W634GU6RB11J - 4Gb DDR3L SDRAM x16 933MHz | Winbond
料号： W634GU6RB11J ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $13.87 | $13.87 |
| 10 | $12.5 | $125.00 |
| 100 | $11.2 | $1,120.00 |
| 500 | $10.1 | $5,050.00 |
| 1,000 | $9.5 | $9,500.00 |
W634GU6RB11J 概述
DDR3L (Double Data Rate 3 Low Voltage) is a type of synchronous dynamic random-access memory (SDRAM) that operates at 1.35V, reducing power consumption by about 20% compared to standard DDR3 (1.5V). It is part of the DDR3 family, which uses double data rate signaling to transfer data on both edges of the clock, achieving high bandwidth. DDR3L is commonly used in mobile devices, embedded systems, and industrial applications where power efficiency is critical.
Key features include auto self-refresh, auto precharge, data mask, write leveling, ZQ calibration, asynchronous reset, and dynamic on-chip termination (DTC). These features enhance signal integrity and simplify system design. The device supports industrial temperature range from -40°C to +95°C, making it suitable for harsh environments. It is RoHS compliant and halogen-free, aligning with environmental standards.
Technically, the W634GU6RB11J uses a 96-ball VFBGA package with a 0.8mm ball pitch, providing excellent thermal and electrical performance. The memory array is organized in 8 banks, and the device supports programmable CAS latency (CL) and additive latency (AL) for flexible timing. The on-die termination (ODT) feature improves signal quality by matching impedance, reducing reflections on the data bus.
Typical applications include networking equipment, industrial automation, medical devices, and embedded computing systems where high-density, low-power memory is required. The 4Gb density and x16 organization make it ideal for applications needing moderate memory capacity with a wide data bus.
When designing with this device, ensure proper decoupling capacitors near the VDD and VDDQ pins to minimize power supply noise. Also, follow the JEDEC DDR3L layout guidelines for signal integrity, including controlled impedance traces and proper termination.
直接替换替代料： W634GU6RB11J ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： W634GU6RB11J （相同外形与封装尺寸） ——差异在于 Operating Temperature, Package, Supply Voltage, Clock Frequency, Data Rate.
快速对比工具——选择替代料号进行并排对比：
W634GU6RB-11
✅ 直接替换✓ 有现货
$13.5227 / 个
查看数据手册 →W634GU6RB11K
✅ 直接替换📋 参考替代料（不在目录中）
MT41K256M16TW-107
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$14.1 / 个
查看数据手册 →IS43TR16512BL-107MBL
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
K4B4G1646E-BYMA
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$14.3182 / 个
查看数据手册 →W634GU6RB11J 最大额定值与电气特性
| 存储器类型 | SDRAM - DDR3L |
| 存储容量 | 4Gbit (256M x 16) |
| Clock Frequency | 933 MHz |
| 数据速率 | 1866 MT/s |
| 接口 | Parallel |
| 电源电压 | 1.35V |
| CAS 延迟 | 20 ns |
| 封装 | 96-VFBGA (7.5x13 mm) |
| 工作温度 | -40°C to +95°C |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
| 无卤 | Yes |
| Auto Self-Refresh | Yes |
| Write Leveling | Yes |
| ZQ Calibration | Yes |
W634GU6RB11J 引脚配置
| 引脚 A1 | VDD — Power supply |
| 引脚 A2 | DQ0 — Data input/output 0 |
| 引脚 A3 | DQ1 — Data input/output 1 |
| 引脚 B1 | VSS — Ground |
| 引脚 B2 | DQ2 — Data input/output 2 |
| 引脚 B3 | DQ3 — Data input/output 3 |
| 引脚 C1 | VDDQ — I/O power supply |
| 引脚 C2 | DQ4 — Data input/output 4 |
| 引脚 C3 | DQ5 — Data input/output 5 |
| 引脚 D1 | VSSQ — I/O ground |
| 引脚 D2 | DQ6 — Data input/output 6 |
| 引脚 D3 | DQ7 — Data input/output 7 |
典型应用
W634GU6RB11J 适用于 6 应用s: Networking Equipment, Industrial Automation, Medical Devices, Embedded Computing, Automotive Infotainment, Test & Measurement.
