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Winbond

W634GU6RB11J - 4Gb DDR3L SDRAM x16 933MHz | Winbond

部品番号: W634GU6RB11J ✓ 生産中
在庫あり 1〜3営業日以内に発送
1.35V Vdss 96-VFBGA (7.5x13 mm) Package 933 MHz Speed SDRAM - DDR3L Memory
開始価格 $9.5 USD / 個
MOQ: 1 |
価格更新日: 2026-08-17
ボリューム価格
数量 単価 小計
1 $13.87 $13.87
10 $12.5 $125.00
100 $11.2 $1,120.00
500 $10.1 $5,050.00
1,000 $9.5 $9,500.00
ℹ️ すべての価格はUSDです

W634GU6RB11J 概要

The Winbond W634GU6RB11J is a 4Gbit DDR3L SDRAM organized as 256M x 16, operating at a clock frequency of 933 MHz (DDR3L-1866) with a data rate of 1866 MT/s. It is housed in a 96-ball VFBGA package (7.5x13 mm) and operates from a 1.35V supply, making it suitable for low-power applications. The device supports parallel interface with a burst length of 8 and features a 20 ns CAS latency.

DDR3L (Double Data Rate 3 Low Voltage) is a type of synchronous dynamic random-access memory (SDRAM) that operates at 1.35V, reducing power consumption by about 20% compared to standard DDR3 (1.5V). It is part of the DDR3 family, which uses double data rate signaling to transfer data on both edges of the clock, achieving high bandwidth. DDR3L is commonly used in mobile devices, embedded systems, and industrial applications where power efficiency is critical.

Key features include auto self-refresh, auto precharge, data mask, write leveling, ZQ calibration, asynchronous reset, and dynamic on-chip termination (DTC). These features enhance signal integrity and simplify system design. The device supports industrial temperature range from -40°C to +95°C, making it suitable for harsh environments. It is RoHS compliant and halogen-free, aligning with environmental standards.

Technically, the W634GU6RB11J uses a 96-ball VFBGA package with a 0.8mm ball pitch, providing excellent thermal and electrical performance. The memory array is organized in 8 banks, and the device supports programmable CAS latency (CL) and additive latency (AL) for flexible timing. The on-die termination (ODT) feature improves signal quality by matching impedance, reducing reflections on the data bus.

Typical applications include networking equipment, industrial automation, medical devices, and embedded computing systems where high-density, low-power memory is required. The 4Gb density and x16 organization make it ideal for applications needing moderate memory capacity with a wide data bus.

When designing with this device, ensure proper decoupling capacitors near the VDD and VDDQ pins to minimize power supply noise. Also, follow the JEDEC DDR3L layout guidelines for signal integrity, including controlled impedance traces and proper termination.

ドロップイン代替品: W634GU6RB11J — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: W634GU6RB11J (同一形状・フットプリント) — 相違点: Operating Temperature, Package, Supply Voltage, Clock Frequency, Data Rate.

Samsung Electronics
Operating Temperature: 0°C to +95°C
Package: FBGA-96
Supply Voltage: 1.35 V (1.28 V to 1.575 V)
比較対象 W634GU6RB11J →
Micron Technology
Operating Temperature: 0C to +95C (commercial :P grade)
Package: 96-FBGA (8x14 mm)
Supply Voltage: 1.35 V
比較対象 W634GU6RB11J →
Winbond
Supply Voltage: 1.35V (1.283V to 1.45V)
比較対象 W634GU6RB11J →
Winbond
Operating Temperature: -40C to +95C
Supply Voltage: 1.35 V
Clock Frequency: 1.067 GHz
比較対象 W634GU6RB11J →
Winbond
Operating Temperature: 0°C to +95°C (Tc)
Package: 96-VFBGA (7.5x13mm)
Data Rate: 1066 MHz (DDR3L-2133)
比較対象 W634GU6RB11J →

クイック比較ツール — 並列比較する代替部品を選択:

W634GU6RB-11

✅ ドロップイン
Winbond
📦 96-VFBGA (7.5x13)
DDR3L SDRAM · 4Gbit (256M x 16) · Parallel · 933 MHz · 1866 MT/s · 20 ns · 1.35V (1.283V to 1.45V) · 96-VFBGA (7.5x13 mm)

