EP3C16U256C8 vs EP3C16U256C8N Comparación
Comparación detallada lado a lado de EP3C16U256C8 por Intel y EP3C16U256C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C16U256C8 | EP3C16U256C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Activo |
| Device Type | Cyclone III field-programmable gate array (FPGA) | — |
| Logic Elements | 15,408 logic elements | 15,408 |
| Logic Array Blocks | 963 LABS | — |
| Embedded Memory | 516,096 bits | — |
| User I/O | 168 I/O | — |
| Encapsulado | 256-ball UFBGA package | 256-ball Ultra FineLine BGA (Ux256, 17 mm x 17 mm) |
| Package Code | FBGA | — |
| Package Dimensions | 14 x 14 mm | — |
| Package Height | 2.20 mm | — |
| Ball Pitch | 0.80 mm | — |
| Terminal Form | Ball | — |
| Terminal Count | 256 terminals | — |
| Package Shape | Rectangular | — |
| Technology | CMOS | — |
| Temperature Grade | Commercial | — |
| Manufacturer | Intel | — |
| Estado RoHS | Compliant | Compliant (Pb-free) |
| REACH Status | [DATA_NEEDED: REACH compliance status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Halogen-Free Status | [DATA_NEEDED: halogen-free status] | — |
| Core Supply Voltage | 1.2 V | — |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| Frecuencia de reloj máxima | [DATA_NEEDED: maximum clock frequency] | — |
| Family | — | Cyclone III |
| Total Memory Bits | — | 516,096 bits |
| Embedded Multipliers (18 x 18) | — | 56 |
| PLLs | — | 4 |
| Maximum User I/O | — | 168 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Process Technology | — | 65 nm low-power |
| Speed Grade | — | 8 (C8, commercial) |
| Temperatura de unión de funcionamiento | — | -40 °C to +85 °C |
| Configuration Modes | — | JTAG, AS, PS, FPP |
| Tipo de montaje | — | Surface Mount (BGA, requires microvia PCB) |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |