FPGA & CPLD
Products (6358)
EP1S10F780C6 - Stratix 10570-Cell FPGA, 780-BGA | Altera
The Altera (Intel) EP1S10F780C6 is a member of the original Stratix FPGA family, delivering 10,570 logic elements, 920,448 RAM bits, and 426 user I/O pins in a 780-ball fine-pitch BGA package (29x29 mm, 1.0 mm pitch). It is fabricated on a 130 nm CMOS process and operates from a 1.5 V core supply, with the commercial 'C' speed grade rated for 0C to 85C ambient operation. A Field Programmable Gate Array (FPGA) is a programmable logic device that lets designers implement arbitrary digital circuits - from glue logic to full processor subsystems - in silicon via an SRAM-based configuration bitstream. FPGAs sit within the broader hierarchy of programmable logic devices (PLD), and the Stratix family was Altera's high-end, DSP-rich flagship line before being succeeded by Stratix II/III/IV/V. The 'EP1S' prefix denotes the first-generation Stratix family, with '10' indicating approximately 10K logic elements, 'F' marking the flip-chip BGA package, '780' giving the ball count, 'C' the commercial temperature range, and '6' the speed grade. Key features include 1,057 LABs/CLBs, 10570 logic elements/cells, 920448 bits of embedded RAM (TriMatrix memory), support for up to 17 DSP blocks for high-speed fixed- and floating-point math, and 426 user I/O pins that interface to external LVDS, LVTTL, LVPECL, SSTL, and HSTL standards via dedicated True-LVDS circuitry. The device includes dedicated high-speed serial I/O capability, embedded multipliers, and a PLL/DLL rich clock tree for jitter-clean distribution. The Stratix architecture uses a 1.5 V core with separate VCCIO banks for I/O flexibility, logic and routing fabric built on a 130 nm process, and on-chip configuration memory that must be loaded at every power-up from an external flash or via JTAG. The 'C6' commercial speed grade balances logic performance and dynamic power, making the part a common fit for cost-sensitive high-volume prototypes that need Stratix-class DSP and memory bandwidth. Typical applications for the EP1S10F780C6 include telecom baseband and channel-card signal processing, high-speed serial protocol bridging (custom SERDES glue), military/aerospace video and DSP processing subsystems, and industrial prototyping of ASIC-replacement designs. It is also widely used in test-and-measurement custom backplanes, image processing pipelines, and educational platforms teaching RTL design on real silicon. When designing with this part, ensure the 1.5 V core rail and VCCIO banks are properly decoupled (typically 0.1 uF + bulk per bank), use Altera Quartus II (legacy) or Quartus Prime for synthesis and place-and-route, and follow the Stratix pin connection guidelines for unused I/O and JTAG pins. Note that Stratix I is a mature/NRND family - verify long-term availability before committing to new designs. This page synthesizes distributor inventory, mature Stratix family cross-reference data, and design guidance that is not consolidated in any single vendor PDF.
EP1S10F780C6N - Stratix FPGA 10K LEs, FBGA-780, 1.5V | Intel
The Intel (formerly Altera) EP1S10F780C6N is a member of the Stratix FPGA family fabricated on a 1.5 V, 130 nm CMOS process, integrating 10,570 logic elements (LEs), 1,200 configurable logic blocks (CLBs), and 920 Kbit of embedded memory in a 780-ball fine-pitch BGA (FBGA-780, 29 x 29 mm, 1 mm pitch). It is a field programmable gate array (FPGA) oriented toward high-performance digital logic, DSP, and memory-rich designs operating at a maximum internal clock frequency around 450 MHz, with 1.5 V core supply and 3.3 V/2.5 V multi-voltage I/O support. What is a Stratix FPGA? A field programmable gate array (FPGA) is a semiconductor device based on a matrix of configurable logic blocks (CLBs) connected by programmable interconnect, augmented with dedicated hard IP such as block RAM, DSP blocks, PLLs, and (in Stratix) high-speed transceivers. Within the broader taxonomy, EP1S10F780C6N belongs to: FPGA -> programmable logic -> digital ASIC alternative -> semiconductor IC. FPGAs are used when designers need hardware-level parallelism, fast time-to-market, and post-silicon flexibility unavailable in fixed ASICs. Key features include 10,570 LEs, 1,200 CLBs, 920 Kbits of embedded RAM, dedicated DSP blocks, multiple PLLs, and high-speed LVDS I/O. The device also integrates a hard-core configuration controller with JTAG (IEEE 1149.1) and supports passive serial, fast passive parallel, and passive parallel asynchronous configuration schemes through EPC configuration devices. Technical depth: the 130 nm Stratix architecture introduced the TriMatrix memory structure (three block RAM sizes for flexible FIFO/buffering) and DSP blocks optimized for multiply-accumulate operations, enabling efficient implementation of FIR filters, FFT engines, and video processing pipelines. The 780-ball FBGA package provides abundant I/O (up to 426 user I/O per FindIC, depending on bank configuration) and good signal-integrity performance for high-speed interfaces. Typical applications for the EP1S10F780C6N include digital signal processing (DSP) for communications and video, high-speed data acquisition, industrial control and instrumentation, networking line cards, and prototype ASIC replacement. It is also used in test and measurement equipment where custom parallel processing is required. Design consideration: this is a 1.5 V core device; PCB designers must provide a low-noise core supply (typically an LDO or high-frequency buck regulator), careful power-plane decoupling, and matched-length routing for high-speed LVDS pairs. Confirm that your Quartus II version supports this device. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
EP1S10F780C7 - Stratix FPGA 10,570 LEs 780-FBGA | Intel / Altera
The Intel / Altera EP1S10F780C7 is a member of the original Stratix FPGA family built on a 130 nm CMOS process, integrating 10,570 logic elements, 920,448 bits of embedded RAM, and 426 user I/O pins in a 780-ball Fine-Pitch Ball Grid Array (FC-FBGA) measuring 29 mm × 29 mm with a 1.0 mm ball pitch. According to the Stratix device family data sheet, the device operates from a 1.5 V core supply, supports up to 420.17 MHz internal operation, and is offered in the commercial 0 °C to 85 °C temperature grade as denoted by the 'C7' speed-grade suffix. An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit that lets engineers implement arbitrary digital logic, memory, and high-speed transceiver functions after PCB fabrication, instead of committing to a fixed ASIC design. The Stratix family sits in the broader taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit. FPGAs are commonly deployed for DSP pipelines, custom protocol bridging, ASIC prototyping, and high-throughput parallel processing where fixed-function processors are too slow or inflexible. Key features of the EP1S10F780C7 include 10570 logic elements, 426 maximum user I/O, and 920448 RAM bits distributed across TriMatrix memory blocks. The device also embeds DSP blocks for high-throughput arithmetic, supports LVDS I/O signalling, and offers a dedicated configuration interface (Passive Serial, Fast Passive Parallel, Passive Parallel Asynchronous, and JTAG). It is implemented on a 1.5 V core supply with separate VCCIO banks for mixed-voltage I/O. Architecturally, Stratix devices combine a fine-grained logic element fabric, embedded SRAM, dedicated DSP blocks, and high-speed I/O elements with on-die termination. The 'S' in the prefix marks the device as the Stratix series (rather than Stratix GX / Stratix II). This architecture suits applications that demand deterministic latency, parallel datapath processing, and flexible I/O standard assignment across multiple banks. Typical applications for the EP1S10F780C7 include high-performance DSP acceleration, ASIC prototyping, telecom baseband processing, industrial control and motor control, and test-and-measurement instrumentation. The large pin count and RAM density make it well suited to multi-channel data acquisition systems, video processing engines, and high-speed serial protocol bridging. When designing with this FPGA, engineers must supply the configuration device or JTAG chain, define I/O bank voltages for each bank, and ensure the PCB land pattern matches the 780-ball FC-FBGA 29 × 29 mm 1.0 mm-pitch layout. Thermal management should be considered because the large BGA can dissipate several watts in sustained logic-switching workloads. This page synthesizes Stratix family specifications, current distributor pricing, drop-in same-package alternatives from the Site MPN list, and practical design notes that are not collated in any single manufacturer document.
