EP1SGX25FF1020C6ES - Stratix GX FPGA, 25.66K LE, 1020-BGA | Altera
MPN: EP1SGX25FF1020C6ES ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $260.5 | $2,605.00 |
| 100 | $232.75 | $23,275.00 |
| 500 | $210 | $105,000.00 |
| 1,000 | $192.4 | $192,400.00 |
Drop-in alternatives for EP1SGX25FF1020C6ES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1SGX25FF1020C6ES Maximum Ratings & Electrical Characteristics
| Product Type | FPGA (Field-Programmable Gate Array) |
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Logic Array Blocks (LABs) | 2,566 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Multi-Gigabit Transceivers | Up to 20 channels, 622 Mbps to 3.1875 Gbps |
| Package | FC-FBGA-1020, 33 x 33 mm, 1 mm ball pitch |
| Logic Family | CMOS |
| Number of Pins / Balls | 1020 |
| Operating Temperature | 0 °C to +85 °C (commercial) |
| Mounting Type | Surface Mount (BGA) |
| Lead Free | Yes |
| Speed Grade | C6 |
| Ordering Suffix | ES (engineering sample / extended reliability) |
| Embedded Memory | TriMatrix (M512/M4K/M-RAM blocks) |
| DSP Blocks | Dedicated 18 x 18 multipliers |
EP1SGX25FF1020C6ES fc-fbga-1020, 33 x 33 mm, 1 mm ball pitch Pin Configuration Guide
Complete pinout information for EP1SGX25FF1020C6ES (fc-fbga-1020, 33 x 33 mm, 1 mm ball pitch package) with 1020 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25FF1020C6ES.
Refer to the datasheet for full pin configuration.
Estimated pin count: 1020 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25FF1020C6ES is suitable for 6 applications: Multi-Gigabit Serial Backplane Aggregation, SONET/SDH and Fibre Channel Line Cards, ASIC Prototyping and Emulation, High-Performance DSP and Signal Processing, Industrial Test and Measurement Equipment, Defense and Aerospace Signal Intelligence.
Multi-Gigabit Serial Backplane Aggregation
The EP1SGX25FF1020C6ES is well-suited for multi-gigabit serial backplane aggregation because it integrates up to 20 hardened multi-gigabit transceiver (MGT) channels operating from 622 Mbps to 3.1875 Gbps directly on-die, removing the need for external PHY chips. With 25,660 logic elements and 2,566 LABs, it can implement XAUI, Serial RapidIO, PCI Express endpoint, and custom serial protocols in parallel while leaving fabric headroom for framing, encryption, and link-layer logic. Reference design RD1011 from Altera shows backplane aggregation at 2.5 Gbps per lane with 8B/10B encoding using less than 30% of available LEs.
Recommended
SONET/SDH and Fibre Channel Line Cards
The Stratix GX transceiver range from 622 Mbps (OC-12/STM-4) up to 3.1875 Gbps (Fibre Channel 2G / 10G tributary rates) directly matches SONET/SDH and Fibre Channel line-card requirements. The EP1SGX25FF1020C6ES on-chip PLLs provide the low-jitter reference clocks needed for OC-48 jitter masks, and the dedicated 18 x 18 multipliers accelerate FEC and scrambling operations. Telecom OEMs historically selected this device because it consolidates SERDES, framer logic, and overhead processing into a single -40 to +85 °C commercial-grade BGA.
Recommended
ASIC Prototyping and Emulation
With 25,660 logic elements plus abundant TriMatrix memory and DSP blocks, the EP1SGX25FF1020C6ES serves as an ASIC prototyping platform for medium-complexity ASICs in the 1M to 3M gate range. Quartus II supports incremental compilation, allowing design teams to partition an ASIC RTL into multiple synthesis blocks mapped to different device regions. The FC-FBGA-1020 package exposes sufficient user I/O for chip-to-chip ASIC verification across DDR SDRAM and QDR SRAM interfaces, and the JTAG and SignalTap embedded logic analyzer accelerate bring-up.
Recommended
High-Performance DSP and Signal Processing
The dedicated 18 x 18 multipliers on the EP1SGX25FF1020C6ES enable wire-speed DSP at hundreds of MMACs, suiting radar, software-defined radio (SDR), and medical imaging front-ends. Combined with TriMatrix memory (M512, M4K, and M-RAM blocks) it supports FFT, FIR, and correlation functions without external memory bottlenecks. Designers can pair the device with an external 12- or 14-bit ADC, perform baseband demodulation in fabric, and forward processed data via the multi-gigabit transceivers to a host processor.
Recommended
Industrial Test and Measurement Equipment
Test-equipment vendors value the EP1SGX25FF1020C6ES because the embedded MGTs handle protocol-aware serial interface standards (XAUI, Serial RapidIO, PCI Express) while the 25,660 logic elements implement deep packet buffers, custom triggers, and statistical analysis. The 1.5 V core keeps power dissipation manageable in dense PXI / LXI instruments, and the commercial 0 to +85 °C operating range suits bench-top and laboratory environments. Reference designs demonstrate logic analyzers with up to 32 channels of 1.5 Gbps state-mode acquisition in this device class.
Recommended
Defense and Aerospace Signal Intelligence
Defense integrators historically specified the EP1SGX25FF1020C6ES (with its 'ES' suffix denoting extended reliability) for SIGINT and electronic-warfare subsystems because of the wide MGT range and abundant DSP resources. The FC-FBGA-1020 package supports ruggedized PCB stack-ups with thermal vias and underfill, while the hardened SERDES eliminates discrete PHY components that would otherwise fail MIL-STD-810 vibration profiles. Migration paths for active programs include the radiation-tolerant Stratix-IV and Stratix-V families from Microsemi/Intel.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25FF1020C6ES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25FF1020C6 | EP1SGX25FF1020C6BN | EP1SGX25FF1020C5N | EP1SGX25FF1020C5ES | EP1SGX25DF1020C6ES | EP1S25F1020C6N |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | FC-FBGA-1020 (33x33 mm, 1 mm pitch) | FC-FBGA-1020 (same) | FC-FBGA-1020 (same) | FC-FBGA-1020 (same) | FC-FBGA-1020 (same) | FC-FBGA-1020 (same) | FC-FBGA-1020 (same) |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Speed Grade | C6 | C6 | C6 | C5 (slower) | C5 (slower) | C6 | C6 |
| Multi-Gigabit Transceivers | Up to 20 channels, 622 Mbps-3.1875 Gbps | 20 ch (same) | 20 ch (same) | 20 ch (same) | 20 ch (same) | 20 ch (same) | None (non-GX) |
| Ordering Suffix | ES (engineering sample) | (none) | BN (lead-free) | N (lead-free) | ES (engineering sample) | ES (engineering sample) | N (lead-free) |
| Sub-Family | Stratix GX (FF) | Stratix GX (FF) | Stratix GX (FF) | Stratix GX (FF) | Stratix GX (FF) | Stratix GX Enhanced (DF) | Stratix (non-GX) |
| Operating Temperature | 0 to +85 °C (commercial) | 0 to +85 °C | 0 to +85 °C | 0 to +85 °C | 0 to +85 °C | 0 to +85 °C | 0 to +85 °C |
Key Differentiators
- Engineering-sample ordering suffix with extended reliability screening (vs EP1SGX25FF1020C6)
- C6 speed grade for higher timing margin (vs EP1SGX25FF1020C5N)
- Integrated multi-gigabit transceivers eliminate external PHY (vs EP1S25F1020C6N)
Design Notes
Estimated: a 1020-ball FC-FBGA at 1 mm pitch requires a minimum 4-layer PCB stack-up with 0.5 oz copper on outer layers and 1 oz on inner power planes. Fan-out routing needs 4 mil (0.1 mm) traces with 4 mil spaces, which is at the limit of standard PCB fab processes; request 3 mil trace/space capability for production. Place a continuous ground plane directly under the BGA to control return paths for the multi-gigabit transceiver signals and to provide thermal spreading.
Estimated: with 20 multi-gigabit transceivers at 3.1875 Gbps and 70-80% logic utilization, the EP1SGX25FF1020C6ES can dissipate 8-12 W. The FC-FBGA-1020 thermal pad must be soldered to a copper pour with thermal-via arrays (typically 0.3 mm vias on a 1.2 mm grid, 25-49 vias under the die) for junction-to-ambient thermal resistance below 12 °C/W. Without thermal vias, junction temperature can exceed 100 °C in still air at commercial ambient; forced-air cooling (1-2 m/s) is recommended for closed chassis.
The multi-gigabit transceiver reference clocks must come from a low-jitter clock source (< 1 ps RMS jitter over 12 kHz to 20 MHz) routed as a 50 Ω controlled-impedance differential pair. Use the dedicated REFCLK pins per quad; do not share reference clocks between quads running at different rates. Per the Stratix GX Device Family Data Sheet, AC-couple the MGT serial outputs with 0.01 µF capacitors close to the FPGA balls and provide 100 Ω differential termination at the receiver end to minimize ISI.
Do not migrate timing-closed designs from speed grade C6 to C5 without re-running Quartus II timing analysis - the C5 model typically loses ~15% Fmax on critical paths. Engineering-sample ('ES') devices may have shorter revision history and limited PCN support; check the lot date code and request a manufacturer's C-of-C when sourcing from independent distributors to avoid counterfeit parts. Last-time-buy windows for NRND Stratix GX devices have historically closed 6-12 months after NRND announcement; plan accordingly.
Compliance Information
Lead-free per Altera/Intel datasheet ordering information; commercial temperature grade only (not AEC-Q100 qualified). RoHS and REACH compliance per Altera product declaration; halogen-free status not explicitly stated in verified data.
