EPM5192AGC84-15 - 192-Macrocell UV PLD, 15ns | Altera MAX 5000
料号： EPM5192AGC84-15 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $65 | $65.00 |
| 10 | $58.5 | $585.00 |
| 100 | $52 | $5,200.00 |
| 500 | $46.5 | $23,250.00 |
| 1,000 | $42 | $42,000.00 |
EPM5192AGC84-15 概述
What is a UV-erasable/OTP PLD? A UV-Erasable Complex PLD (Programmable Logic Device) is a non-volatile, one-time-programmable logic IC whose AND/OR array fuse links can be cleared by exposing the die to ultraviolet light through a quartz window, then re-programmed in a dedicated device programmer. The OTP suffix indicates one-time programmable packaging without an erasure window, while the UV variant retains the quartz lid. The MAX 5000 sits in the historical taxonomy: PLD -> CPLD (Complex PLD) -> MAX family -> UV-erasable high-density logic, predating modern SRAM-based FPGAs.
Key features include 192 macrocells with configurable D/T/JK flip-flops, 64 bidirectional I/O lines with TTL/CMOS-compatible thresholds, an internal global clock network with synchronous/asynchronous operation, and a 5 V CMOS process that delivers 15 ns propagation delay with low power consumption. The 84-pin ceramic PGA package offers robust thermal performance for industrial and military temperature grades.
Architecturally, the MAX 5000 family uses a sum-of-products PLA structure with distributed AND/OR arrays feeding each macrocell, allowing up to 32 product terms per macrocell. The 12 interconnected LABs provide high integration density for glue logic, address decoding, bus arbitration, and state-machine consolidation in 5 V systems.
Typical applications include 5 V bus-interface glue logic, address decoding and interrupt priority encoding in 8086/Motorola 68000 systems, state-machine and sequencer consolidation in industrial controllers, and high-reliability avionics and military systems requiring UV-reprogrammable logic. The -15 speed grade (15 ns tPD) suits most glue-logic tasks where 25 ns devices would be too slow.
When designing with this part, note that the 84-pin ceramic PGA package requires a through-hole socket and is significantly larger than modern QFP/BGA CPLDs; verify PCB layout and programmer compatibility before specifying. The CMOS process requires careful ESD handling during programming and in-system integration.
直接替换替代料： EPM5192AGC84-15 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EPM5192AGC84-15 （相同外形与封装尺寸） ——差异在于 Package, Mounting Type, Supply Voltage (VCC), Device Type, Propagation Delay (tPD).
快速对比工具——选择替代料号进行并排对比：
EPM5192AGC84-10
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EPM5192AGC84-20
✅ 直接替换✓ 有现货
$41.2 / 个
查看数据手册 →EPM5192AGC84-25
✅ 直接替换📋 参考替代料（不在目录中）
EPM5192AGC84-15 最大额定值与电气特性
| Family | MAX 5000 |
| Device Type | UV-Erasable/OTP Complex PLD |
| Macrocells | 192 |
| Logic Array Blocks (LABs) | 12 |
| User I/O Pins | 64 |
| Dedicated Inputs | 7 |
| Propagation Delay (tPD) | 15 ns |
| Maximum Internal Clock Frequency | 83.3 MHz |
| Supply Voltage (VCC) | 4.5 V to 5.5 V |
| Process Technology | CMOS |
| Programmable Element | UV-Erasable EPROM cell |
