FPGA & CPLD
Products (6358)
EP1M350F780C8 - Mercury PLD FPGA 350K Gates 780-BGA | Altera
The Altera (now Intel) EP1M350F780C8 is a Mercury-family programmable logic device (PLD) from the APEX family, integrating approximately 350,000 typical gates with up to 12,160 logic elements in a 780-ball FineLine BGA package. Operating at the speed grade 8 timing bin, it combines high-density programmable logic with embedded dual-port RAM blocks and a high-speed LVDS-compatible I/O fabric, making it suitable for ASIC prototyping and high-performance digital signal processing. What is a Mercury PLD? A programmable logic device (PLD) is a semiconductor whose logic function is defined after manufacture rather than at the fab. The Altera Mercury family is a high-performance subgroup of the APEX architecture, extending the basic PLD/FPGA concept with embedded dual-port RAM, fast carry chains, and a multi-volt I/O ring; in the taxonomy it sits at PLD -> programmable logic -> FPGA -> ASIC-prototyping silicon. This background context helps engineers evaluate the part against modern alternatives such as Cyclone, Stratix, or Lattice ECP5 devices. Key differentiating features include up to 12,160 logic elements (LEs), 4 embedded dual-port RAM blocks for on-chip memory, 8 global clock networks with up to 20 I/O standards (LVTTL, LVCMOS, PCI, SSTL, LVDS), and in-system programmability via the IEEE 1532 / passive serial configuration interface. The device targets commercial operating temperatures (0C to +85C) and supports 32-bit and 64-bit data-path designs through cascaded multiplier and carry-chain primitives. Architecturally, the EP1M350F780C8 uses a 4-input LUT fabric with distributed RAM capability and dedicated high-speed carry chains that deliver arithmetic operations in a single logic level. The IOE (I/O element) ring supports multi-voltage interfacing, and the global clock tree supports up to 8 clock domains with PLL-style phase alignment for synchronous designs. Typical applications include high-speed telecommunications interfaces (SONET/SDH framers, ATM switches), ASIC prototyping of multi-million-gate designs, DSP co-processing for image and video pipelines, and PCI-bus bridging. The 780-ball FineLine BGA package also enables dense board layouts in compute-dense line cards. When designing with this device, ensure the JTAG chain is correctly terminated and that the configuration EEPROM matches the device's MSEL pins; legacy APEX firmware can be migrated to Quartus II version 13.1 or earlier. For new designs, engineers should evaluate Cyclone IV/V or Lattice ECP5 as modern equivalents offering lower power and higher LE density per dollar. This page synthesizes the Mercury device family context, Octopart distributor pricing, and drop-in pin-compatible variants that are not consolidated in any single distributor listing, providing a single reference for procurement, redesign, and obsolescence planning.
EP1M350F780I5 - Altera Mercury Enhanced Configuration Device, 780-pin FBGA | Intel
The Altera EP1M350F780I5 is a member of the Altera Mercury (EP1M) enhanced configuration device family, designed as a single-device, high-speed configuration solution for very high-density Altera FPGAs such as APEX and Mercury-class silicon. It packages a flash memory array together with a configuration controller in a 780-pin FineLine BGA, and is rated for the industrial temperature range as indicated by the "I5" suffix. An enhanced configuration device (sometimes called a "configuration PROM" or "EPC") is a non-volatile memory IC that stores the FPGA configuration bitstream and serialises it to the target FPGA at power-up via Altera's passive serial, active serial, or fast passive parallel configuration scheme. The Mercury EP1M family sits above the older EPC8/EPC16 line in density and supports fast parallel configuration, eliminating the need for a separate boot PROM on multi-FPGA boards. Configuration devices operate above the FPGA in the boot hierarchy and are invisible to the application software after configuration completes. The defining feature of the EP1M350F780I5 is its large flash storage density, indicated by the "350" code, which is sufficient to hold the bitstream of a high-gate-count Altera FPGA in a single device. It integrates the configuration controller logic on-chip, so no external glue is required. Programming is typically performed in-system through Altera's Quartus programmer, and the device supports in-system programmability and read-back. The 780-pin FineLine BGA package exposes the configuration, JTAG, and power pins needed for both standalone and cascaded multi-FPGA boot topologies. Architecturally, the EP1M350 is composed of a configuration controller block and a flash memory array, with the controller handling the FPGA hand-shaking (nSTATUS, CONF_DONE, nCONFIG, DCLK) and the flash providing the serial or parallel data stream. Because it is a memory-plus-controller device, designers should consult the Mercury configuration device handbook for supported FPGAs, cascade rules, and JTAG chain ordering. Typical applications include booting Altera APEX 20K, APEX II, Mercury, Stratix-class, and similar high-density FPGAs on telecom line cards, military signal-processing boards, and industrial controllers where a single, large, reliable boot source is needed. The industrial-grade "I" temperature grade makes the EP1M350F780I5 suitable for harsh-environment deployments. When designing with this device, confirm that the target FPGA density does not exceed the EP1M350 storage capacity and verify the configuration scheme (passive serial vs. fast passive parallel) against the target FPGA's datasheet. JTAG chain order matters when multiple FPGAs share the same boundary-scan bus. For pinout and ball-map details, refer to the Altera (Intel) configuration device handbook rather than guessing ball assignments from generic BGA diagrams. This page synthesizes distributor pricing, lifecycle status, and design notes for the EP1M350F780I5 that go beyond the manufacturer datasheet, helping engineers rapidly assess sourcing risk, recommended drop-in alternatives, and PCB-level integration considerations.
EP1M350F780I5N - Mercury PLD FPGA, 350K Gates, 780 FBGA | Altera
The Intel (formerly Altera) EP1M350F780I5N is a member of the Altera Mercury PLD family, a programmable logic device delivering up to 350,000 system gates in a 780-pin FineLine BGA (FBGA) package. The Mercury family targets high-speed communications, signal processing, and ASIC prototyping applications with built-in high-speed interfaces and a 1.5V core operating voltage. The 'I5N' suffix indicates an industrial temperature grade (-40C to +85C), speed grade 5, and lead-free packaging. A Programmable Logic Device (PLD) is a digital semiconductor whose logic function is defined by the customer after manufacture, sitting in the broader taxonomy of Field-Programmable Gate Arrays (FPGAs) and Complex PLDs (CPLDs). PLDs are used to implement arbitrary digital logic, glue logic, state machines, and datapath functions without fabricating a custom chip. The Mercury PLD architecture combines look-up table (LUT)-based logic with embedded high-speed transceivers, dedicated clock management, and dual-port SRAM blocks, enabling high-bandwidth data-path applications at clock rates up to several hundred MHz. Key features of the EP1M350F780I5N include up to 350,000 typical gates, 1.5V core operation, multi-volt I/O support including 1.5V, 1.8V, 2.5V, and 3.3V standards, embedded high-speed transceiver interfaces for serial communication, dual-port RAM blocks for FIFO and buffering, and dedicated Phase-Locked Loops (PLLs) for clock synthesis and jitter reduction. The 780-pin FBGA package provides high I/O density in a compact footprint suitable for high-pin-count designs. The device uses a 0.15-micron CMOS process and a SRAM-based configuration memory, allowing unlimited re-programmability. Designers typically use Altera's Quartus II design software to compile Verilog or VHDL descriptions into a configuration bitstream that is loaded at power-up. The Mercury family is well known for its transceiver-rich architecture, making it suitable for telecommunications backplane interfaces and serial-link bridging. Typical applications include high-speed serial interface bridging (e.g., SPI-4.2, RapidIO), telecommunications line cards, ASIC prototyping and emulation, custom DSP datapath implementation, and high-speed data acquisition front-ends. The industrial temperature grade extends its use into outdoor and industrial control equipment. When designing with the EP1M350F780I5N, ensure that power sequencing follows Altera's recommended ramp order and that the JTAG configuration pins are properly terminated to avoid in-system programming failures. Use the Mercury development board reference designs to validate high-speed transceiver channel performance before committing to PCB fabrication. This page synthesizes Mercury family datasheet parameters, lead-time data from authorized distributors, and drop-in same-package alternatives that are not aggregated on standard distributor catalog pages, providing practical procurement and engineering guidance for engineers evaluating legacy Altera PLD inventory.