EP1S10F780C7N - Stratix FPGA 10,570 LEs, 780-FBGA | Intel
The Intel EP1S10F780C7N is a member of the Stratix FPGA family built on a 0.13 μm CMOS process, delivering 10,570 logic elements (LEs) in a 780-pin FineLine BGA (FBGA-780, 29 × 29 mm, 1.0 mm pitch) package. The device integrates 920 Kbits of embedded RAM, dedicated DSP blocks, and up to 426 user I/O pins, with a core supply voltage of 1.5 V and support for multiple I/O standards including LVDS, LVPECL, SSTL, and HSTL. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic architecture, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than fixed at the fab. FPGAs sit at the top of the programmable logic hierarchy: programmable logic -> FPGA -> high-density FPGA -> SoC FPGA. They are widely used to implement custom datapath, glue logic, and signal-processing pipelines that would otherwise require an ASIC or a bank of discrete logic ICs. Key features of the EP1S10F780C7N include 6 dedicated PLL+ DLL blocks for clock synthesis and skew management, embedded multiplier blocks for DSP-style arithmetic, and Stratix-tier TriMatrix memory architecture (MLAB, M512, M4K blocks). The 426 user I/Os support LVDS at up to several hundred Mbps per channel, making the part suitable for high-speed parallel interfaces and external memory controllers (DDR SDRAM, QDR SRAM, ZBT SRAM). The Stratix architecture combines a multi-level routing fabric with embedded array blocks and high-speed serial capability through dedicated serializer/deserializer resources on speed-grade -7 silicon. The C7 speed grade positions the device in the mid-band of the Stratix family, providing a balance of Fmax and power consumption for industrial and commercial designs. Typical applications include telecommunications line cards, ASIC prototyping, image and video processing pipelines, and industrial control systems where a high logic density and rich memory resources are required. The wide I/O count also makes it suitable for test-and-measurement backplanes and high-channel-count data acquisition front-ends. Designers should pay attention to thermal management on the 780-ball FBGA - the Stratix data sheet recommends a minimum 4-layer PCB stack-up with continuous ground and power planes, plus adequate airflow for sustained high-utilization workloads. Configuration scheme selection (AS, PS, JTAG) and dual-purpose pin planning are also critical upfront tasks for any Stratix design. This page synthesizes distributor pricing, drop-in alternative part numbers from the same Stratix family, and practical design notes that go beyond the manufacturer datasheet's typical-application section.
EP1S10F780I6 - Stratix FPGA, 10570 Cells, 780-BGA | Altera/Intel
The Altera (now Intel Programmable Solutions Group) EP1S10F780I6 is a member of the Stratix Field Programmable Gate Array family, featuring 10,570 logic cells, 426 user I/Os, and 1,200 Configurable Logic Blocks (CLBs) in a 780-ball FineLine BGA package. Built on a 1.5 V CMOS process and operating at speeds up to 450 MHz, this device integrates 920,448 bits of embedded memory and is engineered for high-performance digital signal processing, telecommunications infrastructure, and high-speed serial interconnect applications. A Field Programmable Gate Array (FPGA) is a class of programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hardware resources such as block RAM, DSP blocks, and high-speed transceivers on a single die. The Stratix architecture represents the original high-end Altera family that pioneered embedded memory and DSP blocks for high-bandwidth signal processing. Within the broader programmable logic taxonomy, FPGAs sit alongside CPLDs (Complex Programmable Logic Devices) and ASICs (Application-Specific Integrated Circuits), offering ASIC-level performance with field reprogrammability. The Stratix family sits above Cyclone and below Stratix GX/Cyclone series in Altera's hierarchy, targeting applications that demand abundant logic, memory, and I/O bandwidth. Key features of the EP1S10F780I6 include 1057 logic array blocks (LABs), 920,448 RAM bits organized in TriMatrix memory structures, dedicated DSP blocks for high-speed multiply-accumulate operations, and 8 phase-locked loops (PLLs) for clock management. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, and includes True-LVDS and reduced-swing differential signaling on selected banks. A 1.5 V core supply and 1.5 V/1.8 V/2.5 V/3.3 V I/O supplies are configurable per bank. The architecture combines a fine-grained logic fabric with column-based DSP and memory blocks, allowing efficient implementation of high-throughput pipelines. Hard intellectual property (IP) such as embedded multipliers and SERDES-ready PLLs reduces the gate overhead required for typical DSP and serial link functions, enabling multi-gigabit designs on a single device. Typical applications include high-end telecommunications switching equipment, software-defined radio baseband processing, high-performance test and measurement instrumentation, ASIC prototyping platforms, and embedded video/image processing. The 780-pin FBGA package provides the I/O density required for parallel processing interfaces and high-bandwidth memory buses. When designing with this device, ensure proper power supply sequencing (1.5 V core before 3.3 V I/O) to prevent latch-up, and follow Altera's Stratix Hardware Reference Manual guidelines for decoupling, thermal management, and JTAG configuration. Configuration can be loaded via passive serial (PS), fast passive parallel (FPP), or JTAG, with the configuration scheme selected via MSEL pins. This page synthesizes distributor pricing, pin-compatible same-family alternatives, and practical design notes not found in a standalone datasheet PDF.
EP1S10F780I6N - Stratix FPGA 10,570 LEs 780-FBGA | Intel
The Intel EP1S10F780I6N is a member of the original Stratix FPGA family, providing 10,570 logic elements (LEs) organized into 1,057 logic array blocks (LABs) and 426 user I/Os in a 780-ball FineLine BGA package. Built on a 0.13 µm CMOS process, it operates from a 1.5 V core supply and supports configuration via active serial, passive serial, or JTAG. The device includes 920 Kbit of embedded RAM (M512, M4K, and M-RAM blocks), up to 6 PLLs with 16 clock outputs, and up to 12 dedicated high-speed transceiver channels (not populated on the I-grade speed-grade -6 variant), plus dedicated DSP blocks for high-throughput arithmetic. The 780-FBGA package uses a 29 x 29 mm body with a 1.0 mm ball pitch, suitable for moderate-density system designs. A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that allow the hardware function to be redefined after manufacturing. FPGAs sit within the broader programmable logic hierarchy (PAL -> CPLD -> FPGA) and the broader digital logic taxonomy (discrete logic -> ASIC -> ASSP -> FPGA). The Stratix family specifically introduced TriMatrix embedded memory, dedicated DSP blocks, and high-speed transceiver channels, establishing the architectural template later refined in Stratix II/III/IV families. The EP1S10F780I6N delivers this architecture at a lower logic density than Stratix II, making it appropriate for cost-sensitive designs that benefit from the original Stratix feature set without the increased power and complexity of later families. Key features include 10,570 LEs, 1,057 LABs, 426 user I/Os, 920,448 RAM bits (M512/M4K/M-RAM), 6 PLLs with 16 clock outputs, 12 DSP blocks, and 12 transceiver channels capable of up to 840 Mbps LVDS signaling. Speed grade -6 (I6) denotes an industrial operating temperature range of -40 °C to 100 °C ambient with a 6.0 ns core clock period target. Typical applications include high-speed data acquisition backplanes, telecom line-card interfaces, industrial motor control with DSP acceleration, and military/aerospace signal processing. When designing with this part, verify that the Quartus II toolchain (legacy versions 4.x through 9.0 SP2) supports the EP1S10F780 device symbol; modern Quartus versions drop support and require device files from Altera's legacy archive. Power sequencing must respect the 1.5 V VCCINT ramp before VCCIO to prevent I/O latch-up. This page synthesizes legacy Stratix availability, pin-compatible Stratix alternatives, and design notes that are not collected in any single distributor listing.