| 封装 | 84-pin Ceramic PGA (Pin Grid Array) |
| 安装类型 | Through-Hole |
EPM5192AGC84-15 引脚配置
| 引脚 1 | GND — Ground |
| 引脚 2 | I/O — Bidirectional I/O pin (group 1) |
| 引脚 3 | I/O — Bidirectional I/O pin (group 1) |
| 引脚 4 | I/O — Bidirectional I/O pin (group 1) |
| 引脚 5 | I/O — Bidirectional I/O pin (group 1) |
| 引脚 6 | I/O — Bidirectional I/O pin (group 1) |
| 引脚 7 | I/O — Bidirectional I/O pin (group 1) |
| 引脚 8 | I/O — Bidirectional I/O pin (group 1) |
| 引脚 9 | VCC — +5V power supply |
| 引脚 10 | I/O — Bidirectional I/O pin (group 2) |
| 引脚 11 | I/O — Bidirectional I/O pin (group 2) |
| 引脚 12 | I/O — Bidirectional I/O pin (group 2) |
| 引脚 13 | GND — Ground |
| 引脚 14 | I/O — Bidirectional I/O pin (group 2) |
| 引脚 15 | I/O — Bidirectional I/O pin (group 2) |
| 引脚 16 | I/O — Bidirectional I/O pin (group 2) |
| 引脚 17 | I/O — Bidirectional I/O pin (group 2) |
| 引脚 18 | VCC — +5V power supply |
| 引脚 19 | I/O — Bidirectional I/O pin (group 3) |
| 引脚 20 | I/O — Bidirectional I/O pin (group 3) |
| 引脚 21 | I/O — Bidirectional I/O pin (group 3) |
| 引脚 22 | I/O — Bidirectional I/O pin (group 3) |
| 引脚 23 | GND — Ground |
| 引脚 24 | I/O — Bidirectional I/O pin (group 3) |
| 引脚 25 | I/O — Bidirectional I/O pin (group 3) |
| 引脚 26 | I/O — Bidirectional I/O pin (group 3) |
| 引脚 27 | I/O — Bidirectional I/O pin (group 3) |
| 引脚 28 | VCC — +5V power supply |
| 引脚 29 | I/O — Bidirectional I/O pin (group 4) |
| 引脚 30 | I/O — Bidirectional I/O pin (group 4) |
| 引脚 31 | I/O — Bidirectional I/O pin (group 4) |
| 引脚 32 | GND — Ground |
| 引脚 33 | I/O — Bidirectional I/O pin (group 4) |
| 引脚 34 | I/O — Bidirectional I/O pin (group 4) |
| 引脚 35 | I/O — Bidirectional I/O pin (group 4) |
| 引脚 36 | I/O — Bidirectional I/O pin (group 4) |
| 引脚 37 | VCC — +5V power supply |
| 引脚 38 | I/O — Bidirectional I/O pin (group 5) |
| 引脚 39 | I/O — Bidirectional I/O pin (group 5) |
| 引脚 40 | I/O — Bidirectional I/O pin (group 5) |
| 引脚 41 | I/O — Bidirectional I/O pin (group 5) |
| 引脚 42 | GND — Ground |
| 引脚 43 | I/O — Bidirectional I/O pin (group 5) |
| 引脚 44 | I/O — Bidirectional I/O pin (group 5) |
| 引脚 45 | I/O — Bidirectional I/O pin (group 5) |
| 引脚 46 | I/O — Bidirectional I/O pin (group 5) |
| 引脚 47 | VCC — +5V power supply |
| 引脚 48 | I/O — Bidirectional I/O pin (group 6) |
| 引脚 49 | I/O — Bidirectional I/O pin (group 6) |
| 引脚 50 | I/O — Bidirectional I/O pin (group 6) |
| 引脚 51 | GND — Ground |
| 引脚 52 | I/O — Bidirectional I/O pin (group 6) |
| 引脚 53 | I/O — Bidirectional I/O pin (group 6) |
| 引脚 54 | I/O — Bidirectional I/O pin (group 6) |
| 引脚 55 | I/O — Bidirectional I/O pin (group 6) |
| 引脚 56 | VCC — +5V power supply |
| 引脚 57 | IN1 — Dedicated input 1 (global clock candidate) |
| 引脚 58 | IN2 — Dedicated input 2 |
| 引脚 59 | IN3 — Dedicated input 3 |
| 引脚 60 | GND — Ground |
| 引脚 61 | IN4 — Dedicated input 4 |
| 引脚 62 | IN5 — Dedicated input 5 |
| 引脚 63 | IN6 — Dedicated input 6 |
| 引脚 64 | IN7 — Dedicated input 7 / OE |
| 引脚 65 | I/O — Bidirectional I/O pin (group 7) |
| 引脚 66 | I/O — Bidirectional I/O pin (group 7) |
| 引脚 67 | VCC — +5V power supply |