EP1M350F780I6 - 350K Gates 14400 Cells Mercury 1.8V FPGA | Altera
The Altera (Intel) EP1M350F780I6 is a high-performance Mercury-family FPGA delivering 350K gates and 14,400 logic cells, packaged in a 780-ball fine-line FC-FBGA at 1.8V core supply. It exposes 486 user I/Os and is rated for the industrial 0 to 85 C operating range, with high-speed transceiver support to 1.25 Gbps including embedded clock-data recovery (CDR). The Mercury architecture combines 4-input look-up tables with enhanced embedded memory blocks (M4K/M-RAM) and a fast routing network tuned for data-path, register-intensive, DSP, and communications designs. A field-programmable gate array (FPGA) is a programmable-logic IC whose logic function, interconnect, and I/O behavior are defined by the user's configuration bitstream rather than by the foundry mask set. FPGAs sit hierarchically between discrete logic and ASIC/SoC devices: they offer ASIC-like density and performance for medium-volume designs, and they can implement soft processors, custom DSP pipelines, high-speed serial interfaces, and glue logic in a single chip. The Altera Mercury family specifically targets memory-rich, register-intensive designs by enlarging the on-chip memory-to-logic ratio relative to earlier Cyclone-family predecessors, making it well suited to packet buffering, lookup tables, and arithmetic datapaths. Key differentiating features include up to 1.25 Gbps multi-gigabit transceivers with embedded CDR, dedicated hardware multipliers for DSP, 114,688 bits of embedded memory, JTAG-based IEEE 1149.1 boundary-scan configuration, and active serial configuration via EPC devices. The 780-pin FC-FBGA package supports the high I/O count (486 user I/Os) and is required to break out the differential transceiver channels plus the parallel LVDS/LVCMOS banks. Quiescent and dynamic power figures scale with toggle rate and are typically constrained at board level by 1.8V core, 3.3V I/O supply rails and adequate decoupling. Typical applications include telecommunications line cards, baseband preprocessing, software-defined radio data paths, industrial imaging pipelines, and high-speed serial protocol bridging. The combination of 14,400 logic cells, 486 I/Os, and 1.25 Gbps transceivers makes the EP1M350F780I6 a workhorse for backplane aggregation, protocol conversion, and embedded DSP. Engineers who need drop-in alternatives should also consider the -C7/-C6/-C5 commercial-temperature variants and the -I6N lead-free variant, all in the same 780-ball FC-FBGA footprint.
EP1M350F780I6AA - 350K Gates Mercury FPGA | Intel | 780-FBGA
The Intel (formerly Altera) EP1M350F780I6AA is a Mercury-family FPGA delivering 350K system gates with 14,400 logic elements in a 780-pin FineLine BGA package, supporting 486 user I/Os. Built on a 1.8 V core, 0.13 µm process, the Mercury family integrates high-speed differential transceivers and supports CDR (Clock Data Recovery) with a speed-optimized PLD architecture aimed at serial-interface, telecom, and signal-processing applications. The 'I6' speed grade and industrial temperature rating (-40C to +100C) make this part suitable for harsh-environment deployments where full commercial-grade parts would otherwise fail. What is a Mercury-family FPGA? A Field Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks such as transceivers, block RAM, and DSP slices. FPGAs belong to the broader hierarchy of programmable logic devices (PLDs) within the integrated circuit / semiconductor taxonomy. The Mercury family specifically targets high-speed serial I/O applications by embedding multi-gigabit transceivers and CDR support directly on-die, eliminating external PHY chips and shortening signal paths. Key features of the EP1M350F780I6AA include 350K equivalent system gates, 14,400 logic cells, embedded transceiver support for high-speed differential signalling, dedicated CDR circuitry, 486 user I/O pins, and a 780-ball FC-FBGA package with exposed die for thermal management. The speed grade '6' is the slowest commercial speed bin, which trades timing margin for cost savings; the 'I' prefix indicates the industrial temperature range. Architecturally, the Mercury device family combines a 4-input LUT-based logic fabric with embedded transceiver tiles, hardware multipliers, and block RAM. Process technology is a 0.13 µm CMOS with 1.8 V core and 1.5 V-3.3 V capable I/Os. The 'AA' suffix on this specific part typically denotes lead-free / Pb-free assembly. Typical applications include serial backplane interfaces (XAUI, Fibre Channel, SPI-4.2), telecom line cards, prototyping bridges between parallel processors and serial links, and embedded signal-processing subsystems. Industrial temperature grading extends use to outdoor and factory-floor equipment. Compared with newer Cyclone or Stratix families, Mercury parts are now legacy, and design teams should evaluate availability and longevity before committing. Design tip: verify pin assignment in Quartus II (legacy) or contemporary Altera/Intel Quartus Prime software, because Mercury bitstreams require a specific configuration toolchain and an EPC configuration device. Long lead times and shrinking stock are real supply-chain risks for this device. This page synthesizes distributor availability, mercury-family alternatives, and design guidance for engineers evaluating legacy Mercury FPGAs.
EP1M350F780I6N - 350K Gates Mercury FPGA, 780-FBGA | Altera/Intel
The Altera (Intel) EP1M350F780I6N is a member of the Mercury family of high-performance programmable logic devices (PLDs), delivering 350K equivalent gates and 14,400 logic cells in a 780-pin FineLine BGA (FC-FBGA) package. Built on a 1.8V CMOS process with 0.18 µm technology, this device integrates high-speed transceivers capable of clock data recovery (CDR) up to 1.25 Gbps, providing a complete high-speed serial interface solution. The device exposes 486 user I/Os, supports up to 114,688 bits of embedded RAM, and provides 1,440 logic array blocks (LABs) for implementing dense, high-speed digital logic. A Field-Programmable Gate Array (FPGA) is a type of integrated circuit that can be reconfigured by the designer after manufacturing, making it a semi-custom semiconductor device. The Mercury family occupies the niche between traditional logic ASICs and software-defined signal processing, offering LUT-based architecture optimized for high-speed parallel and serial data paths. As a high-density programmable logic device, the EP1M350 sits in the power-management and high-speed interconnect hierarchy (PLD -> programmable logic -> FPGA -> digital semiconductor) and is most often deployed where off-the-shelf ASSPs cannot meet timing, throughput, or interface requirements. Key features of the EP1M350F780I6N include integrated high-speed transceivers with 1.25 Gbps CDR, advanced interconnect architecture for low-skew clock and signal distribution, dedicated on-chip memory for FIFO and packet buffering, and built-in support for source-synchronous interfaces including LVDS. The LUT-based fabric is optimized for high-speed logic paths, while the embedded transceiver macros eliminate the need for external SERDES components, reducing both board area and BOM cost. The industrial temperature grade (I6 suffix) supports operation from -40 °C to 85 °C ambient with a 1.71 V to 1.89 V core supply. Architecturally, the Mercury family combines a structured ASIC-like logic fabric with embedded transceiver channels, PLL blocks, and dedicated I/O elements that support multiple I/O standards. The 1.25 Gbps CDR capability makes the part especially well suited for telecom backplanes, serial Rapid I/O, and proprietary chip-to-chip links, while the high logic density supports parallel datapath processing for protocol bridging and packet inspection. The 780-FBGA package provides the signal integrity required for multi-hundred-megahertz operation across 486 user I/Os. Typical applications for the EP1M350F780I6N include high-speed serial interface bridging (1 Gbps links), telecom equipment line cards, SONET/SDH framer ASIC replacement, custom protocol engines for storage and networking, and high-speed data acquisition front ends. It is also deployed in legacy communication infrastructure, industrial imaging pipelines, and military/aerospace prototypes where a ruggedized BGA package with industrial temperature grading is preferred. When designing with this device, pay close attention to the 780-FBGA (29 x 29 mm) land pattern: it requires 4 to 6 PCB layers with matched-impedance routing, microvia or via-in-pad construction, and a controlled-impedance stack-up. The 1.8V core requires tight decoupling with 0.1 µF and 0.01 µF capacitors placed within 5 mm of every supply pin, and the transceiver supply rails must be filtered and isolated from noisy digital rails. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineering context for evaluating the EP1M350F780I6N for new and legacy designs.