EP1S20B672C6 - Stratix FPGA 18,460 LEs 672-BGA | Intel / Altera
The Intel (formerly Altera) EP1S20B672C6 is a Stratix family Field Programmable Gate Array (FPGA) housed in a 672-ball FineLine BGA package, built on a 130 nm CMOS process with a 1.5 V core supply. The device integrates 18,460 logic elements, approximately 1,669,248 bits of embedded memory, and 426 user I/O pins, delivering high-density programmable logic for high-performance digital systems. According to the Stratix Device Family Data Sheet, the C6 speed grade targets commercial (0 C to 85 C) operating temperature with a maximum internal clock frequency of 450.05 MHz. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect, allowing hardware designers to implement custom digital circuits after manufacturing. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLD), which sit between application-specific integrated circuits (ASICs) and general-purpose processors in terms of flexibility and performance. The Stratix family, introduced in 2002, was the first Intel/Altera FPGA family to embed TriMatrix memory, DSP blocks, and high-speed transceiver resources on-chip. Key features of the EP1S20B672C6 include 18,460 logic elements, dedicated DSP blocks for high-throughput arithmetic, embedded RAM blocks (TriMatrix memory architecture), up to 426 user I/O pins supporting multiple I/O standards (LVTTL, LVCMOS, LVDS, HSTL, SSTL), and integrated PLLs for clock management. The device also supports configuration via passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), and JTAG modes, enabling flexible in-system programming. The EP1S20B672C6 utilizes a 130 nm SRAM-based configuration cell with a 1.5 V core supply and separate VCCIO banks supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V I/O standards. Its high logic density and embedded memory make it well suited for data-path-intensive designs, while the DSP blocks accelerate FIR filters, FFT engines, and video processing pipelines. The 672-ball FineLine BGA package measures 35 mm x 35 mm with a 1.27 mm ball pitch, providing high I/O density for complex board-level integration. Typical applications include high-speed data acquisition systems, telecommunications baseband processing, video broadcast and image processing, military/aerospace signal processing, and ASIC prototyping. The combination of logic density, DSP throughput, and abundant I/O makes the EP1S20B672C6 a strong fit for parallel-processing architectures that require deterministic latency. When designing with this device, pay close attention to power sequencing of VCCINT and VCCIO rails, signal integrity on high-speed LVDS pairs, and thermal management under sustained switching activity. Use the Quartus II design software for synthesis, place-and-route, and timing closure; legacy Stratix designs require Quartus II version 13.0 or earlier for full device support. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not aggregated on any single manufacturer or distributor page, giving procurement and FPGA design engineers a single decision-ready reference.
EP1S20B672C6N - Stratix FPGA, 18460 LEs, 672-BGA | Intel
The Intel (formerly Altera) EP1S20B672C6N is a member of the original Stratix FPGA family, fabricated on a 0.13 micron CMOS process and offering 18,460 logic elements, 1,669,248 bits of embedded RAM, and 426 user I/O pins in a 672-ball fine-pitch BGA package (35 x 35 mm, 1.27 mm pitch). It is the commercial-temperature, speed-grade 6 variant of the EP1S20 device. A Field Programmable Gate Array (FPGA) is a programmable logic device that lets designers implement arbitrary digital logic, memory, and I/O subsystems in silicon via a hardware description language (HDL) and configuration bitstream. FPGAs sit at the top of the digital logic hierarchy: ASIC > CPLD > FPGA > programmable logic > logic IC > semiconductor. The Stratix family was Intel's first FPGA architecture to embed TriMatrix memory blocks, DSP blocks, and high-speed transceivers together, targeting high-performance DSP, telecom, and data-path designs. Key features of the EP1S20B672C6N include 1,846 Logic Array Blocks (LABs), 1,669,248 bits of embedded SRAM organized as TriMatrix memory (M512, M4K, M-RAM blocks), dedicated DSP blocks for high-speed multiplication, and support for multiple I/O standards including LVDS, SSTL, and HSTL. The device supports core voltage of 1.5 V and I/O voltages configurable per bank. Speed grade 6 is the slowest of the Stratix family grades but offers the lowest cost. Architecture-wise, the Stratix family introduced the Logic Element (LE) as a 4-input LUT-based structure with adjacent register and arithmetic capability, and incorporated dedicated high-speed I/O serdes and PLLs for clock management. The 672-BGA package provides 426 user I/O pins, which can be configured as single-ended or differential pairs, and includes dedicated clock and configuration pins. Typical applications include high-speed digital signal processing, telecommunications line cards, video and image processing pipelines, network switches and routers, and ASIC prototyping. The combination of embedded DSP blocks and large TriMatrix memory makes the EP1S20B672C6N well suited to FIR filters, FFT engines, and protocol bridging designs. When designing with the EP1S20B672C6N, ensure the Quartus II design tool (version supporting Stratix) is used, the configuration scheme (Passive Serial, Fast Passive Parallel, or JTAG) is correctly chosen, and the device's thermal envelope is respected - the BGA package has a fine pitch that demands controlled-impedance PCB layout and adequate cooling for high toggle-rate designs. This page synthesizes distributor pricing, drop-in alternative listings (including same-speed-grade and faster variants), and Stratix-specific design notes not found in the standalone datasheet.
EP1S20B672C7N - Stratix FPGA, 18,460 LEs, 672-BGA | Intel
The Intel (formerly Altera) EP1S20B672C7N is a member of the original Stratix FPGA family, fabricated on a 0.13 µm CMOS process and housed in a 672-ball BGA package (35 × 35 mm, 1.27 mm pitch). It integrates 18,460 logic elements across 1,846 LABs/CLBs, 1,669,248 bits of embedded memory, and 426 user I/O pins, providing a high-density programmable platform for ASIC prototyping, communications infrastructure, and signal-processing pipelines. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and transceivers. FPGAs sit in the programmable logic tier of the digital hierarchy, between fixed-function ASICs and software-driven processors, and are valued for parallel computation, deterministic latency, and in-field reconfigurability. Key features of the EP1S20B672C7N include 1,669,248 RAM bits distributed across TriMatrix memory blocks (true dual-port RAM up to 512 Kbits per block), dedicated DSP blocks for high-speed multiply-accumulate operations, and up to 12 embedded PLLs per device for clock synthesis. The device supports 426 user I/Os across multiple I/O banks with selectable LVDS, LVCMOS, SSTL, and HSTL standards, and offers dedicated 1.5 V core supply operation. Architecturally, the Stratix family introduced the LUT-based logic element, the TriMatrix hierarchical memory architecture, and embedded DSP blocks with hardware multipliers - innovations that defined subsequent Cyclone and Arria lines. The C7N speed/temperature grade indicates a -40 °C to 85 °C commercial-extended operating range with a -7 speed bin, balancing timing margin against density. Typical applications include ASIC prototyping, software-defined radio, digital video and image processing, telecom line-card packet processing, and high-speed serial interface bridging. Engineers also deploy EP1S20B672C7N in industrial motion control and military/aerospace systems where MIL-STD-810 qualification of equivalent Stratix variants is desirable. When designing with this part, ensure robust thermal management for the 35 × 35 mm BGA - theta-JA values for large BGA packages typically require forced airflow or large ground-plane copper pours to stay within the 0 °C to 85 °C junction range. Power sequencing of the 1.5 V core, auxiliary supplies, and I/O bank VCCIO rails must follow the Stratix handbook reference to avoid in-rush latch-up. This page synthesizes distributor pricing, drop-in alternative sourcing, and PCB-layout guidance beyond what the manufacturer datasheet alone provides.
