EP3SL200H780C3N vs EP3SL200H780I4LN 比較

詳細並排比較 EP3SL200H780C3N 由 Intel 與 EP3SL200H780I4LN 由 Altera. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SL200H780C3N EP3SL200H780I4LN
品牌 Intel Altera
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND NRND
Family Stratix III L (low-power) Stratix III L (Low-Power)
Process Node 40 nm —
Logic Elements 200,000 —
Embedded Memory Bits 10,901,504 bits —
Logic Array Blocks (LABs) 8,000 —
User I/Os 488 —
封裝 780-Ball FCBGA (HBGA), 29 x 29 mm —
安裝類型 Surface Mount Surface Mount
Maximum Internal Clock Frequency 800 MHz —
Transceivers 24 channels, up to 3.75 Gbps —
DSP Blocks 384 —
Speed Grade C3 (commercial, -3 speed) I4 (Industrial, mid-speed grade)
工作溫度 0C to +85C (commercial) -40C to +100C (industrial)
Voltage - Core 0.9 V / 1.0 V (core, VCC) —
Voltage - I/O 1.2 V to 3.3 V (VCCIO banks) —
MSL 等級 3 MSL 3 (168 Hours, per JEDEC J-STD-020)
Lead-Free / RoHS Yes —
Mounting Pitch 1.0 mm ball pitch —
PLLs 12 (Stratix III PLL array) —
Configuration JTAG IEEE Std 1149.1, passive/active serial —
Series — Stratix III L
Manufacturer — Intel / Altera (now Intel PSG)
Number of Logic Elements / Cells — 200,000
Number of LABs / CLBs — 8,000
Total RAM Bits — 10,901,504 (approximately 10.9 Mbit)
Number of I/O — 488
Voltage - Supply — 0.9 V core (selectable Vcore)
封裝 / 外殼 — 780-BBGA, FCBGA (Flip-Chip BGA)
Process Technology — 65 nm CMOS
RoHS 狀態 — RoHS Compliant (lead-free)
Roaming Pin Name Suffix — LN = lead-free, industrial temp, H780 780-ball package

資料表與資源

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