI, SDI, and DisplayPort serializers at 1080p60 and beyond. Combined with the Stratix GX SERDES, the same chip can drive SDI outputs while ingesting HDMI streams from multiple sources.
Recommended
Networking Switches and Routers
In enterprise and carrier-grade networking switches, the EP1SGX25FF1020 functions as the central packet-processing engine. The 25,660 logic elements run multi-table lookup pipelines, while the embedded memory buffers packet headers and routing tables without external SSRAM. Multi-gigabit SERDES provide 10 GbE uplinks directly, and the 1020-ball FCBGA supports parallel connections to TCAMs and external DRAM for deep queue management. The device's PLLs lock onto recovered line clocks for synchronized switching fabric operation.
Recommended
Industrial Control and Factory Automation
The EP1SGX25FF1020 suits industrial control platforms that combine high-speed deterministic control loops with multi-protocol communication. The 25,660 logic elements implement IEC 61131-3 logic, motion-control algorithms, and safety functions in parallel with protocol stacks such as EtherCAT, PROFINET, and SERCOS. Embedded memory buffers sensor data, while the Stratix GX SERDES handle fieldbus uplinks. The 1020-ball FCBGA's high user-I/O count interfaces to multiple encoder, sensor, and actuator channels directly, reducing external glue logic.
Recommended
Medical Imaging Systems
The EP1SGX25FF1020 supports medical imaging modalities such as ultrasound beamforming and MRI reconstruction. Its embedded DSP multiplier blocks accelerate FIR beamforming and FFT pipelines in real time, and the 1.9 Mbits of embedded RAM buffers channel data close to the processing elements. The 1020-ball FCBGA provides the high pin count required to interface with multi-channel ADC front-ends and high-resolution display outputs. Multi-gigabit transceivers stream pre-beamformed RF data to host systems, enabling flexible probe configurations.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25FF1020 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25FF1020C6N | EP1SGX25FF1020C7 | EP1SGX25FF1020I5ES | EP1SGX25FF1020C6ES | EP1SGX25FF1020C5N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | FCBGA-1020 (1.00 mm pitch) | FCBGA-1020 (1.00 mm pitch) - same | FCBGA-1020 (1.00 mm pitch) - same | FCBGA-1020 (1.00 mm pitch) - same | FCBGA-1020 (1.00 mm pitch) - same | FCBGA-1020 (1.00 mm pitch) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Embedded Memory (bits) | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Speed Grade | FF (unspecified bin) | C6 (commercial) | C7 (commercial, fastest bin) | I5 (industrial) | C6 (commercial, ES) | C5 (commercial, slowest bin) |
| Temperature Grade | [DATA_NEEDED: temp grade] | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Family | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX |
| Process / Pin Pitch | 130 nm / 1.00 mm | 130 nm / 1.00 mm | 130 nm / 1.00 mm | 130 nm / 1.00 mm | 130 nm / 1.00 mm | 130 nm / 1.00 mm |
Key Differentiators
- Standard speed-bin cost optimization (vs EP1SGX25FF1020C7)
- Industrial temperature screening option (vs EP1SGX25FF1020C6N)
- Drop-in same-package second source within Stratix GX family (vs EP1S60F1020C7)
Design Notes
The 1020-ball FCBGA at 1.00 mm pitch requires a minimum 6-layer PCB stack-up: assign dedicated layers for core VCC, transceiver supply, ground reference, and signal routing. Escape routing must use micro-vias or via-in-pad for inner rows; place 0.1 uF decoupling capacitors directly beneath the BGA on the opposite side to minimize loop inductance. A continuous copper pour on the opposite PCB side must be stitched to ground for thermal dissipation.
Estimated: at typical Stratix GX utilization (70 percent logic, 50 percent RAM, all SERDES active), the FCBGA-1020 dissipates roughly 5-8 W. The 1.00 mm pitch package concentrates heat in the center; design for a minimum of 150 LFPM airflow or attach a low-profile heatsink with thermal interface material. Monitor junction temperature during bring-up using the device's on-chip thermal diode routed to a separate temperature-sensing circuit.
Do not confuse the EP1SGX25FF1020 (Stratix GX family with SERDES) with the EP1S25F1020C6 (Stratix family without SERDES); both share the 1020-ball FCBGA outline but have different ball maps. Always verify the exact ball-map against the Altera Stratix GX Device Family Data Sheet pin tables before PCB fabrication. Mixing the two will result in non-functional boards and rework costs.
Match the length of each SERDES differential pair within the tolerance specified by the target protocol (typically 5 mil for 3.125 Gbps signals). Route SERDES pairs on the top layer directly above an uninterrupted ground plane to maintain 100 ohm differential impedance. Keep the SERDES power supply isolated from the digital core supply; place ferrite beads and bulk decoupling to minimize switching-noise coupling into the receiver front-end.
Compliance Information
Compliance data not present in verified web data. Stratix GX FPGAs are typically lead-free; RoHS and REACH status must be verified per individual lot via the supplier's certificate of conformance.