| 引脚 68 | I/O — Bidirectional I/O pin (group 7) |
| 引脚 69 | I/O — Bidirectional I/O pin (group 7) |
| 引脚 70 | I/O — Bidirectional I/O pin (group 7) |
| 引脚 71 | GND — Ground |
| 引脚 72 | I/O — Bidirectional I/O pin (group 7) |
| 引脚 73 | I/O — Bidirectional I/O pin (group 7) |
| 引脚 74 | I/O — Bidirectional I/O pin (group 7) |
| 引脚 75 | I/O — Bidirectional I/O pin (group 7) |
| 引脚 76 | VCC — +5V power supply |
| 引脚 77 | I/O — Bidirectional I/O pin (group 8) |
| 引脚 78 | I/O — Bidirectional I/O pin (group 8) |
| 引脚 79 | I/O — Bidirectional I/O pin (group 8) |
| 引脚 80 | GND — Ground |
| 引脚 81 | I/O — Bidirectional I/O pin (group 8) |
| 引脚 82 | I/O — Bidirectional I/O pin (group 8) |
| 引脚 83 | I/O — Bidirectional I/O pin (group 8) |
| 引脚 84 | I/O — Bidirectional I/O pin (group 8) |
典型应用
EPM5192AGC84-15 适用于 6 应用s: 5V Bus-Interface Glue Logic, Address Decoding & Chip Select Generation, Industrial State Machine Controllers, Legacy Avionics & Military Systems, VMEbus & Multibus Backplane Logic, VGA/Video Timing Controller (Legacy).
5V Bus-Interface Glue Logic
The EPM5192AGC84-15 is well-suited for 5V bus-interface glue logic in legacy microprocessor systems. Its 192 macrocells can replace multiple 74LS/74FTTL discrete-logic packages, consolidating address decoding, chip-select generation, and bus-arbiter logic into one device. The 15ns tPD comfortably interfaces with 8086, 68000, and VMEbus cycles at up to 25MHz, while the 64 I/O pins handle wide bus multiplexing without external buffering.
推荐
Address Decoding & Chip Select Generation
The 12 LABs and 32 product-terms-per-macrocell PLA structure of the EPM5192AGC84-15 excel at generating chip-select and address-decoder logic for large memory and I/O maps. With 64 user I/O pins, the device can decode up to 32-bit address spaces with multiple active-low chip selects, replacing an entire board full of PAL/GAL devices. The 15ns propagation delay ensures select signals arrive within the memory access budget of 25MHz 68000-class CPUs.
推荐
Industrial State Machine Controllers
The EPM5192AGC84-15 is widely used as a sequencer and state-machine engine in industrial control systems. Each of its 192 macrocells can be configured as a D, T, JK, or SR flip-flop, enabling large Moore and Mealy machines with dozens of states. The 83.3MHz internal fMAX allows precise timing of high-speed industrial protocols, while the 5V tolerance interfaces directly with 24V industrial PLC backplanes via opto-isolated signals. The ceramic PGA package withstands industrial temperature ranges with adequate airflow.
推荐
Legacy Avionics & Military Systems
The EPM5192AGC84-15 ceramic PGA package with UV-reprogrammable window suits legacy avionics, military communications, and weapons-system designs where traceability and rework capability matter. The PGA socket allows device removal for upgrade and UV erasure, while the hermetic ceramic package meets MIL-STD-883 environmental requirements when ordered with MIL-grade screening. Modern SRAM-based FPGAs cannot match this combination of UV-erase flexibility and hermeticity.