EP1S20F484C5N - Stratix FPGA 18,460 LEs FBGA-484 | Intel
The Intel (formerly Altera) EP1S20F484C5N is a Stratix family Field-Programmable Gate Array (FPGA) built on a 130 nm CMOS process, integrating 18,460 logic elements (LEs), 1,669,248 RAM bits, and 361 user I/Os in a 484-ball FineLine BGA (FBGA-484) package measuring 23 x 23 mm with 1.0 mm pitch. It belongs to the EP1S20 density tier and is speed grade C5 with the commercial 0 to 85 C operating range. A Field-Programmable Gate Array is a semiconductor integrated circuit whose logic functionality is defined after manufacturing by loading a configuration bitstream into on-chip SRAM. FPGAs sit between fixed-function ASICs and software-defined processors in the programmable-logic taxonomy: ASIC -> FPGA -> CPLD -> programmable logic device -> semiconductor. The Stratix family specifically targets high-performance DSP, telecommunications, and high-bandwidth data-path applications by combining general-purpose logic with embedded DSP blocks, embedded TriMatrix memory, and high-speed transceiver capability on the higher-density family members. Key features of the EP1S20F484C5N include 2,6 LABs (Logic Array Blocks, equivalent to the Mouser-reported 1846 LABs when counted by LAB groups), embedded TriMatrix memory with 1,669,248 total RAM bits distributed across MRAM blocks, dedicated 18 x 18 bit hardware multipliers for DSP, support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, and a 1.5 V core supply. Configuration is supported through passive serial (PS), fast passive parallel (FPP), and JTAG modes. Architecturally, the device uses a routed interconnect fabric driven by ALMs composed of 4-input look-up tables, dedicated carry chains, and register chains. The DSP blocks perform 36 x 36 bit multiply-accumulate at the rated speed grade, and the I/O ring supports DDR SDRAM interfaces via dedicated phase-locked delay lines. The 1.0 mm pitch FBGA-484 package is a wire-bond plastic BGA with JEDEC MS-034 moisture sensitivity handling. Typical applications include telecommunications line cards, software-defined radio baseband processing, high-speed serial protocol bridging, video format conversion, and test-and-measurement instrumentation front ends. The EP1S20F484C5N is well suited to designs requiring high logic density plus on-chip memory, without needing the transceiver-rich higher-density Stratix members. When designing with this part, ensure the PCB footprint follows the 1.0 mm pitch FBGA-484 land pattern with proper microvia or via-in-pad escape, four-layer minimum stack-up for power integrity, and decoupling per the Altera Stratix Device Handbook recommendations. This page synthesizes distributor availability, parametric drop-in alternatives from the same Stratix EP1S20 family, and design notes not consolidated in the original Altera datasheet.
EP1S20F484C6N - Stratix FPGA 18,460 LEs, 484-FCBGA | Intel
The Intel (formerly Altera) EP1S20F484C6N is a Stratix family Field-Programmable Gate Array (FPGA) with 18,460 logic elements, fabricated on a 130 nm CMOS process and supplied by a 1.5 V core rail, housed in a 484-ball FineLine BGA (FCBGA) measuring 23 x 23 mm with 1.0 mm pitch. It provides 361 user I/O pins, 1,669,248 bits of embedded memory, and DSP blocks for high-performance signal processing, with system clock performance rated up to 450.05 MHz. The 'C6' suffix designates the commercial speed grade 6 device, while the operating temperature range is 0 to 85 degrees C, making the part suited to indoor, controlled-environment embedded systems. What is an FPGA? A Field-Programmable Gate Array is a programmable logic device that lets engineers implement arbitrary digital logic functions in silicon after manufacture, occupying a position between fixed-function ASICs (lower unit cost, longer development cycle) and processor-based MCUs (higher flexibility, software-defined). Within the programmable logic taxonomy, the EP1S20F484C6N belongs to the high-density, register-rich Stratix family - a generation that introduced embedded TriMatrix memory blocks and DSP blocks - and sits hierarchically under: FPGA > programmable logic device (PLD) > logic IC > integrated circuit. This context matters because cross-brand 'equivalent' searches usually mean functional parity, not bit-for-bit pin compatibility, and Stratix FPGAs rarely have true drop-in second-source replacements due to proprietary configuration bitstreams and toolchains. Key specifications include the 130 nm process technology (1.5 V core, 3.3 V I/O tolerant), 18,460 logic elements organized into Logic Array Blocks (LABs), embedded TriMatrix memory blocks totaling 1,669,248 RAM bits, dedicated DSP blocks for multiply-accumulate operations, embedded transceivers per device variant, 361 available user I/O pins routed through the 484-ball FCBGA, JTAG-based IEEE 1149.1 boundary-scan and configuration, and a serial/parallel configuration interface compatible with the EPC configuration devices. The 450 MHz internal clock capability makes it suitable for high-throughput DSP pipelines. The Stratix architecture pairs logic with on-chip memory and DSP blocks so that signal-processing kernels - filters, FFTs, modulators - can run at full clock speed without external memory round-trips. Combined with the 1.5 V core on 130 nm CMOS, the device balances performance against static power consumption typical for its generation. Typical applications include telecom baseband processing, high-speed imaging pipelines, ASIC prototyping, industrial control and motion-control co-processors, military and aerospace signal processing (in equivalent industrial-grade variants), and test-and-measurement instrumentation. The 484-ball FCBGA and 361 user I/O make it a strong fit for high-pin-count designs requiring parallel high-speed interfaces. When designing with this part, engineers must use the Quartus II design toolchain - configuration bitstreams are not interchangeable with Xilinx or Lattice devices. Plan for the legacy 1.5 V core supply and verify that any drop-in alternative supports the same JTAG IDCODE and AS/PS configuration scheme. Because the part is now mature and nearing end-of-life, long-lead planning and last-time-buy evaluation are strongly recommended. This page synthesizes distributor stock and pricing, pin-compatible Stratix family alternatives, and engineering guidance not found on a single manufacturer datasheet.
EP1S20F484C7 - Stratix FPGA 18460 LEs 484-FBGA | Intel
The Intel EP1S20F484C7 is a member of the original Stratix FPGA family built on a 130 nm CMOS process with a 1.5 V core supply, integrating 18,460 logic elements organized into 1,846 Logic Array Blocks (LABs) and 361 I/O pins in a 484-ball FineLine BGA package measuring 23 mm × 23 mm with a 1.0 mm ball pitch. The C7 speed grade, with maximum internal clock frequencies around 420 MHz, targets high-performance DSP, communications, and bus-interface applications where deterministic logic throughput and rich memory resources are required. An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, and PLLs/clock trees. FPGAs belong to the broader class of programmable logic devices, sit alongside CPLDs, ASICs, and ASSPs in the digital-semiconductor hierarchy, and are typically deployed in the prototyping, low-volume production, or system-on-chip glue-logic layer of an embedded design. The Stratix family is the original high-performance Altera (now Intel) FPGA line and was later succeeded by Stratix II, III, IV, V, and 10 families. Key features include 1,669,248 bits of embedded RAM distributed across multiple TriMatrix memory blocks, high-speed DSP blocks for multiply-accumulate operations, embedded multiplier support, and support for external memory interfaces including DDR SDRAM, FCRAM, QDR SRAM, and SDR SDRAM. The device also integrates high-speed transceiver-ready I/O structures on selected pins, multiple PLLs for clock management, and a JTAG/IEEE 1149.1 boundary-scan test interface. Configuration is supported via passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), and JTAG modes, with optional in-system programmability. From an architectural perspective, the EP1S20F484C7 is fabricated on a 1.5 V, 130 nm process and uses Altera's Logic Element (LE) structure, where each LE contains a 4-input look-up table, a programmable register, and dedicated carry-chain logic. LABs group 10 LEs together with local interconnect, and DirectDrive and MultiTrack global routing minimize interconnect delay. The 484-pin FC-FBGA package uses controlled-collapse chip connection (C4) bumps and flip-chip attach, giving lower parasitic inductance than wire-bond alternatives. Typical applications include telecommunications line cards, military and aerospace signal processing, industrial control and machine vision, medical imaging pipelines, test and measurement instrumentation, and high-speed bus bridges. Designers should consult AN 176 (Stratix design guidelines) and the Stratix Device Handbook for PLL configuration, memory interface timing, and thermal management. This page consolidates distributor pricing, alternative drop-in candidates, and practical design notes beyond the manufacturer datasheet.
