MC9S08DZ60AMLC vs MC9S08DZ60MLC Karşılaştırma

Ayrıntılı yan yana karşılaştırma MC9S08DZ60AMLC tarafından NXP Semiconductors ve MC9S08DZ60MLC tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.

NXP Semiconductors
MC9S08DZ60AMLC MC9S08DZ60AMLC - 8-bit 60KB Flash CAN MCU, 32-LQFP | NXP

MC9S08DZ60AMLC - 8-bit 60KB Flash CAN MCU, 32-LQFP | NXP

MC9S08DZ60AMLC Nrnd
NXP Semiconductors
MC9S08DZ60MLC MC9S08DZ60MLC - 8-bit S08DZ MCU, 60KB Flash, 32-LQFP | NXP

MC9S08DZ60MLC - 8-bit S08DZ MCU, 60KB Flash, 32-LQFP | NXP

MC9S08DZ60MLC ✓ Aktif

Özellik Karşılaştırması

Parametre MC9S08DZ60AMLC MC9S08DZ60MLC
Marka NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Yaşam Döngüsü Durumu NRND Aktif
Core HCS08 (CISC, 8-bit) —
CPU Frequency 40 MHz (20 MHz bus) —
Program Memory 60 KB Flash —
RAM 4 KB 4 KB
EEPROM 2 KB —
Besleme Gerilimi 2.7 V to 5.5 V —
ADC 24-channel, 12-bit, 2.5 us conversion 12-bit (channels vary by package)
CAN Interface 1x MSCAN (CAN 2.0A/B) —
SCI / UART 2 —
SPI 1 —
I/O Pins 40 (32-LQFP exposed count varies by mux) —
LCD Driver Up to 8x36 segments —
Timers TPM channels included —
Paket 32-LQFP (7x7 mm, 0.5 mm pitch) 32-LQFP (7x7 mm)
İşletim Sıcaklığı -40 C to +125 C (automotive grade) —
RoHS Durumu Compliant Compliant (per distributor listings)
MSL Seviyesi [DATA_NEEDED: MSL level] —
Core Architecture — HCS08 (S08 family) - 8-bit
CPU Core — HCS08 with HC08 instruction set (plus BGND)
Core Clock Frequency — 40 MHz
Internal Bus Speed — 20 MHz
Program Memory (Flash) — 60 KB (60K x 8)
EEPROM / Emulated EEPROM — [DATA_NEEDED: EEPROM size]
Montaj Türü — Surface Mount (Gull Wing)
Maximum GPIO — 53 GPIO + 1 input-only (family-wide; 32-LQFP exposed subset)
Pin Sayısı — 32
Interrupt Sources — Up to 32
CAN Module — MSCAN (CAN 2.0B) - 1 channel
Timers / PWM — Multiple (TPM, PIT family)
Operating Voltage Range — [DATA_NEEDED: VDD min/max]
İşletim Sıcaklığı Aralığı — -40C to +125C (automotive grade; verify per suffix)
Debug Interface — BDM (Background Debug Mode)
Lead-Free / Halogen-Free — Lead-Free per NXP packaging standards

Dökümanlar & Kaynaklar

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