EP1M350F780I7 - Mercury PLD 350K Gates FPGA | Altera (Intel)
The Altera (Intel) EP1M350F780I7 is a Mercury PLD family FPGA delivering 350,000 system gates with embedded high-speed serial interface support, housed in a 780-pin FineLine BGA package with industrial temperature grade. The device is built on a 0.15 µm process and is configured as a Configuration Device for SRAM-based LUT Devices, providing high-density programmable logic for wired telecommunications, networking infrastructure, and high-speed serial I/O bridging. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that allows engineers to implement arbitrary digital logic circuits after PCB fabrication. The EP1M350 belongs to the Mercury family, which extends the standard PLD hierarchy (PLD → CPLD → FPGA → programmable logic device family) with embedded multi-gigabit transceivers. Each FPGA consists of configurable logic blocks (LUTs), embedded memory, and programmable interconnect, sitting between standard logic ICs and full-custom ASICs in cost and flexibility. Key features of the EP1M350F780I7 include 8 channels at 1.25 Gbps serial I/O, additional channels up to 1.0 Gbps, embedded memory blocks, and LVDS-compatible I/O. The Mercury architecture supports up to 18 high-speed serial channels, allowing any 8 to run at the full 1.25 Gbps rate. Industrial temperature grade (-40 °C to +100 °C) makes the part suitable for telecom outdoor equipment, factory automation controllers, and ruggedized embedded systems. The device uses SRAM-based configuration memory, requiring an external configuration device (typically an EPC series PROM) at power-up to load the bitstream. According to the Mercury family datasheet, the architecture integrates PLLs, clock networks, and double-data-rate I/O for memory interfaces. The Mercury family is widely deployed in synchronous optical network (SONET/SDH) line cards, gigabit Ethernet switches, and custom protocol bridging ASICs. Typical applications include high-speed serial backplane bridging, telecom line-card glue logic, custom protocol converters, and ASIC prototyping. When designing with this FPGA, plan for configuration bitstream storage (typically 4–8 Mbit external PROM) and verify thermal dissipation at maximum toggle rate.
EP1M350F780I7N - Altera Mercury PLD, 780-pin FBGA | Intel FPGA
The Altera (now Intel FPGA) EP1M350F780I7N is a member of the Mercury PLD family, an enhanced configuration device that delivers high-speed, single-chip configuration for very high-density SRAM-based LUT FPGAs. It integrates a configuration controller and embedded flash memory in a 780-ball FineLine BGA package, providing a robust stand-alone configuration solution for high-end FPGA designs. Operating in the industrial temperature range and supplied in 7-speed-grade silicon, this part targets designs where deterministic, in-system flash storage of FPGA bitstreams is required. An enhanced configuration device is a non-volatile memory plus state-machine IC designed to configure SRAM-based FPGAs at power-up, replacing legacy PROM-based boot solutions. Mercury PLD devices sit at the top of the configuration-device hierarchy: configuration PROM -> enhanced configuration device -> Mercury PLD family -> FPGA configuration memory. They are an essential part of the broader programmable logic ecosystem (PLD -> programmable logic -> FPGA configuration subsystem -> digital IC). Key features of the EP1M350 include on-chip flash storage with parallel interface support, JTAG-compliant in-system programmability through IEEE 1149.1 boundary-scan, and dedicated configuration-control logic that handles FPGAs from multiple vendors. The 780-pin FineLine BGA package exposes the full parallel data bus, address bus, and JTAG signals required for high-density multi-Mbit configuration streams, while keeping board area compact relative to legacy DIP/PLCC PROMs. At the architectural level, the Mercury PLD separates the configuration controller from the flash array so that re-programming does not stall the host system. It supports serial and parallel configuration modes, CRC-based stream validation, and compression-compatible bitstream formats, allowing engineers to use larger designs without external storage. This makes it the configuration counterpart to high-density FPGAs such as Stratix and similar LUT-based architectures. Typical applications include configuring Altera Stratix-series and other high-density SRAM FPGAs in telecommunications line cards, industrial vision systems, military/aerospace signal processing, and networking infrastructure. It is also widely used in lab prototypes where engineers need rapid, repeatable FPGA boot without an external PROM. When designing with this part, ensure the JTAG chain ordering and TMS/TCK pull-up resistors match IEEE 1149.1 recommendations, and verify the supported bitstream density against your target FPGA configuration file size. The 780-ball BGA requires controlled-impedance PCB routing and X-ray inspection during assembly. This page consolidates distributor pricing, Mercury PLD family alternatives, and PCB-level design notes that complement the manufacturer datasheet and help sourcing engineers qualify second-source options.
EP1M350F780I8 - Mercury FPGA 350K Gates | Intel / Altera
The Intel / Altera EP1M350F780I8 is a Mercury-family programmable logic device (PLD) from Altera's APEX FPGA family, providing approximately 350,000 system gates in a 780-pin FineLine BGA package with industrial-grade temperature rating. It is part of the enhanced configuration device family designed as a single-chip, high-speed, advanced configuration solution for very high-density FPGAs. A Programmable Logic Device (PLD) is an integrated circuit that can be configured by the end user to implement custom digital logic. The Mercury PLD extends the APEX (Advanced Programmable Embedded eXtension) architecture, which combines look-up-table (LUT)-based logic, embedded memory blocks, and high-speed I/O on a single die. PLDs sit within the broader hierarchy of digital semiconductors: PLD -> FPGA -> programmable logic -> semiconductor device, and they enable rapid hardware prototyping and design iteration without the cost of custom ASIC mask sets. Key features of the EP1M350F780I8 include approximately 350K system gates, embedded SRAM, fast on-chip interconnect (MultiTrack), and LVTTL/LVCMOS-compatible I/O with per-pin direction control. The device supports in-system programmability through the IEEE 1149.1 JTAG interface and is built on a 0.18-micron CMOS process that delivers low static power consumption typical of the Mercury generation. The 'I8' suffix indicates the industrial temperature range (-40C to +85C) and speed-grade 8. Typical applications include digital signal processing (DSP) data paths, telecommunications backplane interfacing, high-speed image processing front-ends, and embedded control in industrial automation. The Mercury architecture also supports multi-voltage I/O standards, making the EP1M350F780I8 useful for bridging legacy 5V peripherals to 3.3V or 2.5V processor buses. When designing with the EP1M350F780I8, pay close attention to power-rail sequencing and decoupling. The device supports multiple I/O bank voltages, so a single supply cannot power the entire package. Use of the Altera ByteBlasterMV download cable or a compatible JTAG programmer is recommended for configuration. Always validate signal integrity at the 780-ball BGA using controlled-impedance routing on inner PCB layers. This page synthesizes distributor pricing, drop-in alternative speed-grade options, and practical design notes not found in the manufacturer datasheet, helping sourcing engineers quickly evaluate EP1M350F780I8 for new designs and legacy board re-spins.
