MC9S08DZ60AMLC vs MC9S08DZ60MLC Perbandingan
Perbandingan bersamaan detil MC9S08DZ60AMLC dari NXP Semiconductors dan MC9S08DZ60MLC dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MC9S08DZ60AMLC | MC9S08DZ60MLC |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Aktif |
| Core | HCS08 (CISC, 8-bit) | — |
| CPU Frequency | 40 MHz (20 MHz bus) | — |
| Program Memory | 60 KB Flash | — |
| RAM | 4 KB | 4 KB |
| EEPROM | 2 KB | — |
| Tegangan Pemuat | 2.7 V to 5.5 V | — |
| ADC | 24-channel, 12-bit, 2.5 us conversion | 12-bit (channels vary by package) |
| CAN Interface | 1x MSCAN (CAN 2.0A/B) | — |
| SCI / UART | 2 | — |
| SPI | 1 | — |
| I/O Pins | 40 (32-LQFP exposed count varies by mux) | — |
| LCD Driver | Up to 8x36 segments | — |
| Timers | TPM channels included | — |
| Paket | 32-LQFP (7x7 mm, 0.5 mm pitch) | 32-LQFP (7x7 mm) |
| Suhu Kerja | -40 C to +125 C (automotive grade) | — |
| Status RoHS | Compliant | Compliant (per distributor listings) |
| Level MSL | [DATA_NEEDED: MSL level] | — |
| Core Architecture | — | HCS08 (S08 family) - 8-bit |
| CPU Core | — | HCS08 with HC08 instruction set (plus BGND) |
| Core Clock Frequency | — | 40 MHz |
| Internal Bus Speed | — | 20 MHz |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| EEPROM / Emulated EEPROM | — | [DATA_NEEDED: EEPROM size] |
| Tipe Mounting | — | Surface Mount (Gull Wing) |
| Maximum GPIO | — | 53 GPIO + 1 input-only (family-wide; 32-LQFP exposed subset) |
| Jumlah Pin | — | 32 |
| Interrupt Sources | — | Up to 32 |
| CAN Module | — | MSCAN (CAN 2.0B) - 1 channel |
| Timers / PWM | — | Multiple (TPM, PIT family) |
| Operating Voltage Range | — | [DATA_NEEDED: VDD min/max] |
| Rentang Suhu Kerja | — | -40C to +125C (automotive grade; verify per suffix) |
| Debug Interface | — | BDM (Background Debug Mode) |
| Lead-Free / Halogen-Free | — | Lead-Free per NXP packaging standards |