Networking Equipment
The W634GU6RB11J provides high-density, low-power memory for routers and switches. Its 4Gb capacity and 1866 MT/s data rate support high-bandwidth packet processing. The 1.35V operation reduces power consumption in 24/7 operation, and the industrial temperature range ensures reliability in telecom cabinets. The x16 interface simplifies PCB routing, and features like write leveling improve signal integrity at high speeds.
推荐
Industrial Automation
In industrial controllers, the W634GU6RB11J offers reliable memory for real-time data logging and control algorithms. Its -40°C to +95°C range suits factory floors, and auto self-refresh maintains data integrity during power-saving modes. The 1.35V supply reduces heat generation, and the 96-ball VFBGA package withstands vibration. The 4Gb density supports complex HMI applications without external storage.
推荐
Medical Devices
The W634GU6RB11J is ideal for medical imaging and patient monitoring systems that require high-speed, low-power memory. Its 1866 MT/s data rate enables fast image processing, while 1.35V operation extends battery life in portable devices. The industrial temperature range ensures reliable operation in clinical environments. The x16 interface simplifies connection to medical-grade processors, and features like DTC improve signal quality for error-free data transfer.
推荐
Embedded Computing
For embedded systems like single-board computers and IoT gateways, the W634GU6RB11J provides a balance of capacity and power efficiency. Its 4Gb size supports Linux-based applications, and the 1.35V supply is compatible with low-power SoCs. The 96-ball VFBGA package is compact for space-constrained designs. Features like ZQ calibration ensure reliable operation across temperature variations, making it suitable for outdoor IoT deployments.
推荐
Automotive Infotainment
The W634GU6RB11J supports automotive infotainment systems requiring high-bandwidth memory for navigation and multimedia. Its 1866 MT/s data rate handles HD video playback, and the 1.35V supply reduces heat in the cabin. The industrial temperature range covers automotive environments, and features like write leveling ensure stable operation. The x16 interface connects easily to automotive SoCs, and the compact package fits head units.
推荐
Test & Measurement
In oscilloscopes and data acquisition systems, the W634GU6RB11J provides fast, reliable memory for waveform storage. Its 1866 MT/s data rate enables high-speed sampling, and the 4Gb capacity stores long records. The 1.35V operation reduces noise, and the industrial temperature range ensures accuracy in lab and field use. The x16 interface simplifies connection to FPGAs, and features like auto precharge improve efficiency.
推荐
推荐产品汇总
工程参考数据： W634GU6RB11J ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | W634GU6RB-11 | W634GU6RB11K | MT41K256M16TW-107 |
|---|---|---|---|---|
| Package | 96-VFBGA (7.5x13) | 96-VFBGA (7.5x13) | 96-VFBGA (7.5x13) | 96-FBGA (7.5x13) |
| Brand | Winbond Electronics | Winbond Electronics | Winbond Electronics | Micron Technology |
| Memory Size | 4Gbit | 4Gbit | 4Gbit | 4Gbit |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Clock Frequency | 933 MHz | 933 MHz | 933 MHz | 933 MHz |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V |
| Operating Temperature | -40°C to +95°C | -40°C to +95°C | -40°C to +95°C | 0°C to +95°C |
| RoHS | Compliant | Compliant | Compliant | Compliant |
关键差异点
- Industrial temperature range （对比 MT41K256M16TW-107)
- Renewable energy option （对比 W634GU6RB-11)
- Low power consumption （对比 K4B4G1646E-BYMA)
设计说明
Ensure proper decoupling capacitors (0.1uF and 1uF) are placed close to each VDD and VDDQ pin to minimize power supply noise. Follow JEDEC DDR3L layout guidelines for controlled impedance traces (typically 50 ohms single-ended, 100 ohms differential) and maintain equal trace lengths for DQ and DQS signals to ensure signal integrity at 1866 MT/s.
The W634GU6RB11J operates over -40°C to +95°C. In high-ambient-temperature environments, ensure adequate airflow or heatsinking to keep the junction temperature within limits. The 1.35V supply reduces power dissipation, but at 1866 MT/s, the device can still generate significant heat. Use thermal vias under the package to improve heat transfer to the PCB.
Do not exceed the absolute maximum ratings for VDD (1.575V) and VDDQ (1.575V). Ensure the memory controller is configured for DDR3L (1.35V) operation, not DDR3 (1.5V), to avoid damage. Also, verify that the CAS latency and timing parameters match the controller's settings to prevent data corruption.
合规信息
RoHS and halogen-free per Winbond. AEC-Q100 not specified for this part; automotive variants may be available.