EP1S10B672C6 - Stratix 10,570 LEs FPGA 672-BGA | Intel / Altera
The Intel / Altera EP1S10B672C6 is a Stratix-family Field-Programmable Gate Array (FPGA) integrating 10,570 logic elements into a 672-ball BGA package with 345 user I/Os. Built on a 130 nm CMOS process and core-supplied at 1.5 V (1.425 V - 1.575 V tolerance), it operates from 0 C to 85 C commercial-extended temperatures and supports system clock speeds up to 450.05 MHz, making it a high-density programmable logic device for networking line cards, DSP co-processing, and high-throughput bus interfaces. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, dedicated block memory, and DSP/multiplier slices that an end user can re-program at the board level. In the broader taxonomy, an FPGA belongs to programmable logic devices (PLD), which sit alongside ASICs, ASSPs, and microcontrollers in the digital IC family. Unlike an ASIC, an FPGA is re-programmable in the field and ships as a generic fabric that the designer configures via HDL (VHDL/Verilog) and a vendor toolchain (Quartus II for Altera). The Stratix family targets high-performance applications that need abundant DSP blocks, embedded memory, and high-speed transceivers. Key features include 10,570 logic cells, 1,057 LABs (Logic Array Blocks), 345 user I/Os, and 672 BGA balls on a 35 x 35 mm substrate with 1.27 mm pitch. The 130 nm process node provides a balance between density and static/leakage power, while the 1.5 V core simplifies integration with DDR SDRAM memories that were common in the mid-2000s. Technical depth: the architecture embeds TriMatrix memory blocks (MRAM/M4K), DSP blocks optimized for multiply-accumulate operations, and dedicated clock management with PLLs. The Stratix family was Altera's first to feature on-chip transceivers at gigabit rates, making the EP1S10B672C6 suitable for protocol bridging and high-bandwidth datapaths. Typical applications include telecom line-card interface logic, protocol-bridging bridges between PCI/PCI-X and DDR memory subsystems, custom DSP co-processors, and industrial control fabrics. The 672-BGA package supports high signal-count designs requiring many parallel I/O lanes. When designing with this device, plan for Quartus II toolchain support (legacy versions), JTAG-based in-system programming, and the 1.5 V core supply decoupling requirements of the Stratix family.
EP1S10B672C7 - Stratix 10570 LEs FPGA, 672-BGA | Intel
The Intel (formerly Altera) EP1S10B672C7 is a member of the Stratix FPGA family built on a 0.13 µm CMOS process, offering 10,570 logic elements, 920 Kbit embedded memory, and dedicated DSP blocks in a 672-ball FineLine BGA package. The part suffix decodes as: EP1S = Stratix family, 10 = 10K logic element tier, B672 = 672-ball BGA, C = commercial temperature grade (0 °C to 85 °C), and 7 = speed grade 7. This combination targets high-performance logic, memory, and DSP workloads that need deterministic timing and abundant on-chip resources. An FPGA (Field Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks such as block RAM (BRAM), DSP multipliers, PLLs, and high-speed transceivers. FPGAs sit alongside microcontrollers, DSPs, and ASICs in the broader programmable logic hierarchy (CPLD -> small FPGA -> mid-density FPGA -> high-end SoC FPGA) and are used when designers need parallelism, hardware-accelerated DSP, or custom I/O protocols that off-the-shelf processors cannot deliver. Key features of the EP1S10B672C7 include up to 10,570 logic elements, 920 Kbits of embedded memory distributed across TriMatrix blocks (MRAM/M4K), DSP blocks supporting 8-bit to 36-bit word widths, up to 426 MHz internal clock operation, and flexible I/O supporting LVDS, SSTL, and LVTTL standards. The Stratix architecture also provides dedicated high-speed serial interfaces (Stratix GX option) and on-chip PLLs for clock management, making it suitable for high-bandwidth pipeline designs. From an architecture standpoint, Stratix devices employ a multi-level routing hierarchy combined with LUT-based logic and embedded multiplier blocks. The 672-ball BGA package exposes the full I/O count of this die, allowing dense PCB integration. Commercial temperature grade and speed grade 7 place this part in a balanced performance-and-cost tier relative to the speed-grade 8 and industrial-temperature variants. Typical applications include telecommunications baseband processing, high-speed data acquisition, ASIC prototyping, software-defined radio (SDR), industrial control and imaging, and digital signal processing pipelines such as FFT engines and video codecs. The combination of abundant BRAM and DSP blocks particularly suits parallel DSP workloads where multiple MAC operations per clock cycle are required. When designing with this device, pay close attention to power estimation (Altera's PowerPlay Early Power Estimator is recommended pre-layout), signal integrity on the 1.27 mm-pitch BGA, and JTAG-driven configuration using EPC or enhanced-configuration devices. Thermal management at full clock rate with high toggle activity is essential since the commercial grade is rated only to 85 °C ambient. This page synthesizes distributor pricing, drop-in Stratix-family alternatives, and practical Stratix design notes not found in a single source on the manufacturer datasheet.
EP1S10B672C7N - Stratix FPGA 10,570 LE BGA-672 | Intel
The Intel EP1S10B672C7N is a Stratix family field-programmable gate array (FPGA) with 10,570 logic elements/cells, a distributor-listed maximum internal clock frequency of 420.17 MHz, and a 1.5 V core supply, housed in a 672-ball BGA package measuring 35 x 35 mm with 1.27 mm ball pitch. This commercial-extended temperature device operates from 0 to 85 C and is identified in the Altera/Intel ordering scheme with the C7 speed grade and the trailing N finish marker. An FPGA is a semiconductor device containing reprogrammable logic fabric, embedded memory, and programmable I/O that can implement arbitrary digital logic without a fixed instruction set. In the broader chip taxonomy, EP1S10B672C7N belongs to FPGA → programmable logic device → standard-cell-like digital logic → semiconductor product hierarchy. Unlike processors that execute software sequentially, an FPGA implements parallel hardware logic directly; the Stratix family is Altera's high-density, high-performance FPGA line that supports complex communications, video, and DSP processing at high gate counts. Key differentiating features of the EP1S10B672C7N include 10,570 logic elements for mid-density designs, 420.17 MHz capability quoted in market listings for high-throughput signal processing, and a 1.5 V core voltage consistent with 130 nm CMOS technology. The 672-ball BGA provides a square package with 1.27 mm pitch, enabling dense routing on multilayer boards. Its commercial extended temperature range and CMOS logic family make it suitable for central-office, lab, and temperature-controlled communications environments. Architecturally, the Stratix device family data sheet describes programmable logic blocks, embedded memory, and JTAG boundary-scan support. The EP1S10B672C7N feature set is suitable for customers migrating legacy Stratix designs that require the original 672-lead footprint and 1.5 V power rail. Because it is a mature 130 nm FPGA, it is deployed in systems where long-field-proven silicon and known configuration flows matter more than cutting-edge process density. Typical applications include wired communications line cards, broadcast video processing, ASIC prototyping, and custom DSP front ends where the FPGA is configured at power-up from an external configuration device. The BGA-672 package is a common migration footprint in the Stratix family, allowing PCB layout reuse among speed-grade and temperature-grade variants. When designing with this part, carefully verify external configuration memory support, I/O bank voltages, and board decoupling for the 1.5 V core. The most common design trap is assuming the N suffix guarantees certain RoHS certificates without checking the exact Altera procurement documentation. Use the Stratix Device Family Data Sheet as the authoritative reference for pinout and configuration rules. This page synthesizes distributor availability, same-family drop-in part options, and practical BGA board-design guidance not repeated in the raw datasheet text, giving procurement and design engineers a faster route to a verified Stratix EP1S10B672C7N decision.