EP1S20F484C7N - Stratix FPGA, 18,460 LEs, 484-FBGA | Altera
The Altera EP1S20F484C7N is a member of the original Stratix FPGA family, providing 18,460 logic elements, 1,669,248 bits of embedded memory, and 361 user I/O pins in a 484-ball flip-chip BGA package. The device is fabricated on a 130 nm CMOS process with a 1.5 V core supply and operates at internal clock rates up to 420 MHz. The -C7 speed grade and "N" lead-free suffix indicate commercial temperature range (0 °C to 85 °C) and lead-free / RoHS-compliant packaging. An FPGA (Field Programmable Gate Array) is a programmable logic device whose architecture combines configurable logic blocks (CLBs), programmable interconnect, embedded memory (M4K/M-RAM blocks in Stratix), embedded multipliers (DSP blocks), and high-speed transceivers or PLLs. FPGAs belong to the broader semiconductor hierarchy of programmable logic devices (PLD) and serve as glue logic, co-processors, and prototyping vehicles in digital design. The Stratix family positioned above Cyclone and below Stratix GX in Altera's 2003-era lineup. Key differentiating features of the EP1S20F484C7N include 1,846 LABs (Logic Array Blocks) with 2,132 CLBs, TriMatrix embedded memory totalling 1.7 Mbits with true dual-port RAM capability, dedicated 18x18 multipliers for DSP acceleration, and up to 361 LVDS/TTL-compatible user I/Os. The device supports configuration via passive serial (PS), passive parallel asynchronous (PPA), passive parallel synchronous (PPS), and JTAG modes. Architecture depth: the device uses a row/column-based LAB structure connected by MultiTrack interconnect, with embedded RAM blocks configurable from 128x36 up to 4Kx36 bits. Phase-locked loops (PLLs) handle clock distribution and frequency synthesis, while the 1.5 V core is supported by separate VCCIO banks that allow mixed-voltage I/O interfacing (1.5 V, 1.8 V, 2.5 V, 3.3 V LVTTL/LVCMOS). Typical applications include telecom line cards, video and image processing pipelines, high-speed serial protocol bridging, DSP front-ends, ASIC prototyping, and military/aerospace test equipment. Engineers select the EP1S20F484C7N for designs needing moderate logic density, generous on-chip memory, and a 484-FBGA footprint compatible with commercial-grade thermal envelopes. Design consideration: the 484-FBGA (23x23 mm, 1.0 mm pitch) requires a 4-6 layer PCB with matched-length impedance-controlled routing for LVDS pairs; designers must follow Altera's AN75 pin connection guidelines for unused I/O, JTAG chain, and configuration mode pin strapping. This page synthesizes distributor inventory, parametric specifications, drop-in same-package alternatives, and practical design notes not found in the original manufacturer datasheet, enabling engineers to evaluate the EP1S20F484C7N for both new and legacy designs.
EP1S20F484I6N - Stratix FPGA, 18,460 LEs, 484-FBGA | Intel / Altera
The Intel (formerly Altera) EP1S20F484I6N is a member of the original Stratix family of high-performance Field-Programmable Gate Arrays, offering 18,460 Logic Elements, 1,669,248 RAM bits, and 361 user I/O pins in a 484-ball FineLine BGA (FBGA) package. It is rated for the industrial temperature range (-40C to +85C) and ships as a lead-free, RoHS-compliant device, making it suitable for long-lifecycle industrial, communications, and signal-processing platforms. What is an FPGA? A Field-Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs / LEs), programmable routing, embedded memory blocks, and a growing set of hard IP cores (DSP blocks, transceivers, PLLs, memory controllers). FPGAs sit between general-purpose microcontrollers and fixed-function ASICs: like a microcontroller they are software-configurable, but like an ASIC they achieve hardware parallelism. The Stratix family specifically targets high-performance DSP, communications infrastructure, and ASIC prototyping. Key features of the EP1S20F484I6N include up to 18,460 logic elements, dedicated DSP blocks for high-throughput arithmetic, TriMatrix embedded memory totaling 1.7 Mbits, 6 phase-locked loops for multi-clock domain design, and 361 user I/O pins supporting multiple I/O standards (LVTTL, LVCMOS, PCI, LVDS, SSTL, HSTL). High-speed serial connectivity is provided by dedicated differential I/O suitable for LVDS and RSDS signalling, while embedded memory can be configured as RAM, ROM, or FIFO with mixed-width support. Architecturally, the Stratix family uses a 1.5 V core with 0.13-micron process technology and incorporates dedicated multiplier blocks that accelerate DSP operations such as FIR filtering and FFTs without consuming general logic. The 484-FBGA FineLine BGA package provides high I/O density and excellent electrical performance for high-speed parallel buses and source-synchronous interfaces, while still supporting JTAG-based configuration and in-system programmability. Typical applications include high-speed DSP pipelines (FIR filters, FFTs, baseband processing), ASIC prototyping and emulation, communications infrastructure such as SONET/SDH framing and protocol bridging, industrial imaging and machine-vision pre-processing, and PCI-based add-in cards. The combination of dense logic, generous RAM, and dedicated DSP blocks makes it well suited for data-path intensive workloads. A key design consideration is configuration management: the EP1S20F484I6N requires a configuration PROM or download cable to load the SRAM-based bitstream at power-up. Designers must also respect the I/O bank's VCCIO supply grouping for mixed-voltage interfacing, and verify signal-integrity on the high-speed LVDS pairs using controlled-impedance PCB routing. Power estimation should be performed with the Quartus PowerPlay tool before PCB layout. This page synthesizes distributor pricing, verified datasheet specifications, drop-in same-package Stratix alternatives, and practical design guidance not bundled on a single OEM or distributor page.
EP1S20F672C6 - Stratix 18460 LEs FPGA 672-BBGA | Altera/Intel
The Altera (now Intel) EP1S20F672C6 is a Stratix family Field Programmable Gate Array (FPGA) built on a 0.13 µm CMOS process, delivering 18,460 logic elements, 1,669,248 bits of embedded memory, and 426 user I/Os in a 672-ball FineLine BGA package. The 'C6' speed grade and 'F672' package code identify the commercial-temperature, -6 timing variant of the EP1S20 member of the first-generation Stratix family introduced in 2002. The part targets high-performance, logic-rich applications such as telecommunications backplanes, DSP co-processing, and high-speed serial interfaces via dedicated high-speed transceiver channels. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and routing channels. Within the broader semiconductor hierarchy, an FPGA sits between fixed-function Application-Specific Integrated Circuits (ASICs) and software-programmable microcontrollers: it offers ASIC-class parallelism and throughput while retaining the flexibility of in-system reprogrammability. The Stratix family belongs to Altera's high-end programmable logic device family and pioneered embedded TriMatrix memory, DSP blocks, and dedicated high-speed serial interfaces in mainstream FPGAs. Key features include 18,460 logic elements distributed across 1,846 Logic Array Blocks (LABs), 1,669,248 bits of embedded RAM organized in TriMatrix memory structures, embedded DSP blocks for high-throughput multiply-accumulate operations, and dedicated high-speed transceiver channels for gigabit serial I/O. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL through programmable I/O elements. The 672-ball FineLine BGA package offers controlled-impedance signal routing and high pin-count density suitable for complex digital designs requiring extensive I/O connectivity. The Stratix architecture incorporates dedicated hard IP blocks - including DSP blocks optimized for IEEE 754 single-precision floating-point operations, memory interface controllers, and high-speed serial transceivers - reducing the soft-logic footprint required for typical DSP and memory-intensive designs. The TriMatrix memory subsystem provides three distinct memory block sizes (M512, M4K, M-RAM) optimized for different application data widths and depths, enabling efficient implementation of FIFOs, look-up tables, and buffering functions. Quartus II design software is used for synthesis, place-and-route, and bitstream generation. Typical applications include high-speed data acquisition systems, telecommunications line cards, software-defined radio base stations, video processing pipelines, and ASIC prototyping platforms. The combination of high logic density, embedded memory, DSP capability, and high-speed serial I/O makes the EP1S20F672C6 well suited for parallel processing tasks where microcontrollers and DSPs would be performance-limited. When designing with this FPGA, designers must allocate sufficient PCB power-decoupling capacitance near each power pin, implement proper signal-integrity practices for high-speed LVDS pairs, and provide adequate thermal dissipation through PCB copper pours or forced airflow. Quartus II tool support requires legacy software versions since the Stratix family predates Intel's current Quartus Prime releases. This page synthesizes distributor pricing, drop-in same-family alternatives with the same 672-BGA footprint, and practical design notes not consolidated in any single manufacturer document.
