K4B4G1646D-BYH9 vs K4B4G1646E-BYK000 Perbandingan

Perbandingan bersamaan detil K4B4G1646D-BYH9 dari Samsung Electronics dan K4B4G1646E-BYK000 dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Samsung Electronics
K4B4G1646D-BYH9 K4B4G1646D-BYH9 - 4Gb DDR3L SDRAM 256Mx16 1333Mbps | Samsung

K4B4G1646D-BYH9 - 4Gb DDR3L SDRAM 256Mx16 1333Mbps | Samsung

K4B4G1646D-BYH9 ✓ Aktif
Samsung Electronics
K4B4G1646E-BYK000 K4B4G1646E-BYK000 - 4Gb DDR3L SDRAM 256Mx16 | Samsung

K4B4G1646E-BYK000 - 4Gb DDR3L SDRAM 256Mx16 | Samsung

K4B4G1646E-BYK000 ✓ Aktif

Perbandingan Spesifikasi

Parameter Umum K4B4G1646D-BYH9 K4B4G1646E-BYK000
Merek Samsung Electronics Samsung Electronics
Kategori Memory ICs Memory ICs
Status Lingkungan Hidup Aktif Aktif
Density 4 Gb —
Organisasi 256M x 16 256M x 16
Laju Data 1333 Mbps —
Tegangan Pemuat 1.35 V —
Suhu Kerja 0 ~ 85 °C [DATA_NEEDED: operating temperature range]
Paket 96FBGA 96-FBGA (BYK)
Number of Banks 8 [DATA_NEEDED: bank count]
Latensi CAS Programmable —
Write Latency Programmable —
On-Die Termination Yes —
Internal Calibration Yes —
Lead-Free Yes —
Bebas Halogen Yes —
RoHS Compliant Yes —
Die Version D-die —
Tipe Memori — DDR3L SDRAM
Ukuran Memori — 4 Gbit
Speed Grade — DDR3-1600 (1.25 ns clock cycle)
Clock Frequency — 800 MHz
CAS Latency (CL) — [DATA_NEEDED: CAS latency - 1.25 ns CL grade indicates CL11 but not explicitly stated in provided data]
Supply Voltage (VDD) — 1.35 V (DDR3L), 1.5 V compatible (DDR3)
Die Process — Samsung E-die
Tipe Mounting — Surface Mount
Antarmuka — Parallel
Fitur — Auto precharge, asynchronous reset, ZQ calibration, dynamic on-chip termination, data mask
Status RoHS — [DATA_NEEDED: RoHS status]
Access Time — 1.25 ns

Spek dan Sumber

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