K4A8G165WC-BCRC vs K4A8G165WB-BCRC Comparison
Detailed side-by-side comparison of K4A8G165WC-BCRC by Samsung Electro-Mechanics and K4A8G165WB-BCRC by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electro-Mechanics
K4A8G165WC-BCRC - 8Gb DDR4 SDRAM 2400Mbps x16 | Samsung
K4A8G165WC-BCRC ✓ ActiveSamsung Electronics
K4A8G165WB-BCRC - 8Gb DDR4 SDRAM 2400Mbps x16 | Samsung
K4A8G165WB-BCRC ✓ ActiveSpecification Comparison
| Parameter | K4A8G165WC-BCRC | K4A8G165WB-BCRC |
|---|---|---|
| Brand | Samsung Electro-Mechanics | Samsung Electronics |
| Category | EEPROM | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | — |
| Unit Price (USD) | $19.69 | — |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM (DRAM, volatile) |
| Memory Size | 8 Gbit | 8 Gb |
| Organization | 512M x 16 | — |
| Data Rate | 2400 Mbps | 2400 Mbps/pin (DDR4-2400) |
| Clock Frequency | 1333 MHz | 1200 MHz (DDR4-2400) |
| Supply Voltage | 1.2 V (1.14 V to 1.26 V) | — |
| Interface | Parallel, 16-bit DDR | Parallel (DDR4 SDRAM bus) |
| Standby Current (Idle) | 2 mA | — |
| Operating Current | 64 mA | — |
| Operating Temperature | 0 C to +95 C | -40C to +95C |
| Package | 96-FBGA (TFBGA) | 96-ball FBGA (PBGA96) |
| Mounting Type | Surface Mount | Surface Mount |
| Features | Auto precharge, asynchronous reset, CRC, ZQ calibration, dynamic ODT, data mask | — |
| Die Generation | C-die | — |
| Memory Format | DRAM | — |
| RoHS Status | Compliant | — |
| Memory Organization | — | 512M x 16 |
| Supply Voltage (VDD) | — | 1.2 V |
| Technology | — | CMOS, B-die 8Gb die |
| Auto Precharge | — | Yes |
| Asynchronous Reset | — | Yes |
| CRC / CA Parity | — | CRC function supported |
| On-Chip Termination | — | Dynamic ODT |
| ZQ Calibration | — | Yes |