BSP316PH6327XTSA1 vs BSD235CH6327XTSA1 Comparison

Detailed side-by-side comparison of BSP316PH6327XTSA1 by Infineon and BSD235CH6327XTSA1 by Infineon. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter BSP316PH6327XTSA1 BSD235CH6327XTSA1
Brand Infineon Infineon
Category MOSFETs MOSFETs
Lifecycle Status Active Active
FET Type P-Channel —
Drain-to-Source Voltage (VDS) -100 V 20 V
Continuous Drain Current (ID) at TA=25C -680 mA —
Total Power Dissipation (Ptot) at TA=25C 1.8 W —
On-Resistance (RDS(on)) [DATA_NEEDED: RDS(on) at VGS=-10V] —
Gate Threshold Voltage (VGS(th)) [DATA_NEEDED: VGS(th) typical] —
Gate Charge (Qg) [DATA_NEEDED: total gate charge] —
Package PG-SOT223-4 (TO-261-4) —
Mounting Type Surface Mount Surface Mount
Operating Temperature Range -55 C to +150 C (junction) -55 °C to +150 °C (junction)
Number of Pins 3 + thermal tab —
Channel Mode Enhancement Enhancement
Technology SIPMOS (P-channel MOSFET) OptiMOS™ low-voltage
RoHS Status Compliant Compliant (lead-free)
MSL Level 1 1
Packaging Tape & Reel (H6327 suffix) —
Manufacturer — Infineon Technologies
Part Family — OptiMOS™
Configuration — N+P complementary dual MOSFET
N-Channel Continuous Drain Current (ID) — 950 mA
P-Channel Continuous Drain Current (ID) — 530 mA (negative polarity)
Total Power Dissipation (Ptot) — 500 mW
Package Type — PG-SOT363-6-1 (SOT-363, 6-pin)
Polarity — N-channel + P-channel
Pin Count — 6

Datasheets & Resources

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