H5AN8G6NAFR-UHC vs K4A8G085WC-BCTD Comparison

Detailed side-by-side comparison of H5AN8G6NAFR-UHC by SK hynix and K4A8G085WC-BCTD by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

SK hynix
H5AN8G6NAFR-UHC H5AN8G6NAFR-UHC - 8Gb DDR4 SDRAM 512Mx16 | SK hynix

H5AN8G6NAFR-UHC - 8Gb DDR4 SDRAM 512Mx16 | SK hynix

H5AN8G6NAFR-UHC ✓ Active
Samsung Electronics
K4A8G085WC-BCTD K4A8G085WC-BCTD - 8Gb DDR4 SDRAM 2666Mbps 1.2V | Samsung

K4A8G085WC-BCTD - 8Gb DDR4 SDRAM 2666Mbps 1.2V | Samsung

K4A8G085WC-BCTD ⚠ Last Time Buy

Specification Comparison

Parameter H5AN8G6NAFR-UHC K4A8G085WC-BCTD
Brand SK hynix Samsung Electronics
Category Memory ICs Memory ICs
Lifecycle Status Active Last Time Buy
Stock Status In Stock In Stock
Unit Price (USD) $5.74 $50.85
Memory Type DDR4 SDRAM DDR4 SDRAM
Density 8 Gb 8 Gb
Organization 512M x 16 1G x 8
Supply Voltage 1.2 V —
Data Rate 2400 MT/s 2666 Mbps (PC4-2133)
Package FBGA-96 78-ball FBGA (78FBGA)
Operating Temperature 0°C to +85°C 0C to +95C
Number of Terminals 96 —
Package Code TFBGA —
Lead-Free Yes —
Halogen Free Yes —
RoHS Compliant Yes —
CAS Latency [DATA_NEEDED: CAS Latency] —
Burst Length 8, 4 (with burst chop) 8 (chop 4)
Refresh Auto self-refresh —
Supply Voltage (VDD/VDDQ) — 1.2 V (1.14 V to 1.26 V)
Ball Pitch — 0.8 mm
Standard Operating Temp Range — 0C to +85C
Auto Precharge — Yes
Asynchronous Reset — Yes
CRC Function — Yes
ZQ Calibration — Yes
Dynamic ODT — Yes
Data Mask — Yes
Interface Type — Synchronous, parallel
Mounting Type — Surface Mount
RoHS Status — [DATA_NEEDED: RoHS status]

Datasheets & Resources

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