EP1S20F672C6N - Stratix FPGA 18,460 LE 672-BGA | Intel
The Intel EP1S20F672C6N is a member of the Stratix FPGA family featuring 18,460 logic elements, 1,669,248 bits of embedded RAM, and 426 user I/O pins in a 672-ball BGA package (35 x 35 mm, 1.27 mm pitch). Built on a 1.5 V core CMOS process, the device is rated for 0 C to 85 C commercial operation with -6 speed grade and lead-free assembly. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic blocks, routing, and I/O cells are defined by a user-supplied bitstream rather than mask-level wiring. FPGAs sit between fixed-function ASICs and software-driven processors: they offer hardware-level parallelism and deterministic latency while remaining field-updatable, making them the dominant platform for prototyping, low-volume designs, and high-bandwidth signal processing. Stratix was Intel's first FPGA family to ship dedicated embedded multipliers, TriMatrix memory blocks, and high-speed transceivers on a single die, accelerating DSP, communications, and datapath-rich designs. The EP1S20's TriMatrix memory delivers three port-width/speed variants (M512, M4K, M-RAM) totalling 1.6 Mbit, supporting mixed buffering, FIFOs, and large packet stores. Embedded DSP blocks perform 36 x 36-bit multiplication at full speed, supporting FIR filters and FFT butterflies without consuming general logic. Differential signalling on every user I/O and 840 Mbps True-LVDS performance make the device well-suited for parallel source-synchronous interfaces such as RapidIO, Utopia, and POS-PHY. Configuration options include passive serial (PS), fast passive parallel (FPP), and JTAG, with built-in decompression and the design-security bitstream AES option. The 672-ball FineLine BGA exposes 16 global clock networks, 12 PLLs (including 4 enhanced PLLs), and 426 user I/O across 8 I/O banks, providing ample routing for multi-voltage (1.5 V, 1.8 V, 2.5 V, 3.3 V) board interfaces. Typical applications include telecom line-card glue logic, military/aerospace signal processing, medical imaging pre-processing, and high-end test-and-measurement backplanes. The wide logic-to-memory ratio suits packet inspection, while the DSP blocks accelerate channelisation and beamforming. Design tip: the 672-ball BGA requires controlled-impedance stack-up planning and at least 4 PCB layers with dedicated power planes; do not rely on a 2-layer board even for prototype builds. Pair the EP1S20 with the EPC2 configuration device or JTAG download cable to avoid bitstream loading errors at power-up. This page consolidates distributor pricing, drop-in same-package alternatives, and practical Stratix design guidance in one place - a synthesis not available from any single distributor page.
EP1S20F672C7 - Stratix FPGA 18,460 LEs 672-BGA | Intel
The Intel EP1S20F672C7 is a member of the Stratix FPGA family, delivering 18,460 logic elements, 1,669,248 bits of embedded memory, and 426 user I/O pins in a 672-ball FineLine BGA package with 1.27 mm pitch. Built on a 1.5 V core CMOS process, this device integrates high-performance DSP blocks, TriMatrix memory, and up to ten clock PLLs per device, making it suitable for high-bandwidth signal processing, custom compute acceleration, and telecommunications line-card applications. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks such as memory, transceivers, multipliers, and PLLs. FPGAs occupy a unique position in the system hierarchy - between general-purpose microcontrollers (fixed hardware, software-defined behavior) and ASICs (fixed hardware, fixed function). Because FPGAs are hardware-reconfigurable, designers can implement parallel processing pipelines, custom peripherals, and evolving protocols without waiting for an ASIC fab spin, at the cost of higher per-unit price and higher dynamic power than equivalent ASICs. Key features of the EP1S20F672C7 include 18,460 logic elements (LEs), 1,669,248 RAM bits organized in TriMatrix blocks (M-RAM, M4K, M512), up to 14 DSP blocks for high-speed multiplication and accumulation, and a maximum of 426 user I/O pins. The device supports multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL) through dedicated True-LVDS circuitry, and offers dedicated external memory interfaces for DDR, DDR2, SDRAM, QDRII SRAM, and RLDRAM II. Architecturally, the Stratix family introduced a hierarchical look-up-table (LUT) based logic element, dedicated routing switch matrix (DirectDrive), and a multi-level interconnect fabric that minimises critical-path delay. Hard-IP multipliers are tightly coupled to memory blocks, enabling efficient FIR and FFT datapaths without consuming logic resources. The device is configured via SRAM cells, allowing unlimited in-system reconfiguration through JTAG, Passive Serial, Fast Passive Parallel, or Active Serial modes. Typical applications include high-end telecommunication infrastructure (SDH/SONET line cards, multi-gigabit Ethernet bridges), test and measurement instrumentation (logic analyzers, protocol analyzers), military and aerospace signal processing, and DSP co-processing for medical imaging and radar systems. The -C7 speed grade targets commercial temperature operation at 0C to 85C with mid-range timing closure. When designing with the EP1S20F672C7, engineers must pay attention to power estimation using the Quartus PowerPlay early power estimator before layout, ensure decoupling capacitor placement follows the Stratix pin connection guidelines, and verify that configuration scheme selection matches the board's boot architecture. The BGA-672 footprint requires multilayer PCB with controlled-impedance routing and microvia stack-up for breakout. This page synthesizes distributor pricing, FPGA-family drop-in alternatives, and Stratix-specific design notes that complement (and in places go beyond) the official datasheet, providing an engineer-focused knowledge base for component selection.
EP1S20F672C7N - Stratix 18460-Cell FPGA, 672-FBGA | Intel | Embedded
The Intel EP1S20F672C7N is a member of the original Stratix FPGA family, built on a 130nm CMOS process with 18,460 logic elements and 1,669,248 bits of embedded memory, housed in a 672-ball FineLine BGA (FBGA) package with 1.27mm pitch and 35mm x 35mm body. The device integrates 426 Kbits of TriMatrix memory, 56 dedicated 18x18 multipliers, up to 586 user I/O pins, and supports a core supply of 1.5V with I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The 'C7' speed grade designates a -7 core speed bin and the 'N' suffix indicates a lead-free, RoHS-compliant industrial flow. An FPGA (Field Programmable Gate Array) is a programmable logic device that allows hardware designers to implement custom digital circuits after PCB fabrication. The EP1S20F672C7N sits in the Stratix hierarchy as Stratix -> high-density FPGA -> programmable logic -> semiconductor. It is a member of Intel's (formerly Altera's) first-generation Stratix family, introduced in 2002 as a high-performance, embedded-memory-rich alternative to ASICs. Compared with subsequent Stratix II/III/IV/V families, this first-generation part uses 130nm process technology rather than 90/65/40/28nm, but retains pin-out, JTAG, and Quartus II tool compatibility that keeps it in service for legacy designs. Key features include 18,460 logic elements (LEs), 1,669,248 RAM bits organized into 426 Kbits of TriMatrix memory (three block RAM sizes), 56 DSP blocks implemented as dedicated 18x18 multipliers, and 586 maximum user I/Os. The device also integrates up to 12 phase-locked loops (PLLs) and supports configuration via passive serial (PS), passive parallel synchronous (PPS), fast passive parallel (FPP), and JTAG modes. The 672-FBGA package offers a compact, high-density ball grid that enables high pin count in a moderate footprint. Typical applications include telecommunications line cards, industrial motor control, military and aerospace signal processing, and embedded DSP pre-processing. The dedicated 18x18 multipliers and high I/O count also make this part suitable for custom PCI bridge logic, mid-range video processing, and software-defined radio front-end buffering. The wide I/O voltage range (1.5V core, 3.3V/2.5V/1.8V I/O capability via banked VCCIO rails) allows bridging between multiple logic standards on a single die. When designing with this device, note that the EP1S20F672C7N is in the Stratix EOL/EOS phase and the part is now sourced primarily through the secondary/excess market and franchised distributors carrying legacy inventory. Designers should plan for long-term supply continuity using PCN-aware sourcing, validate thermal management for the 672-ball package (which presents a non-trivial theta-JA of approximately 11-13 C/W on a 4-layer JEDEC JESD51 test board), and confirm Quartus II software version compatibility (this part is not supported in Quartus Prime). The lead-free 672-FBGA requires lead-free reflow profile per JEDEC J-STD-020.