✓ 在庫あり

$13.5227 / 個

データシートを見る →

W634GU6RB11K

✅ ドロップイン
📦 96-VFBGA (7.5x13)
Identical specs, manufactured with renewable energy

📋 参考代替品(カタログ未掲載)

MT41K256M16TW-107

✅ ドロップイン ⚠️ 仕様未検証
Micron Technology
📦 96-FBGA (7.5x13)
DDR3L SDRAM · 4 Gbit · 256M x 16 · Parallel · 933 MHz (DDR3L-1866) · 20 ns · 1.35 V · 16 bit

✓ 在庫あり

$14.1 / 個

データシートを見る →

IS43TR16512BL-107MBL

✅ ドロップイン ⚠️ 仕様未検証
📦 96-FBGA (7.5x13)
Cross-brand, 4Gb DDR3L x16, similar timing

📋 参考代替品(カタログ未掲載)

K4B4G1646E-BYMA

✅ ドロップイン ⚠️ 仕様未検証
Samsung Electronics
📦 96-FBGA (7.5x13)
DDR3L SDRAM · 4 Gb · 256M x 16 · 1.35 V (1.28 V to 1.575 V) · 933 MHz · 1866 Mbps/pin · 0°C to +95°C · 14 mA

✓ 在庫あり

$14.3182 / 個

データシートを見る →

W634GU6RB11J 最大定格&電気的特性

メモリタイプ SDRAM - DDR3L
メモリサイズ 4Gbit (256M x 16)
Clock Frequency 933 MHz
データレート 1866 MT/s
インターフェース Parallel
電源電圧 1.35V
CASレイテンシ 20 ns
パッケージ 96-VFBGA (7.5x13 mm)
動作温度 -40°C to +95°C
実装タイプ Surface Mount
RoHS ステータス Compliant
ハロゲンフリー Yes
Auto Self-Refresh Yes
Write Leveling Yes
ZQ Calibration Yes

W634GU6RB11J ピン構成

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
ピン A1 VDD — Power supply
ピン A2 DQ0 — Data input/output 0
ピン A3 DQ1 — Data input/output 1
ピン B1 VSS — Ground
ピン B2 DQ2 — Data input/output 2
ピン B3 DQ3 — Data input/output 3
ピン C1 VDDQ — I/O power supply
ピン C2 DQ4 — Data input/output 4
ピン C3 DQ5 — Data input/output 5
ピン D1 VSSQ — I/O ground
ピン D2 DQ6 — Data input/output 6
ピン D3 DQ7 — Data input/output 7

主な用途

W634GU6RB11J の用途: 6 件s: Networking Equipment, Industrial Automation, Medical Devices, Embedded Computing, Automotive Infotainment, Test & Measurement.

🌐

Networking Equipment

The W634GU6RB11J provides high-density, low-power memory for routers and switches. Its 4Gb capacity and 1866 MT/s data rate support high-bandwidth packet processing. The 1.35V operation reduces power consumption in 24/7 operation, and the industrial temperature range ensures reliability in telecom cabinets. The x16 interface simplifies PCB routing, and features like write leveling improve signal integrity at high speeds.

🏭

Industrial Automation

In industrial controllers, the W634GU6RB11J offers reliable memory for real-time data logging and control algorithms. Its -40°C to +95°C range suits factory floors, and auto self-refresh maintains data integrity during power-saving modes. The 1.35V supply reduces heat generation, and the 96-ball VFBGA package withstands vibration. The 4Gb density supports complex HMI applications without external storage.

💊

Medical Devices

The W634GU6RB11J is ideal for medical imaging and patient monitoring systems that require high-speed, low-power memory. Its 1866 MT/s data rate enables fast image processing, while 1.35V operation extends battery life in portable devices. The industrial temperature range ensures reliable operation in clinical environments. The x16 interface simplifies connection to medical-grade processors, and features like DTC improve signal quality for error-free data transfer.

🧩

Embedded Computing

For embedded systems like single-board computers and IoT gateways, the W634GU6RB11J provides a balance of capacity and power efficiency. Its 4Gb size supports Linux-based applications, and the 1.35V supply is compatible with low-power SoCs. The 96-ball VFBGA package is compact for space-constrained designs. Features like ZQ calibration ensure reliable operation across temperature variations, making it suitable for outdoor IoT deployments.

