MC9S08DZ60AMLC vs MC9S08DZ60MLC مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ MC9S08DZ60AMLC بواسطة NXP Semiconductors و MC9S08DZ60MLC بواسطة NXP Semiconductors. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | MC9S08DZ60AMLC | MC9S08DZ60MLC |
|---|---|---|
| العلامة التجارية | NXP Semiconductors | NXP Semiconductors |
| الفئة | Microcontrollers | Microcontrollers |
| حالة دورة الحياة | NRND | نشط |
| Core | HCS08 (CISC, 8-bit) | — |
| CPU Frequency | 40 MHz (20 MHz bus) | — |
| Program Memory | 60 KB Flash | — |
| RAM | 4 KB | 4 KB |
| EEPROM | 2 KB | — |
| جهد التغذية | 2.7 V to 5.5 V | — |
| ADC | 24-channel, 12-bit, 2.5 us conversion | 12-bit (channels vary by package) |
| CAN Interface | 1x MSCAN (CAN 2.0A/B) | — |
| SCI / UART | 2 | — |
| SPI | 1 | — |
| I/O Pins | 40 (32-LQFP exposed count varies by mux) | — |
| LCD Driver | Up to 8x36 segments | — |
| Timers | TPM channels included | — |
| العلبة | 32-LQFP (7x7 mm, 0.5 mm pitch) | 32-LQFP (7x7 mm) |
| درجة حرارة التشغيل | -40 C to +125 C (automotive grade) | — |
| حالة RoHS | Compliant | Compliant (per distributor listings) |
| مستوى MSL | [DATA_NEEDED: MSL level] | — |
| Core Architecture | — | HCS08 (S08 family) - 8-bit |
| CPU Core | — | HCS08 with HC08 instruction set (plus BGND) |
| Core Clock Frequency | — | 40 MHz |
| Internal Bus Speed | — | 20 MHz |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| EEPROM / Emulated EEPROM | — | [DATA_NEEDED: EEPROM size] |
| نوع التركيب | — | Surface Mount (Gull Wing) |
| Maximum GPIO | — | 53 GPIO + 1 input-only (family-wide; 32-LQFP exposed subset) |
| عدد الدبابيس | — | 32 |
| Interrupt Sources | — | Up to 32 |
| CAN Module | — | MSCAN (CAN 2.0B) - 1 channel |
| Timers / PWM | — | Multiple (TPM, PIT family) |
| Operating Voltage Range | — | [DATA_NEEDED: VDD min/max] |
| نطاق درجة حرارة التشغيل | — | -40C to +125C (automotive grade; verify per suffix) |
| Debug Interface | — | BDM (Background Debug Mode) |
| Lead-Free / Halogen-Free | — | Lead-Free per NXP packaging standards |