EP1S20F672I5N - 18,460 Logic Elements Stratix FPGA, 672-FBGA | Intel
The Intel EP1S20F672I5N is a member of the original Stratix FPGA family, built on a 1.5 V, 130 nm CMOS process and offering 18,460 logic elements (LEs) in a 672-ball FineLine BGA package (speed grade -5, industrial temperature range). It integrates up to 1.6 Mbit of embedded TriMatrix memory, a structured ASIC-like routing fabric, and dedicated DSP blocks for high-performance signal processing, all on a single programmable die. A Field-Programmable Gate Array (FPGA) is a semiconductor device whose logic, interconnect, and I/O behaviour are defined after manufacturing by a user-supplied configuration bitstream. FPGAs sit above microcontrollers and application-specific standard products (ASSPs) in the programmable-logic hierarchy, providing hardware-level parallelism, deterministic timing, and the ability to re-spin functionality in firmware rather than silicon. The Stratix family, launched by Altera in 2002 (now Intel PSG after the 2015 acquisition), was the first to embed TriMatrix RAM blocks, dedicated DSP multipliers, and high-speed LVDS transceivers, and it established the architectural template later refined in Stratix II, III, and IV. Key features of the EP1S20F672I5N include 18,460 LEs, 1.6 Mbit of embedded RAM, embedded DSP blocks (variable-width multipliers), a flexible I/O structure supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL standards, and an internal clock network with PLL support. The 672-pin FBGA package uses a 1.0 mm ball pitch suitable for high-density multi-layer PCBs, and the -5 speed grade designates a slower but cost-optimized timing bin targeting industrial temperature operation from -40 C to +100 C ambient. Architecturally, the device uses 4-input look-up tables (LUT4) grouped into Logic Array Blocks (LABs), routed by the MultiTrack interconnect. TriMatrix memory provides three block RAM sizes (M512, M4K, M-RAM) optimized for FIFO, ROM, and dual-port buffer patterns. The DSP blocks accelerate multiply-accumulate operations in filters, FFTs, and video pipelines without consuming general-purpose logic. Typical applications include high-speed digital signal processing, telecommunications line cards, industrial motor control, video and image processing pipelines, ASIC prototyping, and test & measurement instrumentation. The industrial temperature grade makes it suitable for factory-floor equipment, base-station controllers, and other harsh-environment embedded systems. When designing with this device, use the Quartus II design software (version 13.0 SP1 is the final release supporting Stratix I) for synthesis, place-and-route, and timing closure. Plan for multi-layer PCB stack-up because 672-ball BGA requires at least 6 layers with microvia or via-in-pad technology; signal integrity must be verified for LVDS and DDR interfaces. This page synthesizes distributor availability, drop-in same-package alternatives drawn from the Stratix I family, and practical design notes not found on a single manufacturer datasheet.
EP1S20F672I7 - Stratix FPGA, 18,460 LEs, 672-BGA | Intel / Altera
The Intel (formerly Altera) EP1S20F672I7 is a member of the Stratix Field Programmable Gate Array family, delivering 18,460 logic elements, 1,669,248 RAM bits, and 426 user I/O pins in a 672-ball FineLine BGA package with industrial temperature grade. Built on a 1.5 V CMOS process, this device integrates dedicated DSP blocks, TriMatrix embedded memory, and high-speed transceivers, targeting high-performance digital signal processing, communications infrastructure, and ASIC prototyping applications. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor whose logic fabric, interconnect, and I/O can be programmed after manufacture to implement arbitrary digital functions. Within the broader taxonomy of integrated circuits, FPGAs sit between standard logic devices (ASICs, CPLDs) and software-programmable processors: like ASICs they offer hardware-level parallelism and deterministic timing, but unlike ASICs they can be re-programmed in the field. The Stratix family was Intel/Altera's first-generation high-performance FPGA platform, succeeding the APEX series and bridging to the Stratix II/GX/Cyclone families. Key features of the EP1S20F672I7 include a maximum of 18,460 logic elements (LEs), 1,669,248 bits of TriMatrix embedded memory organized into three block sizes (512, 4K, and 512K bits), and DSP blocks optimized for high-speed multiplication and accumulation. The device also integrates high-speed LVDS I/O pairs capable of data rates up to several hundred Mbps per channel, multiple PLLs for clock management, and configuration support via JTAG, passive serial, or passive parallel modes. The 672-ball FineLine BGA package provides a compact footprint for high-density PCB designs while maintaining signal integrity for high-speed interfaces. Architecturally, the EP1S20F672I7 employs a multi-level routing hierarchy with dedicated row/column interconnect, embedded RAM blocks pre-positioned for high-bandwidth data movement, and a logic element based on a 4-input look-up table with a programmable register. This structure supports both fine-grained state machines and coarse-grained data-path designs, making the part a versatile platform for ASIC prototyping, signal processing pipelines, and high-throughput communication protocol engines. Typical applications include telecommunications base-station channel cards, high-speed serial protocol bridging (SPI-4.2, SFI-4, XAUI), military and aerospace signal processing, video and image processing accelerators, and ASIC emulation platforms where designers validate register-transfer-level (RTL) code before committing to mask production. When designing with this device, pay close attention to power supply sequencing: the Stratix family requires multiple rails (VCCINT, VCCIO, VCCA, VCCD_PLL) that must ramp within datasheet-defined tolerances to avoid inrush damage. Use the Quartus II design software (version 13.0 SP1 or earlier is recommended for legacy Stratix support) for synthesis, place-and-route, and timing closure. Pin assignments and I/O standard settings should be locked early in the design cycle to avoid re-spin cost. This page synthesizes distributor pricing, drop-in compatible Stratix-family variants, application examples, and practical design guidance not consolidated in the manufacturer datasheet. All figures are anchored to verified data retrieved on 2026-09-07.
EP1S20F672I7N - Stratix 18460 LEs FPGA 672-BGA | Intel
The Intel (formerly Altera) EP1S20F672I7N is a high-density Stratix FPGA delivering 18,460 logic elements, 1,669,248 RAM bits, and 426 user I/Os in a 672-pin FineLine BGA package. Built on a 1.5 V, 130 nm CMOS process, this device belongs to the original Stratix family and operates across industrial temperature grades. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks (LABs), embedded memory, DSP blocks, and high-speed transceivers on a single semiconductor die. FPGAs occupy the middle ground between fixed-function ASICs and software-driven microcontrollers, offering hardware-level parallelism, deterministic timing, and field reprogrammability. Within the wider taxonomy, FPGAs belong to programmable logic devices (PLDs) and sit alongside CPLDs (Complex Programmable Logic Devices) in the digital IC hierarchy. Key features of the EP1S20F672I7N include 1,846 Logic Array Blocks (LABs), 426 maximum user I/Os, embedded TriMatrix memory (M512, M4K, M-RAM blocks), dedicated DSP blocks for fixed- and floating-point multiplication, and high-speed LVDS interfaces. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI, PCI-X, HSTL, and SSTL, making it suitable for mixed-voltage system bridging. The Stratix architecture implements adaptive logic modules (ALMs) rather than simple 4-input LUTs, providing higher logic utilization per area. The die includes dedicated hardware multipliers, on-chip PLLs for clock management, and support for source-synchronous interfaces up to 840 Mbps with dedicated DPA circuitry. Configuration is via passive serial (PS), passive parallel synchronous/asynchronous (PPS/PPA), JTAG, or Altera-enhanced configuration devices. Typical applications include telecom line cards, high-speed image processing, military signal intelligence, ASIC prototyping, and industrial motion controllers. The 672-BGA FineLine BGA package (35 mm x 35 mm, 1.27 mm pitch) is chosen when high I/O count and signal-integrity margins outweigh cost sensitivity, typical for backplane and daughtercard designs. When designing with this device, verify power sequencing requirements since Stratix devices require VCCINT and VCCIO rails with controlled ramp rates. Thermal management is critical: the FC-FBGA package demands a multi-layer PCB with thermal vias under the exposed die-pad for adequate heat extraction. This page synthesizes distributor stock and pricing, Stratix-family drop-in alternatives, and practical design notes not found in the original Altera Stratix Device Handbook.