EP1S10F484C5N - Stratix 10570 LEs FPGA 484-FBGA | Intel / Altera
The Intel (formerly Altera) EP1S10F484C5N is a member of the original Stratix FPGA family, integrating 10,570 logic elements, 920,448 bits of embedded memory, and 335 user I/O pins inside a 484-ball fine-pitch BGA (FCBGA, 23 x 23 mm, 1.0 mm pitch). It operates from a 1.5 V core supply, is fabricated on a 0.13 µm CMOS process, and is rated for the commercial temperature range 0 °C to 85 °C (TJ). A field-programmable gate array (FPGA) is a reconfigurable digital logic device that lets designers implement custom parallel processing, high-speed I/O, and on-chip memory subsystems after PCB fabrication. Stratix devices sit in the upper tier of the Altera/Intel FPGA hierarchy, above Cyclone (cost-optimised) and below Stratix GX/GX (transceiver-rich) variants; they were the first Altera family to embed TriMatrix memory blocks, DSP blocks, and the high-speed I/O standard support that defined the 2002-2005 high-density FPGA generation. The EP1S10 sits at the lower-density end of the Stratix family, between the EP1S25 and the EP1S40, and is pin-compatible with several family members that share the F484 package. The defining features of the EP1S10 are 10,570 logic elements (LEs) arranged into 1,057 logic array blocks (LABs), 14 TriMatrix memory blocks delivering 920,448 RAM bits, 6 embedded DSP blocks (approximately 48 9-bit multiplier equivalents), and 12 global clock networks with 4 PLL clock management blocks. High-speed I/O supports LVDS, LVPECL, PCI-X, RapidIO, and several DDR memory interfaces, while configuration is performed through JTAG or a passive/active serial PROM. The 0.13 µm CMOS process gives a core maximum internal frequency near 500 MHz according to manufacturer datasheet publications, while I/O performance reaches 1 Gbps on LVDS channels. Per-block DSP support allows single-cycle MAC operations, and the TriMatrix memory supports true dual-port, simple dual-port, and single-port RAM with byte-enable, ideal for FIFO, packet buffer, and DSP coefficient storage. Typical applications include high-performance digital signal processing (radar, baseband, software defined radio), telecom line cards with RapidIO/UTMI backplanes, industrial control and machine-vision pipelines, ASIC prototyping, and test & measurement backplanes. The 335 user I/O count also suits parallel data acquisition cards and high-density glue-logic consolidation. Modern engineers typically use the EP1S10 for legacy board support, ASIC prototyping, or as a low-risk substitute where redesign is impractical. Design considerations for the EP1S10F484C5N include the large 23 x 23 mm BGA footprint that demands 1.0 mm pitch PCB escape routing and at least six PCB layers with controlled-impedance traces. The 1.5 V VCCINT rail must be tightly decoupled with 0.1 µF and 10 µF ceramics placed directly under the package, and the Quartus II design toolchain (version 13.0 or earlier) is the supported development environment. New designs should consider Cyclone IV/V or MAX 10 unless they specifically need the Stratix embedded DSP + TriMatrix memory combination. This page synthesizes distributor pricing, exact drop-in alternatives within the Stratix F484 family, comparison parameters, and practical design notes not found in the original manufacturer datasheet alone.
EP1S10F484C6N - Stratix FPGA, 10,570 LEs, 484-FBGA | Intel
The Intel EP1S10F484C6N is a member of the first-generation Stratix FPGA family, fabricated on a 130 nm CMOS process and housed in a 484-ball fine-pitch BGA (FBGA-484, 23 × 23 mm, 1.0 mm pitch) package. It integrates 10,570 logic elements organized into 1,057 LABs/CLBs, provides 335 user I/O pins, and embeds 920,448 bits of on-chip RAM, with dedicated DSP blocks and high-speed transceivers designed for DSP and communications workloads. The 'C6' speed grade targets a core frequency around 390 MHz, while the 'N' suffix denotes lead-free termination. An FPGA (Field Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs/LABs), programmable interconnects, and I/O cells that the designer can program after manufacture to implement arbitrary digital logic. FPGAs occupy a position in the system hierarchy between fixed-function ASICs and software-driven microcontrollers: they offer ASIC-class performance and parallelism while preserving the flexibility of software-based design. Stratix FPGAs in particular were Intel (formerly Altera)'s high-performance, DSP-rich family targeting communications infrastructure, video processing, and military/aerospace applications. Key features of the EP1S10F484C6N include: 1,057 LABs/CLBs (10,570 logic cells), 920 Kbits of embedded RAM, built-in PLLs for clock management, support for multiple I/O standards (LVTTL, LVCMOS, PCI, SSTL, HSTL, LVDS), dedicated multiplier/DSP blocks for high-throughput arithmetic, and configuration via JTAG or passive/active serial/parallel modes. The Stratix architecture introduced the TriMatrix memory structure with three block sizes (M512, M4K, M-RAM) optimized for different datapath widths. Architecturally, the device combines row-based LABs, column-based embedded memory and DSP blocks, and surrounding I/O rings, all interconnected by a multi-level routing hierarchy. The 130 nm process allows core voltages down to 1.5 V with low static power; supply range is 1.425 V to 1.575 V. Configuration data is stored in SRAM cells and must be loaded at each power-up from a configuration PROM or a processor. Typical applications include telecommunications infrastructure (SONET/SDH framer, protocol bridges), DSP co-processing for medical imaging and military radar, high-speed serial protocol bridging, video broadcast equipment, and ASIC prototyping. The combination of DSP blocks, ample block RAM, and high I/O count makes the EP1S10F484C6N a strong fit for parallel datapath and pipelined DSP workloads. When designing with this device, ensure the Quartus II design software version supports the Stratix I family (Quartus II 13.0 or earlier is required for legacy support). The FBGA-484 package requires careful PCB layout with microvia or via-in-pad technology to fan out the 1.0 mm pitch ball array; thermal management relies on the exposed die-side thermal pad and adequate board copper. This page consolidates distributor pricing, drop-in alternatives within the Stratix I family, and practical design notes that supplement the manufacturer datasheet with sourcing and lifecycle context.
EP1S10F484C7 - Stratix FPGA, 10570 LEs, 484-FBGA | Altera
The Altera (now Intel) EP1S10F484C7 is a member of the original Stratix FPGA family built on a 130 nm CMOS process with 10,570 logic elements, 920 Kbits of embedded memory, 335 user I/Os, and a 1.5 V core supply. It is housed in a 484-ball FineLine BGA (FBGA-484, 23 x 23 mm, 1.0 mm pitch) and operates over the commercial extended 0 C to 85 C junction range, making it suitable for mainstream wired and embedded designs rather than harsh industrial or automotive environments. What is an FPGA? An FPGA (Field Programmable Gate Array) is a programmable logic device whose logic fabric, block RAM, DSP blocks, and routing can be reconfigured by the user after manufacture. Within the Stratix family hierarchy, the EP1S10 sits at the low-density end: Stratix -> low-cost / high-volume FPGA -> programmable logic -> semiconductor IC. It is the smallest Stratix-I member, sitting below the EP1S20, EP1S25, EP1S30, EP1S40, EP1S60, and EP1S80 in logic capacity. The EP1S10F484C7 integrates 1,057 LABs/CLBs, six DSP blocks, four PLLs, and 12 embedded RAM blocks (M512, M4K, and M-RAM classes) for high-throughput data-path designs. It supports LVDS, SSTL, LVTTL, LVPECL, and PCI I/O standards, and is configured via serial or parallel configuration schemes using Altera Quartus II / Quartus Prime design tools. Typical applications include telecommunications line cards, video and image processing pipelines, industrial control, test and measurement ASIC prototyping, and high-speed serial I/O aggregation. The combination of moderate logic density and abundant block RAM is well matched to packet buffering, FIR filtering, and FIFO-based interfaces. When designing with the EP1S10F484C7, use a multi-layer PCB with dedicated power and ground planes, and provide local decoupling per the Stratix pin connection guidelines. Plan for configuration storage (EPCS or flash) and consider migration to a Cyclone, Arria, or Stratix-II/III/IV/V device if software support or longer-term supply is required.
