EP3SL200H780C3N vs EP3SL200H780I4LN Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL200H780C3N sa pamamagitan ng Intel at EP3SL200H780I4LN sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SL200H780C3N EP3SL200H780I4LN
Brand Intel Altera
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND NRND
Family Stratix III L (low-power) Stratix III L (Low-Power)
Process Node 40 nm —
Logic Elements 200,000 —
Embedded Memory Bits 10,901,504 bits —
Logic Array Blocks (LABs) 8,000 —
User I/Os 488 —
Packhaging 780-Ball FCBGA (HBGA), 29 x 29 mm —
Uri ng Pagpapasok Surface Mount Surface Mount
Maximum Internal Clock Frequency 800 MHz —
Transceivers 24 channels, up to 3.75 Gbps —
DSP Blocks 384 —
Speed Grade C3 (commercial, -3 speed) I4 (Industrial, mid-speed grade)
Temperature na Operasyon 0C to +85C (commercial) -40C to +100C (industrial)
Voltage - Core 0.9 V / 1.0 V (core, VCC) —
Voltage - I/O 1.2 V to 3.3 V (VCCIO banks) —
Level ng MSL 3 MSL 3 (168 Hours, per JEDEC J-STD-020)
Lead-Free / RoHS Yes —
Mounting Pitch 1.0 mm ball pitch —
PLLs 12 (Stratix III PLL array) —
Configuration JTAG IEEE Std 1149.1, passive/active serial —
Series — Stratix III L
Manufacturer — Intel / Altera (now Intel PSG)
Number of Logic Elements / Cells — 200,000
Number of LABs / CLBs — 8,000
Total RAM Bits — 10,901,504 (approximately 10.9 Mbit)
Number of I/O — 488
Voltage - Supply — 0.9 V core (selectable Vcore)
Packhaging / Kaso — 780-BBGA, FCBGA (Flip-Chip BGA)
Process Technology — 65 nm CMOS
Tindminan RoHS — RoHS Compliant (lead-free)
Roaming Pin Name Suffix — LN = lead-free, industrial temp, H780 780-ball package

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