EP3SE260F1152C2 vs EP3SE260F1152C3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152C2 sa pamamagitan ng Intel at EP3SE260F1152C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE260F1152C2 EP3SE260F1152C3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Aktibo
Manufacturer Intel (formerly Altera) —
Series Stratix® III E Stratix III E
Logic Elements (LE) 255,000 —
Logic Array Blocks (LABs) 10,200 10,200
Embedded Memory (bits) 16,672,768 —
User I/Os 744 —
User I/O Banks [DATA_NEEDED: I/O bank count] —
Core Voltage (VCCINT) 1.1 V —
Process Technology 65 nm CMOS 65 nm
Packhaging 1152-ball FC-FBGA (Flip Chip) 1152-BBGA, FCBGA
Uri ng Pagpapasok Surface Mount Surface Mount
Speed Grade C2 (commercial) —
Temperature na Operasyon Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] 0 C to +85 C (Commercial)
Tindminan RoHS Compliant Compliant
Lead-Free Yes —
Level ng MSL [DATA_NEEDED: MSL rating] —
Design Software Quartus II (Stratix III support) —
Logic Elements / Cells — 255,000
Embedded Memory Bits — 16,672,768 bits
User I/O Count — 744
Core Voltage — 1.1 V
Transceivers — Integrated high-speed transceivers
DSP Blocks — Yes (dedicated multiplier/accumulator)
Embedded Memory Type — TriMatrix (true dual-port, FIFO, ROM, RAM)
External Memory Support — DDR3, DDR2, QDR II+, RLDRAM II
Configuration Modes — AS, AP, PS, FPP, JTAG
Partial Reconfiguration — Supported
Programmable Power Technology — Yes (up to 50% dynamic power reduction)

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