IS43TR16256AL-125KBL vs K4B4G1646E-BYMATCV Comparison

Detailed side-by-side comparison of IS43TR16256AL-125KBL by ISSI, Integrated Silicon Solution Inc and K4B4G1646E-BYMATCV by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

ISSI, Integrated Silicon Solution Inc
IS43TR16256AL-125KBL IS43TR16256AL-125KBL - 4Gb DDR3L SDRAM 256Mx16 | ISSI

IS43TR16256AL-125KBL - 4Gb DDR3L SDRAM 256Mx16 | ISSI

IS43TR16256AL-125KBL ✓ Active
Samsung Electronics
K4B4G1646E-BYMATCV K4B4G1646E-BYMATCV - 4Gb DDR3L SDRAM 96-FBGA | Samsung

K4B4G1646E-BYMATCV - 4Gb DDR3L SDRAM 96-FBGA | Samsung

K4B4G1646E-BYMATCV ✓ Active

Specification Comparison

Parameter IS43TR16256AL-125KBL K4B4G1646E-BYMATCV
Brand ISSI, Integrated Silicon Solution Inc Samsung Electronics
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $5.60 $5.90
Memory Type SDRAM - DDR3L DDR3L SDRAM
Memory Size 4Gbit (256M x 16) 4 Gbit (256M x 16)
Interface Parallel —
Clock Frequency 800 MHz —
Access Time 20 ns —
Supply Voltage 1.35V (backward compatible to 1.5V) 1.35 V
Package 96-TWBGA (9x13mm) 96-ball FBGA
Mounting Type Surface Mount —
Operating Temperature 0°C ~ 95°C —
Memory Format DRAM —
Technology SDRAM - DDR3L —
Data Rate 1600 Mbps 1866 Mbps
RoHS Status Compliant Compliant
Lead-Free Yes —
Number of Terminals 96 —
I/O Voltage (VDDQ) — 1.35 V
Number of Pins — 96
Operating Temperature Range — -40°C to +95°C
Number of Banks — 8
Burst Length — 8 (with burst chop 4)
CAS Latency — Programmable (e.g., 13, 12, 11)
On-Die Termination (ODT) — Yes
Auto Precharge — Yes
Self-Refresh — Yes

Datasheets & Resources

Browse All Products Create BOM Request Quote