EP3SE260F1152C2 vs EP3SE260F1152C3N Perbandingan
Perbandingan bersamaan detil EP3SE260F1152C2 dari Intel dan EP3SE260F1152C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SE260F1152C3N - Stratix III E FPGA, 255K LE, 744 I/O, 1152-FBGA | Intel
EP3SE260F1152C3N ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | EP3SE260F1152C2 | EP3SE260F1152C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Aktif |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix® III E | Stratix III E |
| Logic Elements (LE) | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Embedded Memory (bits) | 16,672,768 | — |
| User I/Os | 744 | — |
| User I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Core Voltage (VCCINT) | 1.1 V | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Paket | 1152-ball FC-FBGA (Flip Chip) | 1152-BBGA, FCBGA |
| Tipe Mounting | Surface Mount | Surface Mount |
| Speed Grade | C2 (commercial) | — |
| Suhu Kerja | Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] | 0 C to +85 C (Commercial) |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Level MSL | [DATA_NEEDED: MSL rating] | — |
| Design Software | Quartus II (Stratix III support) | — |
| Logic Elements / Cells | — | 255,000 |
| Embedded Memory Bits | — | 16,672,768 bits |
| User I/O Count | — | 744 |
| Core Voltage | — | 1.1 V |
| Transceivers | — | Integrated high-speed transceivers |
| DSP Blocks | — | Yes (dedicated multiplier/accumulator) |
| Embedded Memory Type | — | TriMatrix (true dual-port, FIFO, ROM, RAM) |
| External Memory Support | — | DDR3, DDR2, QDR II+, RLDRAM II |
| Configuration Modes | — | AS, AP, PS, FPP, JTAG |
| Partial Reconfiguration | — | Supported |
| Programmable Power Technology | — | Yes (up to 50% dynamic power reduction) |