K4B4G1646D-BYH9 vs K4B4G1646E-BYK000 Comparison

Detailed side-by-side comparison of K4B4G1646D-BYH9 by Samsung Electronics and K4B4G1646E-BYK000 by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Samsung Electronics
K4B4G1646D-BYH9

K4B4G1646D-BYH9 - 4Gb DDR3L SDRAM 256Mx16 1333Mbps | Samsung

K4B4G1646D-BYH9 βœ“ Active
Samsung Electronics
K4B4G1646E-BYK000

K4B4G1646E-BYK000 - 4Gb DDR3L SDRAM 256Mx16 | Samsung

K4B4G1646E-BYK000 βœ“ Active

Specification Comparison

Parameter K4B4G1646D-BYH9 K4B4G1646E-BYK000
Brand Samsung Electronics Samsung Electronics
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $2.30 $0.56
Density 4 Gb β€”
Organization 256M x 16 256M x 16
Data Rate 1333 Mbps β€”
Supply Voltage 1.35 V β€”
Operating Temperature 0 ~ 85 Β°C [DATA_NEEDED: operating temperature range]
Package 96FBGA 96-FBGA (BYK)
Number of Banks 8 [DATA_NEEDED: bank count]
CAS Latency Programmable β€”
Write Latency Programmable β€”
On-Die Termination Yes β€”
Internal Calibration Yes β€”
Lead-Free Yes β€”
Halogen-Free Yes β€”
RoHS Compliant Yes β€”
Die Version D-die β€”
Memory Type β€” DDR3L SDRAM
Memory Size β€” 4 Gbit
Speed Grade β€” DDR3-1600 (1.25 ns clock cycle)
Clock Frequency β€” 800 MHz
CAS Latency (CL) β€” [DATA_NEEDED: CAS latency - 1.25 ns CL grade indicates CL11 but not explicitly stated in provided data]
Supply Voltage (VDD) β€” 1.35 V (DDR3L), 1.5 V compatible (DDR3)
Die Process β€” Samsung E-die
Mounting Type β€” Surface Mount
Interface β€” Parallel
Features β€” Auto precharge, asynchronous reset, ZQ calibration, dynamic on-chip termination, data mask
RoHS Status β€” [DATA_NEEDED: RoHS status]
Access Time β€” 1.25 ns

Datasheets & Resources

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