EP3C16U256C8 vs EP3C16U256C8N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C16U256C8 disebabkan oleh Intel dan EP3C16U256C8N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3C16U256C8 EP3C16U256C8N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Aktif
Device Type Cyclone III field-programmable gate array (FPGA) —
Logic Elements 15,408 logic elements 15,408
Logic Array Blocks 963 LABS —
Embedded Memory 516,096 bits —
User I/O 168 I/O —
Kemasan 256-ball UFBGA package 256-ball Ultra FineLine BGA (Ux256, 17 mm x 17 mm)
Package Code FBGA —
Package Dimensions 14 x 14 mm —
Package Height 2.20 mm —
Ball Pitch 0.80 mm —
Terminal Form Ball —
Terminal Count 256 terminals —
Package Shape Rectangular —
Technology CMOS —
Temperature Grade Commercial —
Manufacturer Intel —
Status RoHS Compliant Compliant (Pb-free)
REACH Status [DATA_NEEDED: REACH compliance status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification status] —
Lead-Free Status [DATA_NEEDED: lead-free status] —
Halogen-Free Status [DATA_NEEDED: halogen-free status] —
Core Supply Voltage 1.2 V —
Gambaran Suhu Operasi [DATA_NEEDED: operating temperature range] —
Frekuensi Klock Maksimum [DATA_NEEDED: maximum clock frequency] —
Family — Cyclone III
Total Memory Bits — 516,096 bits
Embedded Multipliers (18 x 18) — 56
PLLs — 4
Maximum User I/O — 168
Core Voltage (VCCINT) — 1.2 V
Process Technology — 65 nm low-power
Speed Grade — 8 (C8, commercial)
Suhu Hubungan Operasi — -40 °C to +85 °C
Configuration Modes — JTAG, AS, PS, FPP
Jenis Pemasangan — Surface Mount (BGA, requires microvia PCB)
Aras MSL — [DATA_NEEDED: MSL level]

Laporan Datasheet & Sumber

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