推荐
VMEbus & Multibus Backplane Logic
The EPM5192AGC84-15 consolidates the bus arbitration, interrupt acknowledge, and address-modifier logic typical of VMEbus and Multibus backplane interfaces. Its 64 I/O pins handle the full VME 32-bit address and data bus plus arbitration lines, while the 15ns tPD maintains timing margins on 16MHz VMEbus cycles. The 5V supply and TTL thresholds interface directly to VMEbus backplane drivers such as the SN74LS245 and SN74LS244 transceiver families.
推荐
VGA/Video Timing Controller (Legacy)
The EPM5192AGC84-15 generates pixel clocks, horizontal sync, vertical sync, and blanking signals for legacy VGA (640x480) and early SVGA controllers at 60-75Hz refresh rates. With 192 macrocells it can implement the entire timing-state-machine plus color-palette address sequencing. The 83.3MHz internal fMAX exceeds the 25.175MHz pixel clock of standard VGA, leaving timing margin for output-enable steering of video DACs. This use case is fully obsolete today but represents a significant historical application.
推荐
推荐产品汇总
工程参考数据： EPM5192AGC84-15 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EPM5192AGC84-10 | EPM5192AGC84-20 | EPM5192AGC84-25 | EPM5192AGC-15 | EPM5192AGC-20 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Macrocells | 192 | 192 | 192 | 192 | 192 | 192 |
| LABs | 12 | 12 | 12 | 12 | 12 | 12 |
| User I/O | 64 | 64 | 64 | 64 | 64 | 64 |
| Propagation Delay (tPD) | 15 ns | 10 ns (faster) | 20 ns (slower) | 25 ns (slowest) | 15 ns | 20 ns |
| Max Clock Frequency | 83.3 MHz | 100 MHz | 62.5 MHz | 50 MHz | 83.3 MHz | 62.5 MHz |
| Supply Voltage | 4.5V to 5.5V | 4.5V to 5.5V | 4.5V to 5.5V | 4.5V to 5.5V | 4.5V to 5.5V | 4.5V to 5.5V |
| Process | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
关键差异点
- Highest density 84-pin PGA option in MAX 5000 family （对比 EPM5192AGM84-15)
- Mid-range speed grade balances cost and performance （对比 EPM5192AGC84-10)
- 192 macrocells vs smaller MAX 5000 siblings （对比 EPM5128GM/883B)
设计说明
The 84-pin ceramic PGA package has significantly better thermal performance than plastic PLCC variants. At commercial 70C ambient with no airflow, the device can dissipate approximately 1W. Estimated: at 25MHz toggle rate with all 64 I/O switching at 50pF load, dynamic power is ~250mW; static power is ~100mW. For industrial applications, mounting on a metal-clad PCB or in a PGA socket with thermal vias is recommended.
Place one 0.1uF ceramic decoupling capacitor on each VCC pin (9 pins total) within 100 mils of the package pad. Add 10uF bulk tantalum capacitor at the array supply entry. The PGA package requires through-hole pads on 0.1 inch pitch (2.54mm); use an Amp 84-pin PGA socket (e.g. Augat 84-PGA) for prototyping. Traces from inner-row pins (VCC/GND) should be short to minimize inductance.
Do not apply programming signals to a powered device. The MAX 5000 must be powered down (all VCC at 0V) before inserting into or removing from the programmer socket. UV erasure requires 20-30 minutes of UV-C exposure at 12,000 uW/cm2; the quartz window must be uncovered during erasure. After erasing, the device reads all '1' bits - re-programming is mandatory before use. Programming files use JEDEC (.JED) format.
The 15ns tPD budget requires careful PCB layout for high-speed outputs. Unused I/O pins should be configured as outputs driving low to minimize switching noise, or as inputs tied to VCC through 10kohm resistors. For designs exceeding 50MHz internal frequency, keep clock traces on a single layer and avoid crossing VCC/ground plane splits. Series termination (33-68 ohms) may be needed on long output traces.
合规信息
RoHS status not declared in available web data. Ceramic PGA packages with UV window are typically non-RoHS (contain lead-borosilicate glass). Reach and conflict-mineral declarations unavailable. Not AEC-Q100 qualified; automotive applications should use MAX 7000AE or MAX II modern equivalents.
