EP3SL200H780C3N vs EP3SL200H780I4LN Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL200H780C3N disebabkan oleh Intel dan EP3SL200H780I4LN disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3SL200H780C3N EP3SL200H780I4LN
Merek Intel Altera
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND NRND
Family Stratix III L (low-power) Stratix III L (Low-Power)
Process Node 40 nm —
Logic Elements 200,000 —
Embedded Memory Bits 10,901,504 bits —
Logic Array Blocks (LABs) 8,000 —
User I/Os 488 —
Kemasan 780-Ball FCBGA (HBGA), 29 x 29 mm —
Jenis Pemasangan Surface Mount Surface Mount
Maximum Internal Clock Frequency 800 MHz —
Transceivers 24 channels, up to 3.75 Gbps —
DSP Blocks 384 —
Speed Grade C3 (commercial, -3 speed) I4 (Industrial, mid-speed grade)
Suhu Operasi 0C to +85C (commercial) -40C to +100C (industrial)
Voltage - Core 0.9 V / 1.0 V (core, VCC) —
Voltage - I/O 1.2 V to 3.3 V (VCCIO banks) —
Aras MSL 3 MSL 3 (168 Hours, per JEDEC J-STD-020)
Lead-Free / RoHS Yes —
Mounting Pitch 1.0 mm ball pitch —
PLLs 12 (Stratix III PLL array) —
Configuration JTAG IEEE Std 1149.1, passive/active serial —
Series — Stratix III L
Manufacturer — Intel / Altera (now Intel PSG)
Number of Logic Elements / Cells — 200,000
Number of LABs / CLBs — 8,000
Total RAM Bits — 10,901,504 (approximately 10.9 Mbit)
Number of I/O — 488
Voltage - Supply — 0.9 V core (selectable Vcore)
Kemasan / Case — 780-BBGA, FCBGA (Flip-Chip BGA)
Process Technology — 65 nm CMOS
Status RoHS — RoHS Compliant (lead-free)
Roaming Pin Name Suffix — LN = lead-free, industrial temp, H780 780-ball package

Laporan Datasheet & Sumber

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