EP3SL200H780C3N vs EP3SL200H780I4LN Perbandingan
Perbandingan bersamaan detil EP3SL200H780C3N dari Intel dan EP3SL200H780I4LN dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SL200H780C3N | EP3SL200H780I4LN |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III L (low-power) | Stratix III L (Low-Power) |
| Process Node | 40 nm | — |
| Logic Elements | 200,000 | — |
| Embedded Memory Bits | 10,901,504 bits | — |
| Logic Array Blocks (LABs) | 8,000 | — |
| User I/Os | 488 | — |
| Paket | 780-Ball FCBGA (HBGA), 29 x 29 mm | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Maximum Internal Clock Frequency | 800 MHz | — |
| Transceivers | 24 channels, up to 3.75 Gbps | — |
| DSP Blocks | 384 | — |
| Speed Grade | C3 (commercial, -3 speed) | I4 (Industrial, mid-speed grade) |
| Suhu Kerja | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Voltage - Core | 0.9 V / 1.0 V (core, VCC) | — |
| Voltage - I/O | 1.2 V to 3.3 V (VCCIO banks) | — |
| Level MSL | 3 | MSL 3 (168 Hours, per JEDEC J-STD-020) |
| Lead-Free / RoHS | Yes | — |
| Mounting Pitch | 1.0 mm ball pitch | — |
| PLLs | 12 (Stratix III PLL array) | — |
| Configuration | JTAG IEEE Std 1149.1, passive/active serial | — |
| Series | — | Stratix III L |
| Manufacturer | — | Intel / Altera (now Intel PSG) |
| Number of Logic Elements / Cells | — | 200,000 |
| Number of LABs / CLBs | — | 8,000 |
| Total RAM Bits | — | 10,901,504 (approximately 10.9 Mbit) |
| Number of I/O | — | 488 |
| Voltage - Supply | — | 0.9 V core (selectable Vcore) |
| Paket / Case | — | 780-BBGA, FCBGA (Flip-Chip BGA) |
| Process Technology | — | 65 nm CMOS |
| Status RoHS | — | RoHS Compliant (lead-free) |
| Roaming Pin Name Suffix | — | LN = lead-free, industrial temp, H780 780-ball package |