EP3SE260F1152I3N vs EP3SE260F1152I4N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1152I3N disebabkan oleh Intel dan EP3SE260F1152I4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260F1152I3N - 255K Logic Elements Stratix III E FPGA | Intel
EP3SE260F1152I3N ⚠ Bahagian terakhir untuk beliIntel
EP3SE260F1152I4N - Stratix III E FPGA, 255K LE, 1152-FCBGA | Intel
EP3SE260F1152I4N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE260F1152I3N | EP3SE260F1152I4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Masa Terakhir Dibeli |
| Series | Stratix III E | Stratix III E |
| Family Name | Stratix III E | — |
| Logic Elements / Cells | 255000 | — |
| Logic Array Blocks (LABs) | 10200 | 10,200 |
| Total RAM Bits | 16672768 | — |
| Number of I/Os | 744 | — |
| Number of Gates | [DATA_NEEDED: number of gates] | — |
| Core Voltage | 0.9 V to 1.1 V selectable | 0.86 V |
| Suhu Operasi | -40C to +100C (industrial) | -40C to +100C (Industrial) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Kemasan / Case | 1152-BBGA, FCBGA (FC-FBGA) | — |
| Process Technology | 65 nm CMOS | TSMC 40 nm |
| Max Internal Frequency | 500 MHz | — |
| Supplier Temperature Grade | Industrial | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Aras MSL | [DATA_NEEDED: MSL level] | 3 (168 hours) |
| Logic Elements | — | 255,000 |
| Embedded Memory (bits) | — | 16,672,768 |
| Maximum User I/O | — | 744 |
| DSP Blocks (18x18 multipliers) | — | 896 |
| Transceivers | — | 48 (up to 8.5 Gbps) |
| Kemasan | — | 1152-ball FCBGA (35 mm x 35 mm) |
| Speed Grade | — | 4 |