EP3C16U256C8 vs EP3C16U256C8N 对比

详细并排对比 EP3C16U256C8 出自 Intel 和 EP3C16U256C8N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP3C16U256C8 EP3C16U256C8N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 Obsolete 有效
Device Type Cyclone III field-programmable gate array (FPGA) —
Logic Elements 15,408 logic elements 15,408
Logic Array Blocks 963 LABS —
Embedded Memory 516,096 bits —
User I/O 168 I/O —
封装 256-ball UFBGA package 256-ball Ultra FineLine BGA (Ux256, 17 mm x 17 mm)
Package Code FBGA —
Package Dimensions 14 x 14 mm —
Package Height 2.20 mm —
Ball Pitch 0.80 mm —
Terminal Form Ball —
Terminal Count 256 terminals —
Package Shape Rectangular —
Technology CMOS —
Temperature Grade Commercial —
Manufacturer Intel —
RoHS 状态 Compliant Compliant (Pb-free)
REACH Status [DATA_NEEDED: REACH compliance status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification status] —
Lead-Free Status [DATA_NEEDED: lead-free status] —
Halogen-Free Status [DATA_NEEDED: halogen-free status] —
Core Supply Voltage 1.2 V —
工作温度范围 [DATA_NEEDED: operating temperature range] —
最大时钟频率 [DATA_NEEDED: maximum clock frequency] —
Family — Cyclone III
Total Memory Bits — 516,096 bits
Embedded Multipliers (18 x 18) — 56
PLLs — 4
Maximum User I/O — 168
Core Voltage (VCCINT) — 1.2 V
Process Technology — 65 nm low-power
Speed Grade — 8 (C8, commercial)
工作结温 — -40 °C to +85 °C
Configuration Modes — JTAG, AS, PS, FPP
安装类型 — Surface Mount (BGA, requires microvia PCB)
MSL 等级 — [DATA_NEEDED: MSL level]

数据手册与资源

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