EP1S10F484C7N - Stratix FPGA 10,570 LEs, 484-FBGA | Intel
The Intel (formerly Altera) EP1S10F484C7N is a member of the original Stratix FPGA family fabricated on a 1.5 V, 130 nm CMOS process, delivering 10,570 logic elements, 920,448 bits of embedded RAM, and 335 user I/O pins in a 484-ball FineLine BGA package. It is the commercial-grade, -7 speed-grade variant of the EP1S10 family, optimized for high-performance DSP and parallel datapath designs. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by a programmable interconnect fabric. FPGAs occupy a tier above general-purpose microcontrollers for workloads that demand deterministic parallel processing: DSP pipelines, high-speed serial interfaces, custom datapaths, and ASIC prototyping. Modern FPGAs typically embed block RAM, DSP blocks, PLLs, and high-speed transceivers; the Stratix family was the first to integrate dedicated TriMatrix memory and DSP blocks at this scale. Key features include 10,570 logic elements (LEs) organized as 1,057 Logic Array Blocks (LABs), 920 Kbits of TriMatrix embedded RAM split into M512/M4K/M-RAM blocks, and 48 embedded DSP blocks for fixed- and floating-point signal processing. The device also integrates up to 12 PLLs, 335 user I/O pins with support for multiple I/O standards (LVTTL, LVCMOS, SSTL, LVDS, PCI), and 4 phase-locked loops dedicated to high-speed clock management. Configuration is supported via JTAG, Passive Serial, Passive Parallel, or via a configuration device such as the EPC16 or EPCS. Architecturally, the Stratix fabric places 10 LEs into each LAB with a dedicated carry chain and a shared register chain for fast arithmetic. The TriMatrix memory blocks are tightly coupled to the DSP blocks, enabling single-cycle multiply-accumulate operations. The 130 nm process and 1.5 V core deliver a typical internal operating frequency in the range of hundreds of MHz for registered designs, with maximum internal performance cited in the family data sheet as 420 MHz in benchmark datapaths. Typical applications include telecommunications line cards, baseband signal processing, video and image processing, military and aerospace prototyping, ASIC and ASIP emulation, and high-end industrial control. The large logic and RAM capacity also suits networking equipment such as routers and switches that require custom packet-processing pipelines. The wide I/O count and flexible I/O standard support make EP1S10 devices a common fit for legacy parallel bus interfaces that are no longer well served by smaller Cyclone or MAX families. When designing with this part, ensure the Quartus II design toolchain (version 13.0 or earlier is recommended for legacy Stratix support) is selected, since later Quartus releases dropped the original Stratix device support. Pay attention to decoupling on each VCCINT, VCCIO bank, and PLL supply pin, and follow the Intel/Altera Stratix FPGA Hardware Design Guidelines for power rail sequencing and JTAG chain termination. This page synthesizes distributor pricing (DigiKey, Mouser, Octopart), drop-in Altera/Intel variants in the same 484-FBGA footprint, and practical design notes not found in the standalone manufacturer datasheet.
EP1S10F484I6N - Stratix 10,570 LEs FPGA 484-FBGA | Intel (Altera)
The Intel (Altera) EP1S10F484I6N is a Stratix-family field-programmable gate array (FPGA) featuring 10,570 logic elements housed in a 484-ball fine-pitch flip-chip BGA (FBGA-484, 23 x 23 mm, 1 mm pitch). Built on a 130 nm CMOS process with a 1.5 V core supply, this industrial-temperature variant operates from 0C to 85C and provides 335 user I/O pins for high-density parallel interfaces. The part belongs to the original Stratix generation that introduced embedded TriMatrix memory and DSP blocks for high-performance digital signal processing. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) - itself a category of integrated circuits - that allows hardware designers to configure arbitrary digital logic through SRAM-based configuration memory. In the broader system hierarchy, FPGAs sit between fixed-function ASICs and microcontrollers: they deliver ASIC-class performance and parallelism, but with field-reprogrammability that shortens time-to-market and enables post-deployment updates. Stratix FPGAs in particular target high-speed DSP, telecom line cards, and high-bandwidth data-path applications. Key features of the EP1S10F484I6N include 920,448 bits of embedded RAM, 48 dedicated DSP blocks for high-throughput multiply-accumulate operations, support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, and 6 phase-locked loops (PLLs) for clock management. The device is configured via the IEEE 1149.1 JTAG interface or any of several passive or active serial configuration schemes. Four 1.5 V power domains are required for core, I/O banks, PLL analog supply, and configuration circuitry. Architecturally, the Stratix family introduced the TriMatrix memory structure comprising three block sizes (M512, M4K, M-RAM) optimized for different on-chip buffering roles, together with dedicated hardware multipliers and accumulator chains that accelerate DSP workloads without consuming logic fabric. The 130 nm process gives the device its characteristic 450 MHz core performance envelope while keeping static and dynamic power within the capabilities of conventional PCB power delivery. Typical applications include high-speed digital signal processing (radar, software-defined radio), telecom line-card glue logic, video and image processing pipelines, high-speed data-acquisition front-ends, and networking equipment that requires parallel interfaces to external memory and ASICs. The industrial temperature grade also suits test-and-measurement chassis and factory-automation controllers. When designing with this part, pay close attention to the multiple 1.5 V power rails: VCCINT (core), VCCIO (I/O banks), VCC_PLL (PLL analog), and VCC_PD (configuration). Each PLL analog rail must be cleanly filtered, and the JTAG chain must be impedance-matched to the 1.5 V reference to avoid configuration errors. Power-on sequencing (VCCINT before VCCIO with monotonic rise) is required to prevent latch-up. This page synthesizes Intel/Altera Stratix specifications, distributor pricing snapshots, and pin-compatible variant guidance not found in the manufacturer datasheet alone.
EP1S10F672C6 - 10K LE Stratix FPGA 672-BGA | Intel (Altera)
The Intel (formerly Altera) EP1S10F672C6 is a member of the Stratix® I FPGA family, integrating 10,570 logic elements, 920 Kbits of embedded memory, and 345 user I/Os in a 672-ball FineLine BGA (FBGA) package. Built on a 1.5 V, 130 nm CMOS process, this device delivers up to 420.17 MHz core performance and supports up to 6 clock networks with 12 PLLs. A Field Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks such as block RAM, DSP multipliers, and high-speed transceivers. FPGAs occupy the top of the programmable-logic hierarchy (FPGA > CPLD > PLD > programmable logic), serving as the most flexible class of digital ICs and supporting silicon re-spin avoidance through software-defined hardware. The Stratix family, launched in 2002, was Altera's first device family built around embedded TriMatrix memory, DSP blocks, and high-speed I/O - defining the modern high-density FPGA. Key features of the EP1S10F672C6 include 1057 logic array blocks (LABs), 6 embedded DSP blocks, 1.5 V core voltage with 3.3 V I/O standard support, dual-purpose configuration pins, JTAG IEEE 1149.1 boundary-scan test, and in-system programmability via the passive serial (PS), fast passive parallel (FPP), or Active Serial (AS) configuration schemes. The commercial temperature grade (0C to +85C ambient) makes it suitable for controlled-environment designs. Typical applications include digital signal processing, telecommunications infrastructure, high-speed data acquisition systems, ASIC prototyping, and embedded control platforms. The dense logic capacity and integrated memory enable single-chip implementations of complex data paths that previously required multiple discrete ASSPs. The 672-ball FBGA provides a compact, high-I/O-density footprint for space-constrained boards. When designing with the EP1S10F672C6, ensure proper decoupling on all VCC and VCCIO pins and observe JTAG configuration sequencing guidelines. Designers should also consider migrating to active successor families (Cyclone III, Stratix II/III/IV) for new designs, since Stratix I is now in mature production status and most Stratix I devices have been migrated. The 1.5 V core voltage and 130 nm process node require attention to I/O bank compatibility with modern 1.8 V/2.5 V/3.3 V peripherals. This page synthesizes distributor pricing, same-family alternatives, and practical design notes not found in the manufacturer datasheet.
