EP3SL200H780C3N vs EP3SL200H780I4LN مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP3SL200H780C3N بواسطة Intel و EP3SL200H780I4LN بواسطة Altera. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP3SL200H780C3N | EP3SL200H780I4LN |
|---|---|---|
| العلامة التجارية | Intel | Altera |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | NRND | NRND |
| Family | Stratix III L (low-power) | Stratix III L (Low-Power) |
| Process Node | 40 nm | — |
| Logic Elements | 200,000 | — |
| Embedded Memory Bits | 10,901,504 bits | — |
| Logic Array Blocks (LABs) | 8,000 | — |
| User I/Os | 488 | — |
| العلبة | 780-Ball FCBGA (HBGA), 29 x 29 mm | — |
| نوع التركيب | Surface Mount | Surface Mount |
| Maximum Internal Clock Frequency | 800 MHz | — |
| Transceivers | 24 channels, up to 3.75 Gbps | — |
| DSP Blocks | 384 | — |
| Speed Grade | C3 (commercial, -3 speed) | I4 (Industrial, mid-speed grade) |
| درجة حرارة التشغيل | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Voltage - Core | 0.9 V / 1.0 V (core, VCC) | — |
| Voltage - I/O | 1.2 V to 3.3 V (VCCIO banks) | — |
| مستوى MSL | 3 | MSL 3 (168 Hours, per JEDEC J-STD-020) |
| Lead-Free / RoHS | Yes | — |
| Mounting Pitch | 1.0 mm ball pitch | — |
| PLLs | 12 (Stratix III PLL array) | — |
| Configuration | JTAG IEEE Std 1149.1, passive/active serial | — |
| Series | — | Stratix III L |
| Manufacturer | — | Intel / Altera (now Intel PSG) |
| Number of Logic Elements / Cells | — | 200,000 |
| Number of LABs / CLBs | — | 8,000 |
| Total RAM Bits | — | 10,901,504 (approximately 10.9 Mbit) |
| Number of I/O | — | 488 |
| Voltage - Supply | — | 0.9 V core (selectable Vcore) |
| العلبة / الحالة | — | 780-BBGA, FCBGA (Flip-Chip BGA) |
| Process Technology | — | 65 nm CMOS |
| حالة RoHS | — | RoHS Compliant (lead-free) |
| Roaming Pin Name Suffix | — | LN = lead-free, industrial temp, H780 780-ball package |