MC9S08DZ60AMLC vs MC9S08DZ60MLC Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S08DZ60AMLC disebabkan oleh NXP Semiconductors dan MC9S08DZ60MLC disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MC9S08DZ60AMLC | MC9S08DZ60MLC |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Aktif |
| Core | HCS08 (CISC, 8-bit) | — |
| CPU Frequency | 40 MHz (20 MHz bus) | — |
| Program Memory | 60 KB Flash | — |
| RAM | 4 KB | 4 KB |
| EEPROM | 2 KB | — |
| Tegangan Pemberi Arus | 2.7 V to 5.5 V | — |
| ADC | 24-channel, 12-bit, 2.5 us conversion | 12-bit (channels vary by package) |
| CAN Interface | 1x MSCAN (CAN 2.0A/B) | — |
| SCI / UART | 2 | — |
| SPI | 1 | — |
| I/O Pins | 40 (32-LQFP exposed count varies by mux) | — |
| LCD Driver | Up to 8x36 segments | — |
| Timers | TPM channels included | — |
| Kemasan | 32-LQFP (7x7 mm, 0.5 mm pitch) | 32-LQFP (7x7 mm) |
| Suhu Operasi | -40 C to +125 C (automotive grade) | — |
| Status RoHS | Compliant | Compliant (per distributor listings) |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Core Architecture | — | HCS08 (S08 family) - 8-bit |
| CPU Core | — | HCS08 with HC08 instruction set (plus BGND) |
| Core Clock Frequency | — | 40 MHz |
| Internal Bus Speed | — | 20 MHz |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| EEPROM / Emulated EEPROM | — | [DATA_NEEDED: EEPROM size] |
| Jenis Pemasangan | — | Surface Mount (Gull Wing) |
| Maximum GPIO | — | 53 GPIO + 1 input-only (family-wide; 32-LQFP exposed subset) |
| Bilangan Pin | — | 32 |
| Interrupt Sources | — | Up to 32 |
| CAN Module | — | MSCAN (CAN 2.0B) - 1 channel |
| Timers / PWM | — | Multiple (TPM, PIT family) |
| Operating Voltage Range | — | [DATA_NEEDED: VDD min/max] |
| Gambaran Suhu Operasi | — | -40C to +125C (automotive grade; verify per suffix) |
| Debug Interface | — | BDM (Background Debug Mode) |
| Lead-Free / Halogen-Free | — | Lead-Free per NXP packaging standards |