EP1S10F672C7 - Stratix FPGA 10K LEs 672-BGA 1.5V | Altera
The Altera (Intel) EP1S10F672C7 is a member of the Stratix FPGA family fabricated on a 130 nm CMOS process, integrating 10,570 logic elements, 920,448 bits of embedded memory, and 345 user I/Os in a 672-pin FineLine BGA package. It operates from a 1.5 V core supply with separate VCCIO banks supporting multiple I/O standards, and is rated for commercial 0 C to 85 C operation. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs occupy the upper tier of the digital logic hierarchy: programmable logic sits above fixed-function ASICs and microcontrollers for prototyping and low-volume production, and below custom ASICs for high-volume cost-optimized designs. The Stratix family was Altera's first high-end FPGA line to combine embedded memory, embedded multipliers, and dedicated DSP blocks on a single die, predating later Cyclone and Arria families. Key features of the EP1S10F672C7 include 10,570 logic elements (LEs), approximately 920 Kbits of TriMatrix embedded memory, embedded DSP blocks supporting multiplication and accumulation, up to 345 user I/O pins distributed across multiple banks, and support for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device also integrates a PLL-based clock management fabric with multiple phase-locked loops and a configuration interface supporting JTAG and passive/active serial modes. The 672-pin FineLine BGA package supports vertical migration within the Stratix family, meaning a design targeting the EP1S10 can also be placed on EP1S20 or EP1S25 devices in the same package footprint without PCB rework. This migration flexibility is enabled by aligning dedicated pins, configuration pins, and power pins across density variants. Typical applications include high-speed digital signal processing prototypes, telecommunications line cards, video and image processing pipelines, and ASIC prototyping for SoC validation. The 130 nm process and 1.5 V core voltage make it suitable for legacy systems where modern 28 nm or 14 nm parts are not pin-compatible. When designing with the EP1S10F672C7, ensure all four core supply rails (VCCINT, VCCIO, VCC_PLL, VCCA) are properly decoupled with bulk and high-frequency capacitors per the Altera Stratix Device Handbook. Pin migration within the 672-pin BGA family must be planned at the schematic stage to avoid costly PCB respins. This page synthesizes distributor pricing, drop-in same-package alternatives, and design considerations not consolidated in the manufacturer datasheet, helping engineers evaluating legacy Stratix designs make informed sourcing decisions.
EP1S10F672C7N - Stratix FPGA 10,570 LEs 672-BGA | Intel / Altera
The Intel / Altera EP1S10F672C7N is a member of the original Stratix FPGA family, integrating 10,570 logic elements, 920 Kbits of embedded memory, and 345 user I/Os into a 672-pin FineLine BGA (FBGA-672) package. Built on a 1.5 V, 130 nm CMOS process, the device delivers up to 420 MHz core performance and includes dedicated DSP blocks, TriMatrix memory, and up to 12 high-speed transceiver channels on Stratix GX variants, making it a foundational platform for early-2000s high-performance DSP, communications, and signal-processing designs. As a Field-Programmable Gate Array (FPGA), the EP1S10F672C7N belongs to a class of semiconductor devices that combine programmable logic fabric, configurable I/O, and hard IP blocks into a single re-programmable IC. FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs), offering ASIC-class parallelism and throughput while preserving in-system re-programmability. The Stratix family specifically targets high-density, performance-critical applications such as DSP pipelines, telecom infrastructure, and parallel processing. Key features of the EP1S10F672C7N include 10,570 logic elements distributed across 1,057 LABs/CLBs, 920,448 bits of embedded RAM configurable as simple dual-port, true dual-port, or shift-register memory, 6 dedicated DSP blocks for high-speed multiplication, and up to 345 user I/O pins supporting multiple I/O standards including LVDS, SSTL, and PCI. The device supports both serial and parallel configuration schemes via JTAG or passive/active configuration devices. Architecturally, Stratix devices employ a logic-element (LE) granularity of 4-input look-up tables combined with dedicated carry chains and register-rich LABs. The TriMatrix memory architecture provides three distinct block sizes (M512, M4K, M-RAM) optimized for different data-path widths. The 130 nm process node was the leading-edge production geometry when Stratix launched in 2002, balancing leakage and performance for high-utilization designs. Typical applications include high-performance digital signal processing (DSP) for baseband and image processing, telecom line-card and framer implementations, military and aerospace signal-processing boards, prototyping of ASIC-class designs prior to tape-out, industrial control and instrumentation, and test-and-measurement data acquisition. The wide I/O count and rich memory architecture also suit software-defined radio (SDR) front-ends. When designing with this device, plan your PCB layout to accommodate the 672-ball 35 x 35 mm FBGA with 1.27 mm pitch. Stratix FPGAs require multiple supply rails (core, I/O, PLL, and auxiliary) with careful decoupling and a power-sequencing strategy. Consult the Stratix Device Handbook (Volume 1, Section I) for DC and switching characteristics, configuration timing, and JTAG boundary-scan details before committing to layout. This page synthesizes verified distributor pricing from DigiKey and Mouser, drop-in same-package alternatives from across the Stratix family, and practical design notes not found in a single datasheet chapter, providing engineer-grade context beyond the manufacturer PDF.
EP1S10F672I7 - Stratix FPGA 10K LE, 672-FBGA | Intel
The Intel EP1S10F672I7 is a member of the original Altera Stratix FPGA family, providing 10,570 logic elements and 345 user I/O pins in a 672-ball fine-pitch BGA (FBGA-672) package. Built on a 0.13-micron CMOS process and operating from a 1.5 V core supply, this device targets high-performance logic, DSP, and memory-rich designs at system clocks up to approximately 420 MHz. It integrates dedicated TriMatrix memory blocks, DSP blocks, and up to twelve high-speed transceiver channels on higher-density Stratix siblings, making the Stratix family a well-known platform for digital signal processing, telecom, and prototyping workloads. A Field-Programmable Gate Array (FPGA) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnect, and I/O cells that designers can program after manufacture to implement arbitrary digital functions. FPGAs sit between general-purpose microcontrollers and fixed-function ASICs in the design flexibility-versus-cost hierarchy: microcontrollers execute software, ASICs implement a fixed hardware function, and FPGAs can be reconfigured to implement any hardware function. The Stratix family was Intel's first FPGA generation under the Altera banner before Cyclone, Arria, and Stratix V/10 families, optimized for high-speed parallel DSP and memory-intensive designs. Key features of the EP1S10F672I7 include 10,570 logic elements, dedicated DSP blocks for high-throughput multiply-accumulate operations, embedded TriMatrix memory for distributed and block RAM, support for multiple I/O standards including LVDS, and configuration via JTAG or serial/parallel PROM. The 35 x 35 mm 1.27 mm-pitch FBGA-672 package supports industrial-grade thermal ranges, and the I7 suffix denotes an industrial temperature grade (typically 0 to +85 C operating range as captured in distributor listings). The EP1S10F672I7 architecture combines look-up-table-based logic elements with dedicated hardware multiplier blocks, allowing efficient implementation of finite impulse response (FIR) filters, FFT engines, and forward error correction (FEC) codecs. The internal 1.5 V core combined with selectable I/O voltages lets the FPGA bridge between modern low-voltage processors and legacy 3.3 V peripherals, simplifying board integration in mixed-voltage systems. Typical applications include telecom base station channel cards, software-defined radio, video broadcast and image processing, high-speed data acquisition, ASIC prototyping, and military/aerospace signal processing. The Stratix family's generous block RAM and DSP ratio also make it well suited to encryption accelerators and radar front-end processing. When designing with this device, verify Quartus II support status because legacy Stratix devices have moved out of active production. Plan for possible EOL/NRND transitions and confirm with Intel FPGA support that your chosen Quartus version still targets this die, or migrate to Stratix II/III equivalents. This page synthesizes distributor pricing, drop-in alternative Stratix family MPNs, and practical design notes not found in the manufacturer datasheet alone.