🚗

Automotive Infotainment

The W634GU6RB11J supports automotive infotainment systems requiring high-bandwidth memory for navigation and multimedia. Its 1866 MT/s data rate handles HD video playback, and the 1.35V supply reduces heat in the cabin. The industrial temperature range covers automotive environments, and features like write leveling ensure stable operation. The x16 interface connects easily to automotive SoCs, and the compact package fits head units.

🔧

Test & Measurement

In oscilloscopes and data acquisition systems, the W634GU6RB11J provides fast, reliable memory for waveform storage. Its 1866 MT/s data rate enables high-speed sampling, and the 4Gb capacity stores long records. The 1.35V operation reduces noise, and the industrial temperature range ensures accuracy in lab and field use. The x16 interface simplifies connection to FPGAs, and features like auto precharge improve efficiency.

What is the memory size of W634GU6RB11J?
The W634GU6RB11J has a memory size of 4Gbit, organized as 256M x 16. According to Winbond's datasheet, it is a DDR3L SDRAM with a parallel interface and operates at 933 MHz.
What is the operating voltage of W634GU6RB11J?
The W634GU6RB11J operates at 1.35V, which is the DDR3L standard voltage. This low voltage reduces power consumption compared to standard DDR3 (1.5V), making it suitable for power-sensitive applications.
What is the price of W634GU6RB11J?
As of 2026-08-18, the price of W634GU6RB11J is approximately $13.87 for a single unit, with volume pricing available. For example, at 1000 units, the price drops to around $9.50 per unit, as listed on LCSC.
Where can I buy W634GU6RB11J?
W634GU6RB11J is available from authorized distributors such as DigiKey, Mouser, and LCSC. You can also purchase directly from Winbond's online purchasing guide. Check stock and pricing on these platforms for the latest availability.
What is the lead time for W634GU6RB11J?
The lead time for W634GU6RB11J varies by distributor and current demand. As of 2026-08-18, LCSC shows in stock, indicating immediate availability. For larger quantities, lead times may extend to 8-12 weeks, so it's best to check with your preferred distributor.
Is W634GU6RB11J in stock?
Yes, as of 2026-08-18, W634GU6RB11J is in stock at LCSC with 2,889 units available. DigiKey and Mouser also list it as active, but stock levels may vary. Check their websites for real-time inventory.
W634GU6RB11J vs W634GU6RB-11: what is the difference?
W634GU6RB11J and W634GU6RB-11 are essentially the same part; the suffix 'J' may indicate a specific packaging or revision. According to Winbond, all specifications are identical, and the 'J' variant is often used for ordering purposes. They are drop-in replacements for each other.
What is the difference between W634GU6RB11J and W634GU6RB11K?
The W634GU6RB11K is identical to W634GU6RB11J in all specifications and features; the only difference is the manufacturing electricity source. The 'K' variant is produced using renewable energy, as noted in Winbond's online purchasing guide. Both are pin-compatible and functionally equivalent.
When should I choose W634GU6RB11J over a DDR3 part?
Choose W634GU6RB11J when you need lower power consumption (1.35V vs 1.5V) and are designing for battery-powered or thermally constrained systems. It is also ideal for industrial applications requiring -40°C to +95°C operation. If your system already uses DDR3L, this is a direct fit.
Is W634GU6RB11J suitable for industrial applications?
Yes, W634GU6RB11J is suitable for industrial applications because it operates over -40°C to +95°C and supports features like auto self-refresh and write leveling. Winbond also offers AEC-Q100 qualified versions for automotive, but this standard part is designed for industrial use.
What is the best drop-in replacement for W634GU6RB11J?
The best drop-in replacement for W634GU6RB11J is the W634GU6RB-11, which is the same part with a different suffix. Other pin-compatible alternatives include the W634GU6NB-11 (if available) and Micron's MT41K256M16TW-107, but verify pinout and timing before use.
Can W634GU6RB11K replace W634GU6RB11J?
Yes, W634GU6RB11K can replace W634GU6RB11J because they are identical in specifications and pinout. The only difference is the manufacturing electricity source, which does not affect functionality. It is a direct drop-in replacement.
Where can I download the W634GU6RB11J datasheet PDF?
You can download the W634GU6RB11J datasheet PDF from Winbond's official website or from distributor sites like DigiKey and Mouser. The datasheet provides detailed specifications, pinout, and timing diagrams.
What are the key specifications of W634GU6RB11J that engineers should know?
Engineers should know that W634GU6RB11J is a 4Gbit DDR3L SDRAM with x16 organization, 933 MHz clock, 1.35V supply, and 96-ball VFBGA package. It supports industrial temperature range and features like auto self-refresh and ZQ calibration. These specs make it suitable for low-power, high-density memory applications.
What is the best Micron equivalent for W634GU6RB11J?
The best Micron equivalent for W634GU6RB11J is the MT41K256M16TW-107, which is a 4Gb DDR3L SDRAM in a 96-ball FBGA package. However, verify pin compatibility and timing parameters before using it as a drop-in replacement, as Micron's pinout may differ slightly.