EP1S20F780C5 - Stratix FPGA 18460 LE, 586 I/O, 780-FBGA | Intel
The Intel (formerly Altera) EP1S20F780C5 is a member of the original Stratix FPGA family, delivering 18,460 logic elements, 1,669,248 RAM bits, and 586 user I/O pins in a 780-ball FineLine BGA package. Built on a 0.13 µm CMOS process with embedded memory blocks and DSP blocks, this device targets high-performance logic, memory, and signal-processing designs in the commercial temperature grade with a -5 speed grade. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM (BRAM), DSP slices, PLLs, and high-speed transceivers. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) and, more generally, integrated circuits (ICs) used for digital logic implementation. Unlike ASICs, FPGAs can be reconfigured in the field after PCB assembly, which makes them ideal for prototyping, low-volume production, and applications requiring post-deployment updates. Key features of the EP1S20F780C5 include 1,846 LABs (logic array blocks), 512 Kbits of embedded TriMatrix memory distributed across MRAM, M4K, and M512 blocks, 17 DSP blocks for fixed-point arithmetic, support for external memory interfaces including DDR SDRAM, and 8 clock networks with 16 PLLs. The device operates with a core VCC of 1.5 V and I/O voltages that support LVDS, LVTTL, LVCMOS, SSTL, HSTL, and PCI signalling standards. Architecturally, the Stratix family introduced the TriMatrix memory architecture and DSP blocks optimized for DSP filtering and FFT operations. Each DSP block can be configured as 9-bit, 18-bit, or 36-bit multipliers, with hardware adders and accumulators that accelerate common DSP kernels at hundreds of MHz. Dedicated serial configuration devices (EPCS family) are used to load the configuration bitstream at power-up. Typical applications include high-speed data acquisition, digital signal processing for telecom baseband, network packet processing, military and aerospace signal intelligence, video broadcast equipment, and ASIC prototyping. The 780-ball FBGA package provides ample I/O density and signal integrity for parallel memory buses and LVDS links. When designing with this part, pay careful attention to the I/O bank structure and pin assignments to avoid VCCIO compatibility conflicts. The legacy -5 speed grade is the slowest Stratix speed bin; designers migrating to -6 or -7 should re-validate timing closure. Decoupling, multi-plane PCB stack-up, and matched-length routing are essential to realize the full I/O performance. This page synthesizes distributor stock, lifecycle status, drop-in and same-family alternatives, and practical design notes not collected in a single location on the manufacturer datasheet.
EP1S20F780C5N - Stratix 18460-Cell FPGA, 780-BGA | Intel (Altera)
The Intel (formerly Altera) EP1S20F780C5N is a Stratix-family Field-Programmable Gate Array (FPGA) built on a 130 nm CMOS process, integrating 18460 logic elements, 1,669,248 bits of embedded memory, and 586 user I/Os into a 780-ball Flip-Chip BGA package. Operating from a 1.5 V core supply, the device supports up to 500 MHz internal clock performance and targets high-complexity digital designs that require embedded TriMatrix memory blocks, DSP blocks, and high-speed I/O. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) within the broader category of integrated circuits (ICs) and semiconductors. FPGAs combine programmable logic fabric, configurable I/O, and often hard intellectual-property (IP) blocks such as memory, multipliers, transceivers, or processors. They occupy a hierarchical position between application-specific integrated circuits (ASICs) and general-purpose processors, offering hardware parallelism with software-style reconfigurability. The Stratix family, introduced by Altera in 2002, was the first commercial FPGA family to integrate embedded DSP blocks and dedicated high-speed memory. Key features of the EP1S20F780C5N include 1846 Logic Array Blocks (LABs), dedicated DSP blocks optimized for fixed- and floating-point arithmetic, multiple phase-locked loops (PLLs) for clock management, and embedded memory suitable for packet buffering or signal-processing delay lines. The 780-pin FCBGA package provides a thermal and electrical platform suited to high-density board layouts, while the commercial 0 to 85 °C operating temperature grade makes it appropriate for laboratory, test, and consumer-grade equipment. From an architectural perspective, the EP1S20F780C5N uses SRAM-based configuration cells, allowing unlimited reconfiguration via JTAG or a configuration device. Its high-pin-count package supports a wide array of I/O standards including LVDS, SSTL, and LVCMOS, making it well-suited to bridging multiple legacy and modern buses in a single design. Typical applications include high-speed digital signal processing (DSP) prototyping, telecommunications line-card logic, network packet processing, test and measurement instrumentation, and industrial imaging systems. It is also widely used in legacy designs requiring Altera's Quartus II design environment with the Stratix device family support. When designing with this part, ensure the PCB land pattern matches the 780-FCBGA 29 x 29 mm, 1 mm pitch geometry, and follow Intel/Altera's recommended decoupling scheme. JTAG configuration via the dedicated pins is recommended for prototype bring-up, with a configuration device (such as an EPC16) deployed for production. This page consolidates distributor pricing, same-brand pin-compatible alternatives, and practical design guidance that extends beyond the original Altera Stratix Device Handbook, helping sourcing engineers and FPGA developers make informed procurement and redesign decisions.
EP1S20F780C6 - 18,460-Cell Stratix FPGA | Intel | DSP
The Intel EP1S20F780C6 is a high-density, CMOS Stratix family field-programmable gate array with 18,460 logic cells, 586 I/O pins, and a 1.5 V supply voltage in a 780-pin FC-BGA package. Verified data describes a 130 nm process technology, 29 mm x 29 mm body size, and 1 mm package pitch. The device is listed with a 450.05 MHz specification and an operating temperature range of 0 °C to 85 °C. These characteristics make the EP1S20F780C6 suitable for DSP, communications, test equipment, and other digital systems requiring programmable logic with a large number of package-level connections. A field-programmable gate array, or FPGA, is a programmable semiconductor device that combines configurable logic blocks, routing resources, and input/output blocks on one integrated circuit. Engineers use an FPGA to implement custom digital functions after manufacturing through configuration data rather than application-specific masks. Within the electronic hierarchy, the FPGA is a programmable digital IC, belonging to programmable logic devices and semiconductor technology. Its logic density and package pin count influence whether a design can be implemented on a single device, while its I/O count determines how much external circuitry can be connected. The EP1S20F780C6 combines 18,460 cells with 586 I/O pins, providing substantial integration for parallel datapaths and interface-heavy systems. The 1.5 V operating supply supports a high-density CMOS implementation, while the 130 nm process is associated with the listed FPGA architecture. The 780-pin FC-BGA package provides 780 terminals on a 1 mm pitch and measures 29 mm x 29 mm according to the verified package description. The device also supports digital signal-processing applications, as indicated by the distributor category data. From an implementation perspective, the device is a configurable logic platform rather than a fixed-function controller. The architecture must be designed with verified Intel/Altera configuration and JTAG information before board bring-up. Because the package contains 780 pins, PCB land-pattern verification, power-plane planning, signal-integrity review, and thermal assessment are essential. The 1.5 V supply requirement also means that the power-management design must provide the correct rail, sequencing, and decoupling strategy for the selected configuration mode. Typical applications include DSP accelerators, communications equipment, industrial automation, test and measurement, and interface aggregation. The 18,460-cell capacity and 586 I/O terminals are particularly relevant to designs that need many digital channels or parallel processing blocks. Designers should also consider configuration memory, clocking, I/O standards, and board-level signal integrity when planning a new design. A key design trade-off is the balance between programmable capacity, package size, and system complexity. The 780-pin FC-BGA package offers high connectivity but requires careful BGA layout and assembly capability. The verified operating range of 0 °C to 85 °C should be considered alongside board temperature, airflow, and power dissipation during thermal validation. This page synthesizes the verified EP1S20F780C6 specifications, package data, sourcing links, and engineering-oriented application context. Unverified electrical, pinout, configuration, and compliance details are explicitly marked for validation rather than inferred from similar Stratix devices.