EP3C16U256C8 vs EP3C16U256C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C16U256C8 sa pamamagitan ng Intel at EP3C16U256C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C16U256C8 | EP3C16U256C8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Aktibo |
| Device Type | Cyclone III field-programmable gate array (FPGA) | — |
| Logic Elements | 15,408 logic elements | 15,408 |
| Logic Array Blocks | 963 LABS | — |
| Embedded Memory | 516,096 bits | — |
| User I/O | 168 I/O | — |
| Packhaging | 256-ball UFBGA package | 256-ball Ultra FineLine BGA (Ux256, 17 mm x 17 mm) |
| Package Code | FBGA | — |
| Package Dimensions | 14 x 14 mm | — |
| Package Height | 2.20 mm | — |
| Ball Pitch | 0.80 mm | — |
| Terminal Form | Ball | — |
| Terminal Count | 256 terminals | — |
| Package Shape | Rectangular | — |
| Technology | CMOS | — |
| Temperature Grade | Commercial | — |
| Manufacturer | Intel | — |
| Tindminan RoHS | Compliant | Compliant (Pb-free) |
| REACH Status | [DATA_NEEDED: REACH compliance status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Halogen-Free Status | [DATA_NEEDED: halogen-free status] | — |
| Core Supply Voltage | 1.2 V | — |
| Hanay ng Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | — |
| Maksimum na Taktiko ng Oras | [DATA_NEEDED: maximum clock frequency] | — |
| Family | — | Cyclone III |
| Total Memory Bits | — | 516,096 bits |
| Embedded Multipliers (18 x 18) | — | 56 |
| PLLs | — | 4 |
| Maximum User I/O | — | 168 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Process Technology | — | 65 nm low-power |
| Speed Grade | — | 8 (C8, commercial) |
| Temperature ng Junction na Operasyon | — | -40 °C to +85 °C |
| Configuration Modes | — | JTAG, AS, PS, FPP |
| Uri ng Pagpapasok | — | Surface Mount (BGA, requires microvia PCB) |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |