K4A8G085WB-BICR vs K4A8G085WB-BITD Comparison
Detailed side-by-side comparison of K4A8G085WB-BICR by Samsung Electronics and K4A8G085WB-BITD by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K4A8G085WB-BICR - Samsung 8Gb DDR4 1Gx8 2400Mbps Industrial
K4A8G085WB-BICR ✓ Active
Specification Comparison
| Parameter | K4A8G085WB-BICR | K4A8G085WB-BITD |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gb | 8 Gb |
| Organization | 1G x 8 | 1G x 8 |
| Data Rate | 2400 Mbps | 2666 Mbps |
| Supply Voltage | 1.2 V (VDD/VDDQ) | 1.2 V |
| Number of Banks | 16 | — |
| Refresh Cycles | 8192 | — |
| Package | 78-ball FBGA | 78FBGA |
| Pin Count | 78 | — |
| Mounting Type | Surface Mount | Surface Mount |
| Temperature Grade | Industrial (I-grade) | — |
| Operating Temperature Range | [DATA_NEEDED: exact temperature range for BICR industrial suffix] | — |
| Die / Process | Samsung 8Gb B-die DDR4 | — |
| Speed Grade | DDR4-2400 (PC4-19200) | — |
| RoHS Status | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Refresh Management | Row refresh, auto-refresh and self-refresh supported | — |
| Operating Temperature | — | -40°C to +95°C |
| Number of Pins | — | 78 |
| CAS Latency | — | [DATA_NEEDED: CAS Latency] |
| Row Cycle Time (tRC) | — | [DATA_NEEDED: tRC] |
| Refresh Cycle Time (tRFC) | — | [DATA_NEEDED: tRFC] |
| Interface | — | Parallel |