BSP316PH6327XTSA1 vs BSS169H6327XTSA1 Comparison

Detailed side-by-side comparison of BSP316PH6327XTSA1 by Infineon and BSS169H6327XTSA1 by Infineon. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter BSP316PH6327XTSA1 BSS169H6327XTSA1
Brand Infineon Infineon
Category MOSFETs MOSFETs
Lifecycle Status Active Active
FET Type P-Channel N-Channel Depletion Mode
Drain-to-Source Voltage (VDS) -100 V 100 V
Continuous Drain Current (ID) at TA=25C -680 mA —
Total Power Dissipation (Ptot) at TA=25C 1.8 W —
On-Resistance (RDS(on)) [DATA_NEEDED: RDS(on) at VGS=-10V] —
Gate Threshold Voltage (VGS(th)) [DATA_NEEDED: VGS(th) typical] Pinch-off approx. -3.5 V (typical)
Gate Charge (Qg) [DATA_NEEDED: total gate charge] —
Package PG-SOT223-4 (TO-261-4) PG-SOT23 (SOT-23-3)
Mounting Type Surface Mount Surface Mount
Operating Temperature Range -55 C to +150 C (junction) [DATA_NEEDED: junction/ambient operating temperature range]
Number of Pins 3 + thermal tab —
Channel Mode Enhancement —
Technology SIPMOS (P-channel MOSFET) Depletion-mode vertical DMOS
RoHS Status Compliant Compliant
MSL Level 1 1 (per JEDEC J-STD-020)
Packaging Tape & Reel (H6327 suffix) —
Continuous Drain Current (ID) — 170 mA (Ta)
Power Dissipation (PD) — 360 mW (Ta)
RDS(on) Maximum — 6 Ohm at VGS=0 V
Gate-Source Voltage (VGS) Max — [DATA_NEEDED: VGS absolute maximum rating]
Pin Count — 3
Lead-Free — Yes
Drain Current at 25C — 170 mA continuous
Typical RDS(on) — [DATA_NEEDED: typical RDS(on) value]

Datasheets & Resources

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