EP3SE260F1152I3N vs EP3SE260F1152I4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152I3N sa pamamagitan ng Intel at EP3SE260F1152I4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE260F1152I3N - 255K Logic Elements Stratix III E FPGA | Intel
EP3SE260F1152I3N ⚠ Huling PagbiliIntel
EP3SE260F1152I4N - Stratix III E FPGA, 255K LE, 1152-FCBGA | Intel
EP3SE260F1152I4N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE260F1152I3N | EP3SE260F1152I4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Series | Stratix III E | Stratix III E |
| Family Name | Stratix III E | — |
| Logic Elements / Cells | 255000 | — |
| Logic Array Blocks (LABs) | 10200 | 10,200 |
| Total RAM Bits | 16672768 | — |
| Number of I/Os | 744 | — |
| Number of Gates | [DATA_NEEDED: number of gates] | — |
| Core Voltage | 0.9 V to 1.1 V selectable | 0.86 V |
| Temperature na Operasyon | -40C to +100C (industrial) | -40C to +100C (Industrial) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Packhaging / Kaso | 1152-BBGA, FCBGA (FC-FBGA) | — |
| Process Technology | 65 nm CMOS | TSMC 40 nm |
| Max Internal Frequency | 500 MHz | — |
| Supplier Temperature Grade | Industrial | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Level ng MSL | [DATA_NEEDED: MSL level] | 3 (168 hours) |
| Logic Elements | — | 255,000 |
| Embedded Memory (bits) | — | 16,672,768 |
| Maximum User I/O | — | 744 |
| DSP Blocks (18x18 multipliers) | — | 896 |
| Transceivers | — | 48 (up to 8.5 Gbps) |
| Packhaging | — | 1152-ball FCBGA (35 mm x 35 mm) |
| Speed Grade | — | 4 |