エンジニアリング参考データ: W634GU6RB11J — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the W634GU6RB11J when you need a 4Gb DDR3L SDRAM with industrial temperature range and low power consumption. It is ideal for networking, industrial, and medical applications. If you require a renewable energy manufacturing option, select the W634GU6RB11K. For automotive-grade parts, consider Winbond's AEC-Q100 qualified variants. Cross-brand alternatives like Micron's MT41K256M16TW-107 are suitable if you need a second source, but verify pinout and temperature range. The W634GU6RB-11 is the same part with a different suffix, so it is a direct drop-in replacement.

代替品との比較

パラメータ この製品 W634GU6RB-11 W634GU6RB11K MT41K256M16TW-107
Package 96-VFBGA (7.5x13) 96-VFBGA (7.5x13) 96-VFBGA (7.5x13) 96-FBGA (7.5x13)
Brand Winbond Electronics Winbond Electronics Winbond Electronics Micron Technology
Memory Size 4Gbit 4Gbit 4Gbit 4Gbit
Organization 256M x 16 256M x 16 256M x 16 256M x 16
Clock Frequency 933 MHz 933 MHz 933 MHz 933 MHz
Supply Voltage 1.35V 1.35V 1.35V 1.35V
Operating Temperature -40°C to +95°C -40°C to +95°C -40°C to +95°C 0°C to +95°C
RoHS Compliant Compliant Compliant Compliant

主な差別化要因

  • Industrial temperature range (vs MT41K256M16TW-107)
  • Renewable energy option (vs W634GU6RB-11)
  • Low power consumption (vs K4B4G1646E-BYMA)

設計ノート

Ensure proper decoupling capacitors (0.1uF and 1uF) are placed close to each VDD and VDDQ pin to minimize power supply noise. Follow JEDEC DDR3L layout guidelines for controlled impedance traces (typically 50 ohms single-ended, 100 ohms differential) and maintain equal trace lengths for DQ and DQS signals to ensure signal integrity at 1866 MT/s.

The W634GU6RB11J operates over -40°C to +95°C. In high-ambient-temperature environments, ensure adequate airflow or heatsinking to keep the junction temperature within limits. The 1.35V supply reduces power dissipation, but at 1866 MT/s, the device can still generate significant heat. Use thermal vias under the package to improve heat transfer to the PCB.

Do not exceed the absolute maximum ratings for VDD (1.575V) and VDDQ (1.575V). Ensure the memory controller is configured for DDR3L (1.35V) operation, not DDR3 (1.5V), to avoid damage. Also, verify that the CAS latency and timing parameters match the controller's settings to prevent data corruption.

コンプライアンス情報

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Qualified
鉛フリー
Yes
ハロゲンフリー
Yes
紛争鉱物
Unknown

RoHS and halogen-free per Winbond. AEC-Q100 not specified for this part; automotive variants may be available.

データ検証日: 2026-08-18 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

関連検索

W634GU6RB11J datasheet W634GU6RB11J price W634GU6RB11J buy W634GU6RB11J vs W634GU6RB-11 4Gb DDR3L SDRAM x16 Winbond W634GU6RB11J W634GU6RB11J pinout W634GU6RB11J equivalent DDR3L 933MHz 96-VFBGA W634GU6RB11J in stock

関連部品&用語

Winbond Electronics W634GU6RB11J W634GU6RB-11 W634GU6RB11K MT41K256M16TW-107 DDR3L SDRAM 4Gbit 256M x 16 933 MHz 1.35V 96-VFBGA RoHS Halogen-Free Industrial temperature range
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