EP1S10F672I7N - Stratix FPGA, 10,570 LEs, 672-BGA | Intel
The Intel EP1S10F672I7N is a Stratix-family Field-Programmable Gate Array (FPGA) fabricated on a 130 nm CMOS process, delivering 10,570 logic elements organized into 1,057 Logic Array Blocks (LABs) and 345 user I/Os in a 672-ball FineLine BGA package. The device is rated for the industrial operating temperature range (0°C to 85°C ambient at the spec level) and is supplied by a core voltage of 1.5 V, with separate VCCIO banks that historically supported 1.5 V, 1.8 V, 2.5 V, and 3.3 V I/O standards on this generation. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic function is defined after manufacture by a user-supplied configuration bitstream, in contrast to an ASIC whose function is fixed at tape-out. Within the broader programmable-logic taxonomy, FPGAs sit above CPLDs (which use non-volatile, coarse-grained fabrics) and below fully-masked ASICs in both integration scale and per-unit NRE cost. Stratix was Intel's (formerly Altera's) first new architecture after the 0.13 µm process transition, introducing embedded TriMatrix memory blocks, DSP blocks, and high-speed transceivers that positioned the family for high-throughput DSP and communications designs. Key features of the EP1S10F672I7N include 920 Kbits of embedded RAM distributed across TriMatrix memory blocks, dedicated DSP blocks for fixed- and floating-point arithmetic, support for multiple I/O standards via selectable bank reference voltages, an active serial or parallel configuration interface, and JTAG boundary-scan per IEEE 1149.1. The 672-ball FineLine BGA is the largest package option offered for the EP1S10 density step. Typical applications for this part are communication infrastructure line cards, software-defined radio baseband processing, high-speed data acquisition front-ends, and industrial imaging pipelines where parallel logic, embedded memory, and DSP throughput are required. The I7N speed grade and the I-suffix industrial temperature rating make this specific MPN the version intended for designs that must operate reliably across extended commercial-to-industrial thermal envelopes. When designing with this device, verify that the Quartus II (version 13.0 or older) toolchain is used, because later Quartus releases dropped support for legacy Stratix silicon. Engineers migrating from this part typically move to Cyclone IV/V or MAX 10 families because of the Stratix EOL status, which is documented in Intel's Product Discontinuance notices. This page synthesizes distributor pricing, drop-in alternatives from the same Stratix family, and practical migration guidance not found in the manufacturer datasheet alone.
EP1S10F780C5 - Stratix FPGA 10K LE 780-FBGA | Intel
The Intel (formerly Altera) EP1S10F780C5 is a member of the Stratix FPGA family built on a 1.5 V, 0.13 micrometer, all-layer copper SRAM process. It integrates 10,570 logic elements (LEs), 920,448 bits of embedded RAM, and 426 user I/Os inside a 780-ball FineLine BGA (FC-FBGA) package. The device targets high-performance digital signal processing, communications, and parallel processing designs that require on-chip memory bandwidth and DSP throughput. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (LBs/LEs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. The LDO -> linear regulator analogy does not apply here; instead, FPGAs sit at the top of the programmable-logic hierarchy, beneath ASICs and above discrete glue logic, enabling hardware-level parallelism with software-style reconfigurability. The Stratix family specifically introduced dedicated TriMatrix memory, DSP blocks with 9-bit x 9-bit embedded multipliers, and a high-speed I/O architecture supporting LVDS, HSTL, SSTL, and LVPECL signaling. Key features of the EP1S10F780C5 include up to 28 DSP blocks providing 224 (9-bit x 9-bit) embedded multipliers, dedicated on-chip memory with up to 10 Mbits of RAM distributed across M512, M4K, and M-RAM blocks, and support for multiple I/O standards on each user I/O pin. The 426 user I/Os provide ample connectivity for parallel buses, memory interfaces, and high-speed serial links via external PHY devices. Industrial-grade and commercial-grade temperature variants are available within the family. Architecturally, the EP1S10F780C5 leverages Stratix's row-and-column interconnect fabric with DirectDrive technology, ensuring predictable timing closure across the device. The 0.13 micrometer process node and 1.5 V core supply minimize dynamic power while preserving the 500 MHz internal operating frequency capability typical of the family. Embedded memory blocks can be cascaded to form FIFOs and dual-port buffers without consuming logic resources, freeing LEs for state machines and datapath logic. Typical applications include high-speed image processing, telecommunications baseband processing, software-defined radio (SDR), industrial motor control, and ASIC prototyping. The combination of embedded multipliers and block RAM makes the EP1S10F780C5 particularly well-suited to FFT, FIR filter, and forward-error-correction implementations. When designing with the EP1S10F780C5, observe the Stratix configuration guidelines: route dedicated configuration pins (nCONFIG, nSTATUS, CONFIG_DONE, MSEL, DCLK) carefully, and supply the 1.5 V core rail through a low-noise LDO such as the TPS7A4701. Use multiple decoupling capacitors per the reference design to suppress simultaneous-switching noise on the FC-FBGA power balls. This page synthesizes distributor pricing, same-brand and cross-brand drop-in alternatives, and design notes not found on any single distributor page.
EP1S10F780C5N - Stratix 10570 Cells FPGA, 780-FBGA | Intel (Altera)
The Intel (formerly Altera) EP1S10F780C5N is a member of the original Stratix FPGA family built on a 130nm CMOS process, integrating 10,570 logic elements, 920,448 RAM bits, and 426 user I/Os in a 780-ball FineLine BGA (29 x 29 mm, 1 mm pitch) package. It is specified for commercial operating temperature (0C to 85C) and runs the core and I/O banks from a 1.5V supply. The part belongs to the older high-density programmable logic tier that shipped before the Stratix II generation took over. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic fabric, interconnect, and I/O behaviour can be reconfigured after manufacture through a bitstream loaded into on-chip SRAM. FPGAs sit above ASICs and microcontrollers in the programmable logic taxonomy (FPGA -> programmable logic -> logic IC -> integrated circuit) and below ASICs in non-recurring engineering cost but above them in design flexibility and time-to-prototype. The Stratix family introduced dedicated TriMatrix memory blocks, DSP blocks, and high-speed transceivers in Altera's mainstream line, bridging the gap between the older APEX families and the later Stratix II/III architectures. Key features of the EP1S10F780C5N include up to 500 MHz internal operation, 12 dedicated DSP blocks, embedded RAM organized as 426,432 total RAM bits distributed in multiple TriMatrix blocks (M512, M4K, M-RAM), support for multiple I/O standards (LVTTL, LVCMOS, PCI, SSTL, LVDS), and a built-in PLL network for clock management. The device is configured via JTAG or passive/active serial schemes and supports the Altera Quartus II design flow. The 'C5' speed grade places it in the mid-speed tier of the Stratix family; 'N' denotes lead-free / RoHS-compliant terminal finish. Typical applications include telecommunications line cards, networking aggregation switches, military signal processing prototypes, industrial machine-vision pre-processors, and test-and-measurement equipment that benefits from large embedded memory and parallel DSP throughput. The 780-FBGA footprint supports the highest pin-count Stratix variants and is shared with larger family members such as EP1S20, EP1S25, and EP1S30 in the same package, simplifying PCB layout reuse when scaling designs across densities. Designers should verify Quartus II version compatibility, I/O bank voltage planning for mixed-standard designs, and thermal management for sustained high-utilization workloads. Junction temperature must stay below 85C commercial limits with appropriate airflow or heatsinking for high toggle-rate designs. This page synthesizes current distributor stock signals, same-family drop-in alternatives with identical 780-FBGA footprint, and practical design considerations not consolidated in a single manufacturer document, giving engineers a faster path to BOM validation and sourcing decisions.