EP3C16U256C8 vs EP3C16U256C8N Comparison

Detailed side-by-side comparison of EP3C16U256C8 by Intel and EP3C16U256C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C16U256C8 EP3C16U256C8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Active
Device Type Cyclone III field-programmable gate array (FPGA) —
Logic Elements 15,408 logic elements 15,408
Logic Array Blocks 963 LABS —
Embedded Memory 516,096 bits —
User I/O 168 I/O —
Package 256-ball UFBGA package 256-ball Ultra FineLine BGA (Ux256, 17 mm x 17 mm)
Package Code FBGA —
Package Dimensions 14 x 14 mm —
Package Height 2.20 mm —
Ball Pitch 0.80 mm —
Terminal Form Ball —
Terminal Count 256 terminals —
Package Shape Rectangular —
Technology CMOS —
Temperature Grade Commercial —
Manufacturer Intel —
RoHS Status Compliant Compliant (Pb-free)
REACH Status [DATA_NEEDED: REACH compliance status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification status] —
Lead-Free Status [DATA_NEEDED: lead-free status] —
Halogen-Free Status [DATA_NEEDED: halogen-free status] —
Core Supply Voltage 1.2 V —
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
Maximum Clock Frequency [DATA_NEEDED: maximum clock frequency] —
Family — Cyclone III
Total Memory Bits — 516,096 bits
Embedded Multipliers (18 x 18) — 56
PLLs — 4
Maximum User I/O — 168
Core Voltage (VCCINT) — 1.2 V
Process Technology — 65 nm low-power
Speed Grade — 8 (C8, commercial)
Operating Junction Temperature — -40 °C to +85 °C
Configuration Modes — JTAG, AS, PS, FPP
Mounting Type — Surface Mount (BGA, requires microvia PCB)
MSL Level — [DATA_NEEDED: MSL level]

Datasheets & Resources

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